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Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Bow and Global Film Stress Measurement
128 Series
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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STDF Test Data Analysis Tool
DataView
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
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Pressure Mapping
HIGH SPEED I-SCAN® SYSTEM
Tactile pressure and force measurement system capable of measuring
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Half-Cell Corrosion Mapping
XCell
Giatec XCell™ is a smart tablet-based NDT probe for fast, accurate and efficient detection and on-site analysis of corrosion in reinforced concrete structures. Giatec XCell™ meets all the requirements of the ASTM C876 standard specification.
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Digital Map Systems
Elbit Systems of America’s Global Digital Map Unit is built on a proven design that accommodates multiple data formats and provides unmatched situational awareness to aircrews. The GDMU displays detailed map, flight plan, and threat information to aircrews. Each system performs interactive functions with the mission computers and generates digital video map data for head down displays.
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Pressure Mapping
CONFORMAT® SYSTEM FOR R&D
Tactile pressure measurement system utilizing a fully conforming array pressure sensor.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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One click site mapping
PowerMapper
PowerMapper is an automatic site mapping tool for information architects, usability analysts and web developers. It is used in more than 50 countries, by 30% of the Fortune 100, and major organizations like NASA and MIT.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Magnetic Field Camera: mapping for MRI applications
MFC2046
MRI and NMR spectroscopy applications require a highly uniform magnetic field, within at most a few ppm. NMR is the only magnetic measurement technique capable of providing a field map with that degree of precision. Introduced 25 years ago, Metrolab’s NMR Magnetic Field Cameras have revolutionized field mapping for MRI magnets. They reduced acquisition times from hours to minutes, positioning errors to fractions of a millimeter, and they rendered human and drift errors negligible. Now, meet the latest generation NMR Magnetic Field Camera, the MFC2046! Map any magnet with the New generation of MFC probe arrays. Magnetometer Teslameter Gaussmeter
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Industry Standard in GPR for Utility Mapping and Locating
GSSI’s Utility Scan Pro GPR
Geophysical Survey Systems, Inc.
With UtilityScan Pro, users can quickly identify and mark the position and depth of metallic and non-metallic objects; including utilities such as gas, communications and sewer lines as well as underground storage tanks and PVC pipes. Based on the SIR 4000 controller, the UtilityScan Pro provides the GPR professional with solutions to any underground locating situation.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
