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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
PORTABLE PRESSURE MAPPING
I-SCAN® HANDHELD SYSTEM
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Handheld pressure measurement system for collecting tactile pressure data.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Pressure Mapping
TIRESCAN
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Complete pressure imaging system for conducting tire tread analysis.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Validation, Mapping and other Services for GxP Regulated Applications
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The individuality of your GxP application may require a variety of function-specific settings and measurement systems. Benefit from our know-how and let our application engineers design the optimal measuring system for you. With our consulting services in GxP, we support you from project planning (URS) to implementation and testing of your system. This ensures an optimal and efficient design.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Headspace MAP Gas Analyzers
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Headspace analysis is conducted to ensure that the residual oxygen in a product complies with predefined limits. This is a vital part of the Quality Control of Modified Atmosphere Packaging (MAP) products. For packaged foods and other goods, exceeding these limits increases the risk of growth and proliferation of bacteria or mould, which causes spoilage and results in shorter product shelf-life.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
Pressure Mapping
BPMS
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Measure pressure distribution between the human body and support surfaces such as seats, mattresses
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Product
Concrete Corrosion Mapping System
15620
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Our Concrete Corrosion Mapping System (CCMS) can be used to satisfy the ASTM C-876 standard test method and the kit contains all equipment items that are needed to perform a corrosion survey on virtually all types of reinforced concrete structures, such as bridges, highway slabs and parking garages.
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Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Locate and Map Underground Utilities
UtilityScan DF
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Geophysical Survey Systems, Inc.
UtilityScan DF incorporates our innovative dual-frequency digital antenna (300 and 800 MHz) and an easy-to-use touchscreen interface to view shallow and deep targets simultaneously in a single scan.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
