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Product
Acoustic Microscope
AMI D9650Z
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The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Product
Simultaneous Multi-Surface Test Interferometer
VeriFire MST
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Simplify the complex – multiple surfaces create complex fringe patterns, the Verifire™ MST uses patented wavelength-shifting technology to acquire phase data from multiple surfaces simultaneously. Report key metrics from individual surfaces of parallel windows, transmitted wavefront, as well as precise surface-to-surface information like total thickness variation (TTV), wedge and even material inhomogeneity.
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Product
20J3 SHEET RESISTANCE METER
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Non-contact measurement of Ohms/sq, Ohms-cm, resistivity, thickness, and moreMeasures nearly all thin conductive materials or coatingsChoose a sensor in one of four ranges, from .005 Ohms/sq to 100,000 Ohms/sqadd other sensors laterFor benchtop or inline applicationsSimple one-button operationSmall footprint with detached sensor probeOptions include vacuum-ready probe, PC-based productivity software, Ethernet connectivity, stage, and more
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Interface And Signal Processing Units
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The interface and signal processing units extend the field of application of Micro-Epsilon sensors. The interface modules are used to convert sensor signals into digital or bus-compatible interfaces. This enables interfaces such as USB, RS422, Ethernet/IP, Profinet and EtherCAT for numerous sensors. The signal processing units are also used to record several sensor signals, to calculate and output them together. This is necessary, for example, for planarity measurement or thickness measurement.
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Product
Ultrasonic Thickness Gauge
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High-precision ultrasonic thickness gauge, suitable for various materials high-precision measurement needs, can be applied to steel, cast iron, aluminum, copper, zinc, etc.
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Product
Powerful and Cost Effective Spectroscopic Ellipsometer
Smart SE
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The Smart SE from HORIBA Scientific is a versatile spectroscopic ellipsometer for fast and accurate thin film measurements. It characterizes thin film thickness from a few Angstroms to 20µm, optical constants (n,k), and thin film structure properties (such as roughness, optical graded and anisotropic layers, etc).The spectral range from 450 to 1000nm is measured in a few seconds and ellipsometric data are analyzed using the DeltaPsi2 software platform. The software integrates two levels of software to fulfil both routine analysis with predefined recipes and advanced analysis with state-of-the art ellipsometric modelling.
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Product
Precision Coating Thickness Gauge Probe Range
Elcometer 355
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Unique probe modules allow the Elcometer 355 Coating Thickness Gauge to be versatile and flexible for any coating thickness measurement application.
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Product
Coating Thickness Meters
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PCE Instruments' accurate, affordable coating thickness gauge, thickness meter, surface testing and film gauge devices are used for material testing, manufacturing quality control and automotive paint inspection applications. Choose from a variety of coating thickness gauge, mil gage or paint meter products used for the non-destructive measurement of nonmagnetic coating, insulating layer and dry film thickness (DFT) on ferrous and / or non-ferrous metal substrates such as steel and aluminum.
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Product
Coating Thickness Gauge - Integral
Elcometer 456
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Whether you are measuring on smooth, rough, thin or curved surfaces, the Elcometer 456 Dry Film Thickness Gauge produces accurate, temperature stable measurements thanks to its ±1% thickness measurement capability and increased reading resolution.
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Product
Ultrasonic Thickness Gauge
38DL PLUS
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The 38DL PLUS is an innovative instrument that signals a new era in ultrasonic thickness gauging. Ideally suited for almost every ultrasonic thickness application, this handheld thickness gauge is fully compatible with a full line of dual and single element transducers. The versatile 38DL PLUS can be used in applications ranging from wall thinning measurements of internally corroded pipes with dual element probes to very precise thickness measurements of thin or multilayer materials with single element transducers.
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Product
Scrub Test Panels
4695
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In a typical scrub test, the coating is applied to the Leneta Scrub Test Panel at a specified film thickness, allowed to dry and then subjected to scrubbing with a straight-line scrub tester.
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Product
Thickness gauge
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Thickness gages are used to make precise dimensional measurements on coatings and materials such as steel, plastic, glass, rubber, ceramics, paint, electroplated layers, and enamels. Search by Specification
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Product
Precision Coating Thickness Gauge
355
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The Elcometer 355 Coating Thickness Gauge watchwords are accuracy, simplicity, versatility and durability, making this a state of the art hand-held measuring system packed with time-saving and cost-saving features.
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Product
Underwater Thickness Meter
Multigauge 3000
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Large bright 10mm display. Integral battery with 55 hours runtime. Can be easily upgraded to a topside repeater. 500m depth rating.
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Product
High Temperature Chip Resistors
ERJ-Hxx Series
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Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Product
Process EDXRF Spectrometer
NEX LS
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Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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Product
Heat Flux Sensors
MF Series
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EKO Heat Flow Sensors are applied to measure the heat flow or thermal conductivity in materials and radiative IR flux emitted by body surfaces. The sensors are suitable for indoors applications, some models made for outdoors purposes and are available in different sizes and thickness. All sensors are extremely flat, which is a big advantage considering the minimum interference with the conditions of the testing area the thermal dynamics. Since sensor foils are relatively flexible those can easy be applied on curved surfaces and can be used in different applications to measure the performance of insulating materials in refrigerators, container walls, pipes, building constructions, etc.
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Product
Flat One Side Baseplates
BE-FOS
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Bemcoil-FOS (Flat One Side) is made from 18 gauge, 304 stainless steel sheet combined with 11 gauge (0.120 inch thick), 304 stainless steel plate. Bemcoil-FOS can be circuited to allow tapped or clearance hole penetrations for mounting. This material is sometimes specified as a liquid nitrogen cooled water getter plate material in optical testing systems.
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Product
EMC Subracks
1101.10
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VECTOR Electronics and Technology, Inc.
VectorPak™ EMC subracks for medium and light duty applications. Its features include 2.5mm thick side panels / rack flanges and conductive finish throughout.
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Product
Pitot Tubes
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The dpm-i Pitot Tube is a new design concept in Pitot Static Tube technology. It is a multi-functional sensor. It can replace thermally heated instruments, where power requirements are high. Gives easy access to duct measurement compared to a standard Pitot Tube. For example, in ceilings voids and confined areas, where there is a thick lagging or metal cladding.
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Product
MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
VTAC, Patchcord, ITA, 36", VTAC, DACAR 535, Double Ended
7-141702141-036
VTAC Patchcord
The density/ thickness of DACAR 535 wire, may require a module loading pattern that includes extra slot spacing to prevent wire bend and pressure. See the VTAC User Manual for more information.
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Product
Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Product
Wet Film Wheels
3230
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By rolling the gauge through a wet coating, the centre wheel eventually touches the film. This point on the scale indicates the thickness.
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Product
Compact Coating Thickness Gauges
MP0 Series
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The small all-rounders for mobile coating thickness measurement. Leading industrial instrument series for fast and easy coating thickness measurement in corrosion protection and industrial applications.
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Product
Duct Deposit Measuring System
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The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Product
Customized Ellipsometers
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~0.1 nm thickness difference can be seen by IE-1000.Thickness distribution of thin film can be imaged.Thickness and optical images of semiconductor device, display, and bio samples.IE-1000 can show the images which can not be seen by conventional microscope.Defect of semiconductor and display can be seen directly.Easy and fast operation.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
