Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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CD Measurement and Advanced Film Analysis
FilmTek CD
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Scientific Computing International
SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. Delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. Patented multimodal measurement technology meets the challenging demands associated with the most complex semiconductor design features in development and production.
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Plasma Process Monitors
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Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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ICP OES spectrometer (ICP AES)
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SPECTRO Analytical Instruments GmbH
ICP OES spectrometer (ICP AES) for the rapid analysis of elements in a variety of matrices including aqueous, semi-conductor, petrochemical, soil, metallurgical and slurries
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High Speed & Precision Pressure Insensitive Mass Flow Module
D700MG
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Critical semiconductor manufacturing processes continuously desire precision gas flow control devices that enable both future innovation, and lab to fab transition of leading edge memory and logic device. HORIBA's propose the new pressure based MFC D700MG, the upper compatible model of the D500MG to support customer’s challenges.
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Laser Diode
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A laser diode, also known as an injection laser or diode laser, is a semiconductor device that produces coherent radiation (in which the waves are all at the same frequency and phase) in the visible or infrared (IR) spectrum when current passes through it.
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Non-Linear Junction Detector
ORION™ 900 HX
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The ORION 900 HX Non-Linear Junction Detector (NLJD) detects electronic semi-conductor components through dense materials such as bricks, concrete, and soil. The ORION 900 HX NLJD is made to detect and locate hidden cameras, microphones, and other electronic devices regardless of whether the surveillance device is radiating, hard wired, or turned off.
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MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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PXI Semiconductor/IC Test System
Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Wide Bandgap Transistors
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The key for the next essential step towards a more energy-efficient world lies in the use of new materials, such as wide bandgap semiconductors (WBG) which allow for increased power efficiency, smaller size, lighter weight, lower system cost or all of these together. STMicroelectronics offers the broadest product and technology portfolio of silicon carbide (MOSFETs) and gallium-nitride-based (e-mode HEMT) devices, covering bare dies, discretes and modules belonging to the STPOWER family.
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3-5 Watt Power Amplifiers
CCM1095 and CCM2096
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The CCM1095 and CCM2096 are power amplifiers that use current efficient Silicon Carbide output semi-conductors to achieve +35 to +38 dBm output power. An internal sequencing circuit is included to provide for safe operation of the output power device.
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WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Measuring Microscopes, Image Processing + Semiconductor Technology, Micro Scriber
Line Width Measurement
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Optik Elektronik Gerätetechnik GmbH
COMEF is an image processing software with special functions for the highly accurate measurement of line width and line distance. Using grey value algorithms, the width and distance of conductor lines or structures on silicon wafers can be measured with subpixel accuracy.
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Lan Digitizer / Oszilloscope With 16 Bit, 4 Channels 100 MS/s Up To 8 GS Memory
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The GaGe series of Faceless Connected Instruments (FCiX) provide test and measurement professionals new options for integrating high resolution, multi-channel digitizers into Ethernet and LAN enabled measurement systems. The applications served include manufacturing test, automotive test, remote communications monitoring, multi-site semiconductor test, and other solutions where a lightweight but powerful, multi-channel, independent digitizer system is required.
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Thermalyze Extension for Steady State Analysis
Lock-In
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Steady-state thermography is limited to detecting hot spots that heat up a minimum of 100 mK (0.100°C). This may be useful for locating shorts on high-power devices, but is inadequate for detecting low power defects such as semiconductor device leakage current or short circuit with very low or very high resistance. Steady-state thermography also suffers from poor spatial resolution as the heat from localized hot spots diffuses rapidly, blurring the location of the heat source.
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Dissolved Ozone Analyzer
Model 470
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Teledyne Advanced Pollution Instrumentation
The Model 470 is a state-of-the-art Dissolved Ozone Sensor designed for semiconductor Wet Bench tools and many other industrial processes. It provides continuous measurement of dissolved ozone in deionized water or sulfuric baths with concentrations up to 150 mg/L. The Model 470 is “clean-ready” for high purity semiconductor processes, and is designed to be simply spliced in-line in the recirculation loop of any wet bench tool with flow rates up to 150 SLPM.
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Advanced Packaging & TSV
FilmTek 2000M TSV
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Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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MANIFULATOR
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As one of the most important module in Probe_Station, manipulator is an accurate system that probe micro distance() and contact on the electrode of semiconductor wafer, device. ECOPIA's Manipulator is very easy to use and probe arm's elastic plate is good to protect sample's surface, from being damaged by Z direction movement.
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Semiconductor Device Parameter Analyzer/Semiconductor Characterization System Mainframe
B1500A
Analyzer
Current-voltage (IV) measurement capabilities of spot, sweep, sampling and pulse measurement in the range of 0.1 fA - 1 A / 0.5 V - 200 VAC capacitance measurement in multi frequency from 1 kHz to 5 MHz and Quasi-Static Capacitance-Voltage (QS-CV) measurement capabilitiesAdvanced pulsed IV and ultra-fast IV measurement capability from minimum 5 ns sampling interval (200 MSa/s)Up to 40 V high voltage pulse forcing for non-volatile memory evaluation
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Laser Heads
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The laser head is the source of the laser beam used in all laser motion and position measurement systems. The primary difference between laser heads is in the velocity, reference frequency and optical output power. Other considerations are size, heat dissipation, and input power requirements. Which laser you choose depends primarily on the application in which it will be used. For example, semiconductor lithography systems typically have faster moving parts (stages), and therefore need higher velocities than machine tool applications.
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Low Noise Amplifiers
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RPG Low Noise Amplifiers are developed and manufactured using the most modern discrete components and thin film technologies, in order to cover the frequency range 50 to 350 GHz. With improved DC-supply and modern semiconductors these amplifiers not only deliver low noise performance but also broad operating bandwidth and gain flatness. These low-noise amplifiers are available as a standard product and on request as customized manufactured product.
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Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Panel-mount Type Resistivity Meter (Four-Wire Transmission)
HE-480R
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HE-480R connects resistivity sensor(ERF sereies) and measures resistivity and temperature in the sample water.The feature is the high-precision temperature compensation function.Its high-performance temperature compensation makes it ideal for sequential monitoring of ultra-pure water used in manufacturing processes in the semiconductor field, and many other fields, including the areas of electrical goods, foods and medicines.
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WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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SEM- Based Dectors
ScintiFast™
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ScintiFast™ is El-Mul’s flagship scintillator technology enabling the next generation of detectors with shorter response time and higher sensitivity. Recently released, ScintFast™ has the highest available photon yield for the nanosecond scintillator category. ScintiFast™ is the scintillator of choice for detectors in SEM-based tools for the semiconductor market as well as in Time of Flight Mass Spectrometry instruments.
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Product Lifecycle Management Software
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Siemens Digital Industries Software
Our product suites offer capabilities that span the product lifecycle, from design inception to manufacture and support. By doing so, they help turn more of our customers' ideas into successful products. Solutions for: Aerospace & Defense, Automotive & Transportation, Consumer Products & Retail, Electronics & Semiconductor, Energy & Utilities, Industrial Machinery & Heavy Equipment, Marine, Medical Devices & Pharmaceuticals.
