Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
4-Probe Resistivity and Resistance Tester
HS-MPRT-5
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t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Product
Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
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*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Resistance Meters
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High-Speed High-Stable Resistance Meter with Low-impact Resistance Measurements for Miniature 008004-size Electronic Parts
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Product
Resistance Tester
METRISO® 3000
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Wolfgang Warmbier GmbH & Co. KG
Suitable for resistance point-to-point and resistance to ground measurementsIntegrated data logger with USB communication port for data transmission (50.000 test values). The supplied Report Generating Software ETC allows to generate a complete test reportA barcode scanner can be used in order to record measurement points before testing
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Product
Resistive Components
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Diamond is the best thermal conductor on earth. Combined with a low dielectric constant, it is an excellent RF dielectric material for high-frequency applications in which thermal performance is equally critical. By applying cutting-edge thin film process and extensive millimeter wave design experience, Smiths Interconnect has created a high-performance line of resistive components. The resulting products, our Diamond RF Resistives® resistors, terminations, and attenuators, are significantly reduced in size and unparalleled in average and peak power handling.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
Resistivity Standard
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Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
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Product
Resistance Calibration
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Process Instruments maintains fractional part-per-million accuracy with a state of the art resistance calibration facility. Specialized services include precision resistor manufacture, resistor and shunt repair, characterization of alpha and beta temperature coefficients and the determination of barometric effects on resistance values.
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
Resistance Meter
MS8-2L
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M-module MC8-2L is a mezzanine module designed to measure resistance using a two-wire measurement scheme in eight channels (eight-channel digitizer). М-module МС8-2Л is installed on the mezzanine carrier - NM module and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the HM module. The NM module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
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Resistivity Meters
SSR-MP-ATS
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Integrated Geo Instruments & Services Private Limited
The instrument design incorporates several innovative features and advanced techniques of digital circuitry to make it a reliable Geophysical tool providing high quality data useful for mineral and groundwater exploration and any other Geophysical applications. The SSR-MP-ATS sends the entire current into the ground without wasting power for constant current generation thus increasing the signal strength to probe deeper layers.
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Product
Resistance Software
OhmRef
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OhmRef provides the power of automation for Standards maintaining statistical control of resistance values in your laboratory. This program controls a Low Thermal Scanner along with other equipment commonly available in Standards Laboratories to compare resistance standards over the range of 100µΩ to 10GΩ . Comparison accuracies arebetter than 1 ppm in the midranges.
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Resistance Measurement
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Precision resistance measurement equipment for a range of applications. Specialist units measure down to fractions of a micro-ohm with high accuracy.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Resistance Meter
RM3542A
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High-speed resistance meter ideal for automated lines; compatible with super-small electronic components • Testing source: DC • Fastest measurement time: 0.9 ms • Minimum integration time: 0.1 ms • Finest resolution: 0.1 μΩ
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Product
Contact Resistance Meter
CRM 200B
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CRM 200B directly measures micro-ohm values at 100 Amps DC under live switchyard conditions.CRM 200B is specially designed to reliably measure contact resistance of circuit breakers, isolators, busbar joints, welded joints etc., under the hostile electrostatic noise found in live EHV switchyards upto 765 kV.
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Electrical Resistivity Instrumentation
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The resistivity survey method is more than 100 years old and is one of the most commonly used geophysical exploration methods (Reynolds, 1997). It has been used to image targets from the millimeter scale to structures with dimensions of kilometers (Linderholm et al., 2008; Storz et al., 2000).
