Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
WLCSP Probe Heads
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Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Product
TMR Current Sensors
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MultiDimension Technology Co.,Ltd.
An open-close current transducer, high sensitivity and signal-to-noise ratio TMR chips are used in the design, which based on Tunneling magneto resistance effect. The transducer has a built-in temperature compensation and nonlinear compensation circuit, which can accurately measure DC, AC and pulse current. The transducer has many benefits ,such as high precision, wide bandwidth, low power consumption, excellent isolation performance and so on. Besides, the design of open-close structure makes it easier to install and unload.
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Product
Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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Product
Diode Arrays
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a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
DDR3 SODIMM
SQR-SD3N
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Original Samsung/Micron IC chips adapted, Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C, 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
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Product
N2 O2 Analyzer
GNL-IN881 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-IN881 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%.It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/78ea4933-855f-c270-f389-d6ac3b6fe432.shtml#sthash.Dk7zX5DN.dpuf
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Product
16 Channel Multihit TDC (25 ps)
V1290N-2eSST
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The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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Product
100μm Flexible PET IDE Sensor Chip
FPI1
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100μm flexible PET interdigitated electrode (IDE) sensor chip for gas sensing, humidity monitoring, biosensing, and capacitive sensing research. The electrode geometry is designed for repeatable response, compact sample volumes and easy integration with potentiostats or custom fixtures.
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Product
Manual Label-Free Molecular Interaction Analysis Machine, Flexible Research Platform
OpenPleX
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Designed to meet the demands of biologists, biochemists and biophysicists, the OpenPlex is a flexible surface plasmon resonance imaging system.OpenPlex is your companion for the development of label-free and multiplexed bio-assays and molecule detection. It is a robust and compact system designed for simple use and high versatility. Its open format, dedicated sensor chips and manual operation enable numerous types of experiments to be explored without compromise, covering chemistry, biochemistry, physico-chemistry and biomolecular interactions.
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Product
High Speed High Mix Pick And Place
MC389
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The MC389 sets new standards for SMT pick and place speed, precision, and flexibility. Based on the MC Series’ durable ball-screw and rotary-encoded drive train, its three heads and on-the-fly vision allow accurate placement of any SMD (including 01005 chips, µBGAs, and 12-mil pitch QFPs). With an enormous placement area of 650 mm x 460 mm (25.6" x 18.1") and a capacity for up to 160 Smart Tape and Stick Feeders, the MC389 can easily be configured for virtually any high-mix project.
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Product
SparkFun GPS Breakout
Chip Antenna, SAM-M8Q (Qwiic)
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The SparkFun SAM-M8Q GPS Breakout is a high quality GPS board with equally impressive configuration options. The SAM-M8Q is a 72-channel GNSS receiver, meaning it can receive signals from the GPS, GLONASS, and Galileo constellations. This increases precision and decreases lock time and thanks to the onboard rechargable battery, you'll have backup power enabling the GPS to get a hot lock within seconds! Additionally, this u-blox receiver supports I2C (u-blox calls this Display Data Channel) which made it perfect for the Qwiic compatibility so we don't have to use up our precious UART ports. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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Product
Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Product
Arduino CAN Shield
IFB-10003-AWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
8 Channel DAC FMC Module
DACNF08 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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Microcontrollers
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Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Product
(IoT) Wireless Module
SX-59HLS
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The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
Capacitors
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Types of capacitors manufactured by Vishay include tantalum (both solid and wet), ceramic (both multilayer chip and disk), film, power, heavy-current, and alumninum. Vishay is the number one manufacturer worldwide of wet and conformal-coated tantalum capacitors, as well as capacitors for power electronics. Vishay is also one of the largest manufacturers of molded tantalum surface-mount capacitors.
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Product
I2C Isolators
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Analog Devices’ family of isolated I2C isolators support a complete isolated I2C interface. This portfolio is based on our iCoupler® chip scale transformer technology. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. By integrating iCoupler channels with semiconductor circuitry, our technology enables a complete, isolated I2C interface with a small form factor. Our I2C isolators covers applications such as central office switching, networking, and power over Ethernet.
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Product
288-Pin Dual In-Line Memory Module
SQR-UD4(ECC)
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SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program.
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Product
128 Channel Multihit TDC
VX1190A-2eSST
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The VX1190A-2eSST is a 128 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Low cost Device Programmer for PC/Parallel
ChipMax
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ChipMax is a cost-effective, high quality industrial-grade device programmer with parallel-port interface that is suitable for most programming needs without using any extraneous personal family modules.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
AMC GBit link card/VITA 57 FMC carrier
SIS8100
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The SIS8100 will be a single width mid height AdancedMC card. It will interface with a single PCI Express lane over a PLX Technology PEX811 PCI Express to local bus bridge chip and have an on board Virtex IV FPGA. The default stuffing option has a Small Form Factor (SFF) optical link medium that can be operated at 1, 2.5 and 4 GBit/s.
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Product
Radio Module with PCIe Card
SX-PCEAC2
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The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Product
32 Channel Multihit TDC (25 ps)
V1290A-2eSST
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The V1290A-2eSST is a 32 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts both ECL and LVDS inputs.
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Gang Programmers
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a multi-socket electronic device made by Xeltek used to program data into multiple integrated circuits (chips) at the same time.
