Aligners
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Product
Custom Solutions for Mask Aligners
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OAI offers custom designed solutions built to your unique specification.
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Bare Fiber Aligner
1120
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The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Product
ResMap or DualMap Auto Load Floor Standing
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Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Product
Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
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The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
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Product
µMLA Maskless Aligner
µMLA
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The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
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Product
MLA 150 Maskless Aligner
MLA 150
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The MLA 150 Maskless Aligner is poised to revolutionize photolithography by offering an advanced, fast, and flexible solution that replaces traditional photomask techniques. With its high-resolution capabilities providing sub-micron accuracy, this aligner is designed for efficiency, making it ideal for rapid prototyping, advanced research, and low to mid-volume production. By utilizing a two-dimensional spatial light modulator (SLM), the MLA 150 directly exposes the resist-coated wafer, facilitating an unmatched ease of use and operational performance. Its application spans various sectors including MEMS, micro-optics, sensors, and electronic components, highlighting its versatility and effectiveness in nanofabrication environments.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Single Fiber Aligner
1100
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The 1100 Single Fiber Aligner uses patented fiber alignment concepts to produce virtually instantaneous temporary couplings for OTDR, dispersion, or any other optical fiber or component test that requires a fiber-to-fiber connection. It delivers low loss, low reflectance couplings on the first try virtually every time, without the need for test instrument feedback. As a result, temporary coupling times are minimized and manufacturing costs are reduced without compromising product quality.
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
DUV Mask Aligner
Model 200E
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OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
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Product
ResMap or DualMap Manual Load
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
ResMap or DualMap Auto Load Table Top
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Product
Laser Beam Alignment
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The alignment product line provides full solutions for applications such as: alignment of laser cavities, straightness measurement, machine alignment, wide-bed printers alignment and others. The AlignMeter system simultaneously measures incoming laser beam position (in µm) and angle (in µRad).It is a powerful compact device perfect for alignment monitoring, for testing the drift, centration and beam alignment relative to the outer housing or tube.
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Product
Shaft Alignment
NXA Pro
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30 years of innovation continue with the introduction of the NXA Pro.
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Product
Shaft Alignment
NXA Ultimate
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The combination of alignment and geometric routines allows the user to address many of the root causes of outages as part of a complete preventive maintenance program. With a wide range of applications, a screen interface featuring animated 3-D images and a large color touch screen (6.5″) the NXA Ultimate is remarkably user friendly.
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Product
Beam Geometry & Alignment Testing
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Perform quality control testing of your Digital Radiography (DR), Computed Radiography (CR) and Fluoroscopy X-ray systems with ease. Comply with local, state, federal, and governing bodies for digital and traditional analog radiographic imaging technologies.
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Product
½ ATR For Deployable Applications Aligned To SOSA™
ATR-3600S
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ATR-3600S is an off-the-shelf half-ATR specifically designed for deployable applications requiring alignment with the SOSA Technical Standard. This six-slot chassis is mission-ready to accept SOSA aligned plug-in cards (PICs) and VITA 62 power supplies and is an ideal way to rapidly integrate a deployable platform leveraging the power of SOSA.
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Product
Alignment Pin Replacement Kit, G2/G6/G10, Receiver
310118000
Receiver
This kit contains parts/ tools needed to replace missing or damaged alignment/ dowel pins on the G2, G6, or G10 receiver: 2 alignment/ dowel pins Loctite primer Loctite adhesive Dimension blockInstructions for replacement can be found in G2/G6/G10 user manual.
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Product
DC Alignment
SEP/SIP
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There are analog phase control type DC power supply type and digital control type inverter energy saving type. We provide the most suitable equipment according to the current capacity and cycle time.If the "start command" is executed from the existing molding equipment, each mode of "alignment-pause-demagnetization" is continuously operated by the program inside the instrument. It is also possible to share an emergency stop signal and output an output current abnormality signal.
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Product
8-slots 25Gb backplane aligned to SOSA
1SVX308ABP-1X31
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3U 8-slots 25Gb backplane aligned to SOSA, with apertures for VITA 66/67 RF & optical modules.
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Product
FlexVNX+ 3-Slot Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S03VPXZZY2VAND
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Elma’s 3-Slot FlexVNX+ Development Chassis is the industry’s first compact, SOSA™ and VITA-90 aligned VNX+ platform, purpose built for rapid board bring-up, validation, and test of plug-in cards (PICs).
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Product
UFP series High Sensitivity Fiber Optic Alignment Stages
UFP
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Model: UFP1A-LFeatures:• The linear stage has both coarse adjustment and fine adjustment, sensitivity is much better than 0.5um• The rotation stage sensitivity is much better than 23.4" • High stability
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Product
3U 12-Slot Development Platform Aligned To SOSA 1.0 And CMOSS
39E12WUX98Y2VCM0-SOSA1
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3U OpenVPX development platform aligned with SOSA 1.0. It supports both SOSA and CMOSS profiles. It includes: 2 I/O intensive SBC, 7 primary payload, 1 radial clock, 2 switch and 2 power. Includes VITA 67.3 RF and optical I/O modules.
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Product
Headlight Alignment Testing Technology
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Maschinenbau Haldenwang GmbH & Co. KG.
See and be seen: The headlight adjustment test technology provides the user with information about the horizontal and vertical adjustment of vehicle headlights and their intensity. With the help of the headlight alignment test technology, the headlights can be adjusted, taking legal or manufacturer-specific requirements into account.
