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Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Test Sockets
BGA/LGA
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Off-Set Kelvin Test Sockets
This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Test Sockets
Non Standard
Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Test Probes
Petracarbon is a leading supplier and provider of spring contact probes and semiconductor test sockets.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Quick-Release Universal ZIF
Series X57X
Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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RF Socket
With unparalleled technology, coaxial structure, and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
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Test Block & Plug Systems
Test Block system is an evolution of the 14 test circuit versions widely employed in the power utility sector. The primary difference is the incorporation of ‘finger safe’ test sockets which allow the use of shrouded 4mm banana plugs.
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Digital Multi-Function Tester
MT2
Multi-functional tester with plain slot blade that allows the checking of wiring without dismantling or having any contact with live parts. Applications include 'break point' in wiring, continuity testing, bulb and fuse testing, microwave leakage, socket testing and testing for static. Fully insulated. Full instructional leaflet supplied. Supplied with 2 x 1.5V alkaline batteries.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Film Frame Test Handler
4170-IH
High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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EV Charging Station Tester
EV : ChargeCheck
The EV Industry’s Charging Station Tester of Choice. • Simulates an electric vehicle • Tests J1772 (type 1) tethered leads • Tests IEC62196 (type 2) sockets • Tests IEC61851-1 mode 3 communication compliance • Tests for correct polarity • Tests for earthing presence • Tests contactor actions.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Turret Kelvin Test Contactor
cHybrid
cHybrid™ Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multi-beam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.cHybrid Kelvin contactor with multi-beam contact spring architecture delivers improved yield and long life minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Test Contactor/Probe Head
Hydra
Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
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Grypper G80 / G80 LIF
*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
