Lithography
nano fabrication of circuitry.
-
Product
Nanostructuring
-
AMO offers a highly flexible process-platform for the fabrication of nanostructures. We have a broad range of lithography techniques that can be flexibly combined with each other – including interference lithography. Each lithography technique is tailored to a specific pattern-transfer process and can be used on a wide range of substrates. In addition, we have developed an advanced nanoimprint lithography process that can transfer e-beam-defined patterns to large areas in a cost-effective manner.
-
Product
Nanoimprint Lithography
NIL
-
EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
-
Product
Electron Beam Lithography System
-
Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
-
Product
Laser Head
5517D
-
The Keysight 5517D is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
-
Product
CCD Foundry Services
-
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
-
Product
Laser Heads
-
The laser head is the source of the laser beam used in all laser motion and position measurement systems. The primary difference between laser heads is in the velocity, reference frequency and optical output power. Other considerations are size, heat dissipation, and input power requirements. Which laser you choose depends primarily on the application in which it will be used. For example, semiconductor lithography systems typically have faster moving parts (stages), and therefore need higher velocities than machine tool applications.
-
Product
Lithography
-
EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
-
Product
Refurbished Systems
-
Refurbishing ‘classic’ PAS 5500 and TWINSCAN lithography systems for a new life and a new purpose
-
Product
Laser Interferometers
-
ZYGO laser interferometers support and enable the most demanding metrology applications in industries from semiconductor and lithography to space-borne imaging systems, cutting-edge consumer electronics, defense-related IR and thermal imaging systems and ophthalmics.
-
Product
µMLA Maskless Aligner
µMLA
-
The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
-
Product
Nanopositioning Systems
-
Mad City Labs'' nanopositioning systems move and maintain the position of objects with sub-nanometer precision and high stability. Applications for nanopositioners include super resolution microscopy, high speed confocal imaging, AFM, NSOM, SPM, optical trapping, fiber positioning, single molecule spectroscopy, single molecule/particle tracking, high resolution optical alignment, nanoscopy and lithography.
-
Product
Automated Measurement System
EVG®40NT
-
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
-
Product
Mask Alignment Systems
-
EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
-
Product
Patterning Simulation
-
KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
-
Product
UV LED Light Source
Model 32
-
This new UV LED lightsource is designed and engineered by the proven lithography experts at OAI. The lightsource delivers a number of unique benefits, the most consequential of which is consistent intensity over an exceptionally long life. The lightsource is highly energy efficient, requires no maintenance or light replacement, and contains no mercury.
-
Product
DWL 66⁺ Laser Lithography System
DWL 66⁺
-
The DWL 66⁺ Laser Lithography System is a cutting-edge platform that combines advanced grayscale capabilities and the highest resolution available in direct-write laser systems. This machine is expertly designed for research and development in fields such as microelectronics, MEMS, and photonics, providing unparalleled versatility in both direct writing and low-volume mask making. With its minimum feature size of just 200 nm and 65,536 grayscale levels, the DWL 66⁺ surpasses traditional optical lithography solutions, ensuring precise pattern generation for a multitude of applications including sensors, optics, and quantum devices.
-
Product
Lithography Systems
-
When it comes to shaping what a chip can do, lithography systems lead the way by transferring intricate circuit designs onto substrates with unmatched precision. From prototyping to high-volume manufacturing, these tools define the geometry of modern microchips, as well performance.
-
Product
Dry Systems
-
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
-
Product
NanoFrazor Nanolithography Tool
NanoFrazor
-
The NanoFrazor Nanolithography Tool represents a paradigm shift in nanofabrication, integrating cutting-edge Thermal Scanning Probe Lithography (t-SPL) technology to foster groundbreaking research and innovation in various fields. This versatile and modular system is adept at crafting intricate nanostructures, making it an ideal instrument for exploring quantum devices, 1D/2D materials, and nanoscale device arrays. With its ultrasharp heatable probe tip, the NanoFrazor not only writes but simultaneously inspects complex structures, optimizing patterning parameters in real-time for exceptional precision. The tool excels at creating grayscale patterns with vertical accuracies of less than 1 nm, thanks to its advanced software and noise-insulated design.
-
Product
VPG⁺ 200/400/800 Volume Pattern Generators
VPG⁺ 200 / VPG⁺ 400 / VPG⁺ 800
-
The VPG⁺ 200, VPG⁺ 400, and VPG⁺ 800 Volume Pattern Generators are advanced lithography systems that cater to meticulous mask manufacturing for i-line resists. Specifically engineered for high-resolution electronic packaging and other demanding applications, these versatile systems adeptly manage substrate sizes ranging from 9" x 9" to an impressive 32" x 32". Each model integrates a cutting-edge high-speed exposure engine, significantly lowering write times while boosting productivity in environments requiring continuous operation. This exceptional functionality allows for the creation of packaging masks, achieving results that meet the stringent line-width uniformity and edge roughness standards demanded in the industry.
