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Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Edge Gateway
EPC-R3710
EPC-R3710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI/LVDS/eDP and rich IO as dual GbE/2serials/3USB/12GPIO. EPC-R4710 also features Mini-PCIe slot for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for HMI, IoT gateway, healthcare application.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Solid Edge
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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360° Edge Analytics
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Edge AI System
Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
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Edge Gateway
The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
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Leading Edge Sensors
The LaserGauge® Leading Edge Profiling System consists of a handheld or benchtop sensor and the Leading Edge software application. Designed to scan both sides of the blade simultaneously, the sensor returns a complete profile around the radius of the blade, which allows accurate measurements of the thickness and the plotting of the blade profile for comparison to its engineering design.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Edge Applications
Provide more powerful digital experiences with less overhead, using pre-built edge applications integrated with your CDN.
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Edge Gateway
EPC-R4710
EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Wafer Inspection Machine
IV-W2000
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Single Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Edge Gateway
EPC-R4760
EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Universal Edge Finder
BORDO
No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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Wafer Level Multi-Die Test System
ITC55WLMD
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Sharp Edge Tester
UI-T03
Sharp Edge Tester is used to test if toy or other test sample has hazardous sharp edge or not.
