Intel
-
Product
Intel Systems
-
NextComputing appliances and Intel processors are both built at the boundaries of technology and make amazing experiences possible. Leverage these combined solutions to customize your ultimate solution for professional grade computing at lightning speed.
-
Product
3U cPCI Intel SBC
75INT2
-
NAI’s 75INT2 is a 3U cPCI Intel® Core™ i7-based, Single Board Computer (SBC) that can be configured with up to two intelligent function modules and delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.NAI's Intel® Core™ i7 SBCs in the 3U cPCI form factor offer improved processor performance and better security, targeted at military and defense applications such as manned and un-manned air and ground vehicles, and in more sophisticated digital signal processing applications such as intelligence, surveillance, reconnaissance, radar and sonar.
-
Product
Intel Xeon D-15xx Processor, AMC
AMC763
-
The AMC763 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
-
Product
1U Intel Xeon Series
-
1U Rackmount Network Appliances with Intel® Xeon® Scalable Processor for NFV and SD-WAN.
-
Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
-
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
-
Product
1U Intel Atom Series
-
1U Rackmount Network Appliance with Intel® Atom™ Processor for uCPE and Network Applications.
-
Product
3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
-
The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
-
Product
Intel 80486 DX4
MS 1502
-
- ATE- Data Acquisition System- Process Control Industry- Industrial Automation
-
Product
SC6-TANGO cPCI® Serial Intel® Atom™ E3900 Series SBC
SC6-TANGO
-
The SC6-TANGO is a low power CompactPCI® Serial CPU board, based on an Intel® Atom™ E39xx-series System-on-Chip processor (Apollo Lake APL-I).
-
Product
Intel Atom X6000E Series PICO-ITX SBC
MIO-2363
-
Intel Atom x6000E SeriesOnboard LPDDR4x up to 8GB and EMMC up to 128GBSupport 12-24V wide voltage range -40~85°C operating temperature2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2CM.2 E-Key, M.2 B-Key for SATA storage and option to support RS-232 moduleSupport iManager & Software APIs, WISE-DeviceOn, and EdgeAI Suite
-
Product
CompactPCI® PlusIO CPU Card, Intel® XEON® E3 v6 Family
PC7-FESTIVAL
-
The PC7-FESTIVAL is a feature-rich high performance 3U CompactPCI® PlusIO CPU board with an Intel® Xeon® E3 mobile workstation processor for demanding applications. Also available with a 7th Generation Intel® CoreT processor.
-
Product
Intel® Core™ Ultra 5/7/9 LGA1851
AIMB-589
-
Intel® Core™ Ultra Series 2 Processors, max. 24Core. Support W880/Q870 chipsetsUp to 192GB DDR5 UDIMMs/CUDIMMs for data transfer2 x 2.5GbE LAN and 2 x GbE LAN for digital devices1 x USB4, 8 x USB3.2, 4 x USB2.02 x M.2 M-Key 2280 for NVMe SSDAccommodate 2 double-deck GPU cards by PCIe x16 slots (x8 lanes)
-
Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
-
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
-
Product
2U Edge Server With 5th/4th Gen Intel
SKY-820V3
-
2U edge server with 5th/4th Gen Intel® Xeon® Scalable processors, ideal for AI training, inference, and high-performance edge computing.
-
Product
2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
-
The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
-
Product
Processor AMC, Intel® Xeon E5-2648L V4, PCIe Gen3 With PinoutPlus™
AMC750
-
The AMC750 is a Processor AMC (PrAMC) in a double module, full-size AdvancedMC (AMC) form factor based on the Intel® Xeon E5-2648L v4 which has 14 Cores @ 1.8 GHz. The module follows the AMC.1 and AMC.3 specifications.
-
Product
Intel Atom® Panel Controller
AMAX-PT700 V2
-
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 32-axis motion control with 1ms EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Modular Computing Box designed with Intel Atom® x6425E with one DDR4 SODIMM slot (up to 32GB)Multiple-sized front panel modules offered with P-Cap multi-touch sensor (12.1" & 19" with robust 5-wire resistive touch)
-
Product
Pocket-Size DIN-Rail Edge IPC With Intel® Atom® X6413E
UNO-127
-
Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memoryCompact, robust, fanless and cable-free system with high stabilityOptimized basic unit with 2 x GbE, 2 x USB, 1 x HDMIOn-board full-size mPCIe port for various expansion capabilityBuilt-in TPM2.0 for hardware-based securitySystem ground isolation designCertified with IEC 61010-2-201 for industrial applicationUbuntu Core 20 certified hardwareSupport Windows 11 IoT Enterprise LTSC
-
Product
PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs
SHB230
-
The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.
-
Product
Micro-ATX Motherboard 10th Gen Intel® Xeon® Processor LGA1200
AIMB-587
-
Supports Intel® 10th Gen Xeon/Core™ (Comet Lake-S) i9/i7/i5/i3 processor with Q470E/ W480E/ H420E chipsetFour U-DIMM sockets support up to 128GB DDR4 2666/2933 MHz SDRAMSupports 2 DP++, VGA(option), eDP display with Triple Display supportSupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, Dual 10 GbE LAN, Dual GbE LAN, M.2(M-key) and up to 8 x SATAIIISupports 4 USB3.2 Gen2, 6 USB3.1 Gen1 and 6 USB2.0Supports SUSI,Ubuntu 20.04 LTS, WISE-DeviceOn and Edge AI Suite
-
Product
Intel® Smart Display Module Small (Intel® SDM-S) With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
SDM300S
-
The SDM300S is a signage computer module following the newest Intel® Smart Display Module Small (Intel® SDM-S) architecture. The SDM300S is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake) with the Intel® HD Graphics 505 or 500 chipset. The sleekest all-in-one display module measures only 100 x 60mm (roughly the size of a credit card), which makes for a thinner display. The SDM300S can be easily connected to an SDM-compliant display via a high-speed PCIe edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 1.4, DisplayPort 1.2, Serial TX/RX and I2C signals. Nearly a third the size of Open Pluggable Specification (OPS), the design of the SDM300S omits housing so it is well suited for space-constricting applications.
-
Product
Small-Size Modular Embedded Box PC With Intel® Celeron® J6412
UNO-2372G V2
-
Intel® Celeron® J6412 quad-core processor with 8GB DDR4 memoryCompact, robust, fanless and scalable system with high stabilityOptional second stack for supporting extension iDoor module, including wireless connectivity, industrial fieldbus and more I/O portsSupports NVME storage with high data-transmission efficiencySupports Windows 11 IoT Enterprise LTSC
-
Product
6U VME 3rd Gen Intel Core 17 Computer
VM6052
-
The VM6052 6U VME 2eSST Single Board Computer is built around Intel®’s state-of-the-art 3rd Generation Core™ i7 dual-core processor.
-
Product
PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
-
The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
-
Product
Modular TPC - Computing Box Module With Intel Atom And Celeron CPU
TPC-B300
-
Computing Box powered by Intel Atom® X6425E/ Intel® Celeron® J6412 with DDR4 SODIMM slot (up to 32GB)Multiple sized front panel module offering with P-Cap multi-touch sensor (12.1" & 19" w/ robust 5-wire resistive touch)1 x Full-size mini PCIe for iDoor expansion1 x M.2 Key-E 2230 for WIFI + BT module1 x M.2 Key-M 2280 for SATA SSD1 x 2.5” SATA SSD expansion2 x 2.5Gb LANSupports TPM2.0 hardware securityWide Temp Support. Range -20~60 °C (Atom™ X6425E)
-
Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
-
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
-
Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
-
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
-
Product
Intel Atom® X6000E Series, Pentium®, Celeron® N And J Series Processor
AIMB-218
-
Supports Intel Pentium/Celeron processor (Elkhart Lake), N6210/N6211/J6412/J6413/J6426/x6413ETwo 260-pin SO-DIMM up to 32 GB DDR4 3200 MT/s SO-DIMMSupports, DP++ , HDMI, eDP(or LVDS)Supports 1x M.2 (B-Key) and 1x M.2 E-Key (or 1x PCIe x1 Gen3 ), 6 COM, 3 USB 3.2 Gen2x1 & 5 USB 2.0, dual LANLower total cost of ownership with DC12V support and onboard TPM2.0 (option) & Amplifier (option)Support SUSI, Ubuntu20.4, WISE-DeviceOn and Edge AI Suite
-
Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
-
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
-
Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
-
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
