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COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 7 Development Baseboard
CEB94701
*Two 10GBASE-KR SFP+ ports*2 SATA-600*VGA*4 USB 3.0*2 PCI Express Mini Card slots*2 RS-232/422/485
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COM Express basic Type 7 with Intel Atom processor
COMe-bDV7
The COM Express module COMe-bDV7 based on the Intel Atom processor C3000 series extends Kontron's product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel Xeon processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Computer On Modules
COM Express Mini
Advantech COM Express Mini series boards includes Intel Core i, Intel 4th Generation, Intel Atom processor. With mere 84 x 55 mm in size, COM Mini series are the most compact COM modules and match all demands from Intel Core i, Intel 4th Generation, to Intel atom processor. COM Express Mini series is compliant with the COM Express Type 1/10 standard pin definition, and with a slight modification are able to commit with the existing COM Express carrier boards.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Mini Module
COMeT10-3900
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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COM Express
COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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COM Express Type 7
ROM-8720
Advantech ROM-8720 COM Express Type 7 Compact Computer-on-Module is powered by NXP LS1046A SoC which includes four Arm Cortex-A72 cores for Edge networking and Edge firewall, two 10Gbsp-KR and up to four Gbps for the networking communications. Three PCIe, three USB 3.2 Gen1 and three USB2.0 for the embedded interface expansions. two UART, one SPI and 8 GPIO for embedded device controls.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Type 7 Starter Kit
COMe Type 7 Ice Lake-D STKit
The Type 7 Starter Kit Plus consists of a COM Express Type 7 module with ATX size Type 7 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for 10GbE adapter card that convert 10GBase-KR to 10GbE Optical Fiber or 10GbE Copper signal, one PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB3.0/2.0, Gigabit LAN and Super I/O. in addition, a IPMI BMC (miniBMC) located on carrier board connect to COM Express Type7 module by NC-SI interface to support some of out-of-band management features. All necessary cables are included.
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COM Express Type 10 Reference Carrier Board
miniBASE-10R
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Embedded Computing System,
ComSys-5301
The COM Express based ComSys-5301 combines leading edge processing with modularity in a thermally efficient, lightweight design. SWaP optimized for fanless, reliable performance in harsh environments. I/O expansion enables fast system redefinition.
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COM Express Type 2
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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COM Express Type 7 10GBASE-T Network Adapter Card
10GBASE-T Network Adapter Card
- Supports up to four 10GbE copper interface (10GBASE-T)- Compatible with PICMG COM.0 R3.0 Type 7 modules
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COM Express
The COM Express product platform includes Intel©-based CPU modules and Type 2/3 or Type 6 carrier cards. Additionally, support products are available for prototyping and production such as: development systems, MIL-DTL-38999 front panels, and an assortment of cables.
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MXI-Express Cable, Gen 2 x8, Copper, 5m
782317-05
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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COM Express Type 10 Mini Application Board With LVDS, VGA, Dual LAN And Audio
CEB94018
*84 x 55 mini size form factor*2 GbE LAN*SATA and mSATA*LVDS and VGA*6 USB 2.0*2 PCI Express Mini Card slots
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PXIe-8399, Gen 3, x16, 2-Port PXI Remote Control Module
784180-01
PXIe, Gen 3, x16, 2-Port PXI Remote Control Module—The PXIe-8399 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8399 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection. An additional port allows daisy-chaining for multi-chassis configurations.
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MXI-Express Cable, Gen 2 x8, Copper, 3m
782317-03
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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ARINC429 PCI Express Mini Card
AMEE429-x
The AMEE429-x is AIM’s new PCI Express Mini Card module targeted for embedded ARINC429 applications in an ultra-compact form factor.
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Embedded MIL-STD-1553 PCI Express Mini Card
AMEE1553-x
The AMEE1553-x is AIM’s new PCI Express Mini Card module targeted for embedded MIL-STD-1553B applications in an ultra-compact form factor.
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Compact PCI-Express/PXI-Express Module
ACE1553-3U-x-DS
The ACE1553-3U-x-DS is a member of AIM’s new family of compact PCI-Express/PXI-Express modules for analyzing, simulating, monitoring and testing MIL-STD-1553A/B databuses providing 1 or 2 dual redundant bus streams.
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PXIe High Performance System Module: Dual Port (x16), Gen 3
M9023A
The M9023A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The M9023A has a flexible configuration capability. Each card has two Gen 3 x8 PCIe cable links capable of achieving speeds up to 8 GB/s on each port. These two ports can be combined into a single x16 cable link providing a speed of up to 16 GB/s. This means a data-intensive system can be built using high-performance desktop or rack-mounted computers.
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PCIe Gen3 x8 FMC Module
VITA 57.1 FMC HPC ConnectorPCIe Gen3/Gen2/Gen1 x8 Slot (upto 64Gbps)Single module supports both PCIe Root Port & EndpointM.2 Key-M NVMe slot with PCIe Gen3 x2 interface & SATA3.0 interfaceMIPI DSI & CSI Connector through LVDS IOs32Kb-EEPROM
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MXI-Express Cable, Gen 1 x4, Copper, 3m
779725-03
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
