Lithography
nano fabrication of circuitry.
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Lithography
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With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Lithography
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EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
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Electron Beam Lithography System
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Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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DUV Lithography Systems
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ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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Computational Lithography
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ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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EUV Lithography Systems
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Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
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Lithography System
JetStep X500
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The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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EUV Lithography
EXE systems
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EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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LITHOSCALE® Maskless Exposure Lithography Systems
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Maskless exposure lithography systems represent an entirely new product platform of EVG lithography equipment.
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Nanoimprint Lithography
NIL
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EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
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DWL 66⁺ Laser Lithography System
DWL 66⁺
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The DWL 66⁺ Laser Lithography System is a cutting-edge platform that combines advanced grayscale capabilities and the highest resolution available in direct-write laser systems. This machine is expertly designed for research and development in fields such as microelectronics, MEMS, and photonics, providing unparalleled versatility in both direct writing and low-volume mask making. With its minimum feature size of just 200 nm and 65,536 grayscale levels, the DWL 66⁺ surpasses traditional optical lithography solutions, ensuring precise pattern generation for a multitude of applications including sensors, optics, and quantum devices.
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Product
Lithography System
JetStep S3500
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The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Interference Lithography Gratings
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Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
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Variable Angle Spectroscopic Ellipsometer
VUV-VASE
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The VUV-VASE variable angle spectroscopic ellipsometer is the standard in optical characterization of materials used in lithography applications. Its measurement range spans vacuum ultraviolet (VUV) to near infrared (NIR). This provides incredible versatility to characterize numerous types of materials: semiconductors, dielectrics, polymers, metals, multilayers and now liquids such as immersion fluids.
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Product
Laser Head
5517FL
Laser Head
The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Advanced Node Solution
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A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document.
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Reticle/Mask Particle Remover
RP-1
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The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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µMLA Maskless Aligner
µMLA
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The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
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Laser Interferometers
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ZYGO laser interferometers support and enable the most demanding metrology applications in industries from semiconductor and lithography to space-borne imaging systems, cutting-edge consumer electronics, defense-related IR and thermal imaging systems and ophthalmics.
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Nanopositioning Systems
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Mad City Labs'' nanopositioning systems move and maintain the position of objects with sub-nanometer precision and high stability. Applications for nanopositioners include super resolution microscopy, high speed confocal imaging, AFM, NSOM, SPM, optical trapping, fiber positioning, single molecule spectroscopy, single molecule/particle tracking, high resolution optical alignment, nanoscopy and lithography.
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Refurbished Systems
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Refurbishing ‘classic’ PAS 5500 and TWINSCAN lithography systems for a new life and a new purpose
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UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Integrated Lithography Track Systems
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Lithography track systems complete the EVG lithography product family with a fully integrated production system and high grade of automation combining mask alignment and exposure with integrated pre- and post-processing. Based on a modular platform, the HERCULES lithography track system merges EVG’s established optical mask alignment technology with integrated cleaning, resist coating, baking and resist development modules. This turns the HERCULES platform into a “one stop shop”, where pre-processed wafers are loaded into the tool and fully structured processed wafers are returned.
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VPG⁺ 200/400/800 Volume Pattern Generators
VPG⁺ 200 / VPG⁺ 400 / VPG⁺ 800
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The VPG⁺ 200, VPG⁺ 400, and VPG⁺ 800 Volume Pattern Generators are advanced lithography systems that cater to meticulous mask manufacturing for i-line resists. Specifically engineered for high-resolution electronic packaging and other demanding applications, these versatile systems adeptly manage substrate sizes ranging from 9" x 9" to an impressive 32" x 32". Each model integrates a cutting-edge high-speed exposure engine, significantly lowering write times while boosting productivity in environments requiring continuous operation. This exceptional functionality allows for the creation of packaging masks, achieving results that meet the stringent line-width uniformity and edge roughness standards demanded in the industry.
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Dry Systems
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Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Scanning Electron Microscope
E5620
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The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Product
Laser Head
5517EL
Laser Head
The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
