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Thermal Expansion
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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DSP, Expansion & Software
A wide range of products designed to control, mix, and optimize audio signals.
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Expansion Peripherals
Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.
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Expansion I/O Module.
SI-MOD22xx
The SI-MOD22xx is a family of high resolution, ultra high speed multi function data acquisition and control modules that plug into any SI-DSP carrier processor card for the PCI Express bus.
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Thermal Transport
The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Thermal Tools
BMP Testing and Calibration Services Inc.
BMP Testing and Calibration Services, Inc. utilizes the latest thermal measurement equipment to analyze low to medium-conductivity materials, from ceramics, plastics, and polymers to coatings, composites, liquids, and building materials.
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Thermal Imager
testo 865
The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal Analysis
Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Digital Expansion Board
MSXB 013
Digital Expansion Boards. The MSXB 013 Digital Input/Output Expansion Board expands 16 digital input lines and 16 digital output lines to 64 digital input lines and 64 digital output lines.
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Thermal Camera Cores
Tenum® 640
With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Thermal Vacuum Testing
When you want to test your product for extreme space conditions, that include temperatures from 155°C to -175°C at space vacuum altitudes, Environment Associates is your solution. Using this test to determine the unique failures of space mechanisms that orbit the earth is key in improving system reliability. Thermal vacuum testing is similar to thermal cycling but adds deep space vacuums for detecting corona/arcing and intermittence and increases a product’s out-gassing. The key failure modes found during this test are: 1) electrical iIntermittence, 2) thermal control issues, 3) arcing, 4) corona, 5) material out-gassing, and more, to determine a product’s flight-worthiness for workmanship and processing issues.
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Expansion Adapter Chassis
TB3-TO-CMC-LP
The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
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Fixed-Mount Thermal Camera
FLIR Axxx-Series Image Streaming
FLIR Axxx-Series Thermal Image Streaming Cameras offer the monitoring capabilities needed to accurately detect and identify thermal issues across manufacturing and industrial processes. With multiple field-of-view choices, multi-streaming capabilities, motorized focus control, and optional compressed radiometric streaming over Wi-Fi, these fixed-mount camera solutions can tackle the most complex remote monitoring objectives. Easy configuration allows you to tailor this monitoring system to your company’s quality, productivity, maintenance, and safety needs.
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Thermal Imaging Cameras
PeakTech Prüf- und Messtechnik GmbH
Is a versatile thermal imaging camera with a resolution of 220x160 thermal pixels, which shows temperature differences easily recognizable for every user. Use this new development e.g. to detect thermal bridges in thermography, leaks in systems and pipe systems or track heating pipes in walls and floors.
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Analog Input Expansion Board
MSXB 018
The MSXB 018 Analog Input Expansion Board expands 16 analog input lines to 64 analog input lines. The MSXB 018 provides 4 expansion ports that are compatible with MSTB 009 Analog Termination Boards.
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Thermal Cabinets
AMETEK Sensors, Test & Calibration
We provide two models of high precision heating and cooling thermal cabinets; the TC540 heating cabinets (40°C to 300°C) and the TC550 heating and cooling thermal cabinets (-70°C to 300°C) used with liquid nitrogen for cooling.
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PCI Express Expansion Backplane
SKU-076-0X
PCI Express Expansion backplane was designed as a universal solution for Desktop or Laptop host computer expansion. It allows adding up to four additional PCI Express boards to the host computer. Expansion backplane can be placed inside any general-purpose computer chassis, and connects to the host computer via 5ft (or 10ft) CAT6 cable.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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Thermal Vacuum Chamber
Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Thermal Test Chip
Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Thermal Surveillance Systems
Zhejiang ULIRvisionTechnology Co., LTD
Thermal security camera system is widely used in areas where security and monitoring are required for timely detection of abnomal situations in order to prevent further damage. Below are two typical type of cameras for thermal surveillance and the importance of thermal imager for security in various application fields.
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AMC For PCIe Bus Expansion
AMC113
AMC113 is VadaTech second generation PCIe expansion module. The AMC113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s other carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem.The AMC113 allows expansion among multiple μTCA chassis or
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Row Expansion Cables
Y1134A
Easily configure an expanded matrix using this expansion cable with the 34934C and 34934T terminal blocks
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Liquid Thermal Shock Baths
TSB Series
CSZ's Liquid thermal shock chambers consist of separately controlled hot and cold baths. Product is submersed in fluid and thermally stressed between the hot and cold baths, resulting in immediate product temperature changes. CSZ uses perfluorinated fluid that does not coat the product or conduct electricity for use in both the hot and cold baths to eliminate cross contamination and reduce evaporation losses.
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Thermal Voltage Converter
1395D
The 1395D series of TVC's, have Dual Thermal Element technology. The 1395D offers double the output voltage (typically 14 mV instead of 7 mV). This higher output voltage means better resolution and increased accuracy. It can be used to measure AC Voltages between 20 Hz and 100 MHz and it can serve as a primary AC voltage standard and/or standard for calibration of AC calibrators and voltmeters.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Rapid Thermal Processing system
RTP - 1300
Ecopia’s RTP (Rapid Thermal Processor) is able to do heat treatment on maximum 4inch wafer in very high speed. And, we have installed 12 pcs of hallogen lamps and it can make it possible to do heat treatment on the sample uniformly.Furthermore, it is very convenient to use and we are providing at reasonable price. Therefore, it is good to use in university and laboratory.
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