Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
3U Processor Board
CP39101
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LinkedHope Intelligent Technologies Co.,Ltd.
CP39101 is a 3U CompactPCI 4-channel independent isolated serial communication board, designed for industrial communication applications, compliant with PICMG R3.0 2.1 specification.CP39101 adopts EXER 17D158 communication processor as the master control chip. Each of the on-board 4-channel serial port can be individually configured as RS232, RS485 or RS422, and in any mode, CP39101 can be operated properly in extended temperature ( -40℃ to +85℃ ) range.
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Product
100μm Flexible Gold Interdigitated Electrode Chip (PI)
FIG1
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Flexible gold IDE chip on a polyimide (PI) substrate for humidity, gas sensing, and optoelectronic research.
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Product
Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Product
60 GHz WR-15 Waveguide Tx Module
PEM010
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The PEM010 is a highly integrated millimeter wave transmitter that covers the 60 GHz global unlicensed spectrum allocations packaged in a standard waveguide module. Transmitter architecture is a double conversion, sliding IF with wide bandwidth capability through the up-conversion chain from baseband to carrier. The I/Q interface accepts analog baseband signals which provides for flexibility in design and applications. The baseband input optionally supports FSK/MSK modulation for non-coherent applications. The transmitter incorporates a complete waveguide interface with low-loss transition between the chip and the WR15 waveguide port. The integrated package is small and lightweight, with a simple to use multi-pin ST4 connector for power, reference clock, digital control port and baseband signals. Either of two reference clocks can be used for setting 540 MHz or 500 MHz channel spacing.
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Product
8G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U8GN32-SE2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
10-CH General-Purpose Timers/Counters & 8-CH Digital I/O Card
PCI-8554
Digital I/O Module
- Supports a 32-bit 5 V PCI bus- On-board four 82C54 programmable timer/counter chips- 10-CH independent 16-bit down counters- 1-CH 32-bit cascaded timer- Four programmable clock sources for each timer/counter
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Product
Pressure Sensors
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ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Product
RF modules
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Dresden Elektronik Ingenieurtechnik GMBH
2.4 GHz OEM module with chip ceramic antenna based on the ATmega128RFA1 single-chip microcontroller from Atmel
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Product
DIP Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
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Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
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Product
FEC Accelerator Based On Intel® VRAN Dedicated Accelerator ACC100
PCIe-ACC100
Interface Card
ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
QSeven
ROM-7420
Computer-on-Module
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Product
Sealed Linear Encoders
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Sealed linear encoders feature optimal protection from dust, chips, and splash water. They are especially ideal for use in manually operated machine tools and also in numerically controlled machine tools.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Product
STANAG3910/EFEX Modules
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AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Empowering Traditional Mass Spec
ZipChip
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The ZipChip™ separations platform uses integrated microfluidic technology to prepare, separate and electrospray biological samples directly into traditional mass spectrometers (MS). In less than 3 minutes per sample, the cost-effective ZipChip system enables analysis of a broad range of matrices from growth media to cell lysates, blood, plasma, urine, and biopharma products. Each chip provides answers on analytes from small molecules up to intact proteins, antibodies and antibody drug conjugates (ADCs). This platform provides better separation quality than most liquid chromatography (LC) instruments – in a fraction of the time – all with full MS identification behind every separations peak.
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Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Gaussmeter
DX-102
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DX-102 Gaussmeter is a portable gauss meter, based on the latest progress of Hall effect magnetic field measuring instrument, adopted DSP technology. Test probe adopts import GaAs linear Hall chip, the difference between any two probes is small, if damaged, it can be replaced directly. DX-102 Gaussmeter is an ideal DC magnetic field test instrument.
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Product
Machine With A History
PAS 5500
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In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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Product
UV TOCONs
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SiC based UV sensor with integrated amplifier and 0 – 5 V voltage output. Measures intensities from 1.8pW/cm² up to 18W/cm². Spectral response for broadband UV or filtered for UVA, UVB, UVC or UV-Index. Also available for blue light (GaP chip) or visible light (Si chip) measurement. Available in TO5 housings or as miniature sensor probes (stainless steel or plastic). Special TOCONs for hydrogen flame sensing (TOCON_F) and for fire detection (TOCON_N) available. Also available for operating temperatures up to 120°C (standard is 85°C). Please learn more about the sglux TOCONs here: TOCON selection guide and here: TOCON User Guide.
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Product
Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
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Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
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Pyroelectric Detectors
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Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
