System-on Chip
A complete computer "System on a Chip".
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Product
Chip Scale TVS Arrays
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ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V32GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Rings
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Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Metal Glazed High Voltage Chip Resistors, Anti-Sulfuration
SMG Series
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*Flameproof UL94VO molded package, resistance to sulfuration, heat and humidity.*Special design for automatic surface mounting.*Metal-glaze elements provide high stable performance against environmental conditions and overload.Excellent mechanical strength & electrical stability.*Reducing assembly costs.
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Product
OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Thin Film Chip Resistors, High Voltage Type
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Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
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Product
32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Test Adapter
RAMCHECK Sync
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The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Product
8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip
AQD-D5V8GN48-SC
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
8GB DDR5-5600 288Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-D5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L4GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L4GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8, Samsung Chip.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Precision Shunt Chip Resistors
SMV
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*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V32GR48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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Product
UltraZed PCIe Carrier Card for UltraZed-EG System-on-Module
AES-ZU-PCIECC-G
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The UltraZed PCIe Carrier Card supports the UltraZed-EG System-on-Module (SOM), providing easy access to the full 180 user I/O, 26 PS MIO, and 4 PS GTR transceivers available from the UltraZed-EG SOM via three Micro Headers. Two 140-pin Micro Headers on the carrier card mate with the UltraZed-EG SOM, connecting 180 of the UltraZed-EG Programmable Logic (PL) I/O to 2 Digilent Pmod™ compatible interfaces, FMC LPC slot, LVDS Touch Panel interface, push button switches, DIP switches, LEDs, Xilinx SYSMON, and clock oscillator.
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
Thin Film Current Sensing Chip Resistors
CSTN
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*Thin film process*High power rating up to 3 watts in 2512 size*Resistance values from 50m to 1ohm*High purity alumina substrate for high power dissipation*Power management applications*Switching power supply*Over current protection in audio applications*Voltage regulation module (VRM)*DC-DC converter, battery pack, charger, adaptor,*Automatic engine control*Disk drive
