Sockets
receive conductors.
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Product
Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Relay Sockets & Accessories For Power Relays
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Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Volt Probe & Socket Testers
Non-Contact & Socket
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Use Amprobe non-contact volt probes to safely check circuit breakers, wall sockets and fuses for voltage presence with portable, economical tools. For sockets, choose an Amprobe socket tester, which can confirm whether GFCI breakers are properly wired.
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Voltage Testers
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The non-contact voltage tester detects live conductors on cable connections, cable drums, sockets, switches, junction boxes etc. Due to capacitive measurement procedures, no current flow is required and interruptions can be indicated quickly and accurately.
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Fuel Display Unit Tester
MS 1125
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Fuel Display Unit Test Bench is a compact table-top test bench with front panel controls, indications, built-in signal simulator and necessary power supply for testing the serviceability of Fuel Display Unit of Helicopter. FTB operates on 230 V AC and supplies 28 V DC power to FDU. FTB is housed in a metallic cabinet FTB interfaces with both 61 Pin connector and 6-pin socket mounted on the rear panel of FDU by means of the cable connected to the unit. FTB is fabricated utilizing off-the-shelf standard industrial/commercial components like rotary switches, toggle switches, press switches, test sockets, fuse holders, potentiometer etc. The Frequency generation circuit is integrated into FTB for the simulation of Fuel probe and flow rate signals. The frequency of the signal can be selected by means of a rotary switch Low amplitude sine wave signal is simulated for testing flow rates. Variable voltage DC power supply with a voltage range of 24 to 29 Volts is provided within FTB to power-up FDU. 5 V DC is provided for the operation of signal generating circuit (PIC Frequency Controller Board). An off-the-shelf Hand held battery operated Digital Multimeter (DMM) procured from the prominent manufacturer (FLUKE) is supplied with FTB for setting up and measurement of various parameters like Resistance, Voltage, Frequency etc.
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PXI/PXIe Power Relay Module,5 Amp, 50-pin D-type Connector
40-153-103-HI
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The 40/42-153-103-HI is a PXI/PXIe high density power relay module with 25xSPST switches rated at 5A and includes the hardware interlock option. User connection is via a 50-pin D-type male connector, hardware interlock is via a 4-pin 00 series socket (mating plug is supplied). The 40/42-153 range is available in 18, 25, 36 or 50 SPST configurations with or without hardware interlock.
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Ultra Compact Industrial Computers, mini PCIe socket for WIFI / 4G module
Neousys NRU
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Ultra-compact industrial computers based on NVIDIA® Jetson AGX Xavier ™ for mobile use (in transport, in surveillance systems, in industrial systems).- NVIDIA® Jetson AGX Xavier ™ SOM with JetPack 4.4- IEEE 802.3at Gigabit PoE + or 0GBASE-T 10G ports - M.2 2280 M key socket for NVMe SSD- mini PCIe socket for WIFI / 4G module - GPS PPS input
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Fanless Embedded System With LGA1150 Socket Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 2 HDMI/VGA/DisplayPort, 4 GbE LANs, 6 USB 3.0, Wide Range DC-in And PCIe Mini Card
eBOX670-883-FL
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The eBOX670-883-FL supports the LGA1150 socket type for 4th generation Intel® Core™ i7/i5/i3 and Celeron® processors (formally codename: Haswell) with Intel® Q87 Express chipset. Under this rich support system, the eBOX670-883-FL allows wide operating temperature ranging from -40°C to +55°C for the most endurable operation. The outstanding embedded controller comes with four 10/100/1000 Ethernet ports, Jumbo Frame (9.5K), PXE Remote Boot, Teaming, and wake-on-LAN (WOL) function to highly enhance its network connection speed. Additionally, the eBOX670-883-FL supports up to three independent hi-resolution displays or a 4K display. Undoubtedly, this rugged fanless embedded computer is the best solution for any industrial field, including host computers, cloud computing servers, multimedia applications, and automation systems.
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Product
Amplifier Module
LNAM-LPA
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We offer an evaluation board and case for the LNAM-B and LNAM-FBX modules. This Laboratory PreAmplifier (LPA) solution is powered by a switch-mode power supply and gives access to the LNAM in- and outputs via BNC sockets.
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Product
COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
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The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
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Test Contactor/WLCSP Probe Head
ACE
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ACE™ test sockets offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm, ACE features an innovative design that provides superior performance, improved yields and power efficiency.ACE probe heads deliver exceptional electrical performance, both DC and RF. Manufactured from HyperCore™ base material, a proprietary material of Cohu’s Everett Charles Technologies, ACE probes have the electrical properties of BeCu with the non-oxidizing properties of a precious metal. The short signal path, sharp tips, and large contact area between plungers provide high current conductance and reliable contact with less force.
