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Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Resistance Meters
High-Speed High-Stable Resistance Meter with Low-impact Resistance Measurements for Miniature 008004-size Electronic Parts
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Resistive Components
Diamond is the best thermal conductor on earth. Combined with a low dielectric constant, it is an excellent RF dielectric material for high-frequency applications in which thermal performance is equally critical. By applying cutting-edge thin film process and extensive millimeter wave design experience, Smiths Interconnect has created a high-performance line of resistive components. The resulting products, our Diamond RF Resistives® resistors, terminations, and attenuators, are significantly reduced in size and unparalleled in average and peak power handling.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Resistance Meters
ACL provides surface resistance/resistivity meters and digital megohmmeters to quickly and accurately measure resistivity.
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Resistance Measurement
Precision resistance measurement equipment for a range of applications. Specialist units measure down to fractions of a micro-ohm with high accuracy.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Electrical Resistivity Instrumentation
The resistivity survey method is more than 100 years old and is one of the most commonly used geophysical exploration methods (Reynolds, 1997). It has been used to image targets from the millimeter scale to structures with dimensions of kilometers (Linderholm et al., 2008; Storz et al., 2000).
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Resistive Current Tester
Weshine Electric Manufacturing Co., Ltd
Long Distance Digital Zinc Oxide Arrester Resistive Current Safety Testing Set
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Resistance Substitution Box
RS Series
The RS Series Resistance Substitution Box is the most commonly used decade box on the market today. The RS Series is not only easier to use, but it is also priced lower than most its competition.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Resistance
Ohmmeters, decade boxes and resistance standards for tests against safety and quality.
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Contact Resistance Tester
Weshine Electric Manufacturing Co., Ltd
The loop resistance tester is used to test the conductive loop resistance of various switchgear, and the test current shall not be less than 100A. Due to the oxidation of the contact surface, poor contact tightening and other reasons, the contact resistance increases. When a large current flows, the temperature of the contact point increases, which further accelerates the oxidation of the contact surface and further increases the contact resistance.
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Electronic Resistance Store
MPS2
The MPS2 module is a mezzanine module designed to form DC resistance in two channels with a four-wire measurement circuit. MPS2 is installed on the mezzanine carrier - the NMU module and is connected to it via a local information highway. Up to four mezzanines of various types can be installed on the NMU module. The NMU module together with the mezzanines installed on it forms a VXI module of the size C-1 and is used to create information measuring VXI systems.
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Winding Resistance Tester
JYR20S/10S
DC winding resistance testing is regarded as another essential routine screening tool. It indicates problems such as loose, defective or incorrect connections, which cause enough transformer failures each year to be regarded as a failure category of its own.
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Electronic Store Of Resistances
PS8
The module is intended for use as part of information measuring systems based on the VXI bus for software setting of resistance values with a given step along three independent channels.
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Artificial Resistive Load
326
An industry staple for over 50 years, the TESCO Artificial Resistive Load (Catalog No. 326) has been redesigned to meet 21st century standards, making it the most cost effective, portable and light weight artificial load box on the market today.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
