Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Radio Module (2x2)
SX-PCEAC2
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The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Digital I/O Board
P104-DIO-96
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Each I/O line of this card is buffered and capable of sourcing 32mA, or sinking 64mA. The board simulates Programmable Peripheral Interface chips (PPI) to provide a computer interface to digital I/O lines. Each PPI supports two 8-bit ports (A, B) and two 4-bit ports (Chi, Clow). Each port can be configured to function as either input or output latches. The I/O line buffers (types 74ABT240 and 74ABT245) are configured automatically by hardware logic for input or output according to the PPI Control Register direction software assignment.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
64 Channel Multihit TDC
V1190B-2eSST
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The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Ultra-compact Photoelectric Sensor
EX-20 Ver.2
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Panasonic Industrial Devices Sales Company of America
Using a single chip optical IC, Panasonic created the powerful EX-20 Ultra-Compact Photoelectric Sensors, which are among the smallest Photoelectric Sensors worldwide and in spite of their miniature size, the Sensors incorporate a sensitivity adjuster. Since a red LED dot light source is used, alignment and confirmation of the sensing position is easy, even if very tiny objects have to be detected.
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Product
Industrial Grade SODIMM DDR4 3200
SQR-SD4I
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30u” Golden Finger, Wide Temp range: -40oC~85oC. Tier one original chip adopt, lifetime warranty, DRAM Software Monitoring.
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Product
FPGA Card
VP869
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The VP869 is a high-performance 6U OpenVPX FPGA processing board featuring two Xilinx® UltraScale+™ FPGAs and a Zynq® 7000 Series multiprocessor system-on-chip (MPSoC). It is designed for the most demanding mission critical military, defense, and industrial applications where extreme FPGA processing and I/O bandwidth capabilities are needed. Applications include electronic warfare, signal intelligence, radar/sonar, and high performance embedded computing.
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Product
High-Speed Analog Output
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High-speed analog output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a PIN photodiode and high-speed amplifier transistor on the output side in a single chip.
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Product
RF Coaxial Probes & Probe Positioner
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Fairview Microwave’s line of coaxial RF probes and RF PCB probe positioner are ideal for use with chip evaluations, signal integrity measurements, coplanar waveguide, substrate characterization, gigabit SERDES and test fixture applications. The RF coaxial probes provide return loss better than 10 dB and a maximum operating frequency of 20 GHz. The probes have a 3.5mm female interface, a pitch of 800 or 1500 micron and they can be cable-mounted. They feature gold-plated contacts and can be used by hand, with or without a probe positioner. Compliant coaxial GSG (or GS) pogo pins allow for a broad range of probing angles. The RF PCB probe positioner can hold coaxial probes, has articulated joints and delivers multi-axis positioner control. This positioner also boasts a magnetic mounting plate with on-off positioner switch.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Digital Receiver Exciter (DREX)
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CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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Product
RF & Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & WIreless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Toyota, Mitsubishi, Honda, Hyundai, Daewoo...etc., most of the global IC design houses with DTV chips such as Broadcom, Marvell, MTK...etc., and also defense entities around the world.
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Product
Limiter Diodes
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The SemiGen SLP7100 series of Limiter Diodes are processed with a high-resistivity epi that have thin intrinsic layers. These devices are typically in the 2 to 20 micron range of epi thickness and can be gold doped to achieve specific performance goals. These diodes are used in passive or active limiter designs in the 100 MHz to 30 GHz frequency ranges. They are ideal for use in high-power applications and can be supplied in chip form or in your choice of packages below.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
Arria 10 FPGA Card
CP-FPGA-4
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The Arria 10 FPGA PCIe card features a powerful field programmable gate array chip that supports both analog and digital I/O. Each card’s I/O functionality is fully customizable by the user by means of the FPGA Workbench tools. The cards are available with 480K or 1150K logic elements. There are two High Pin Count FMC Style Positions available for the High-Speed Daughter Cards.
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Product
0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Product
GO-NR1000 Near-Field Goniophotometer
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Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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Product
Universal Programmers
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Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
PCI Evaluation Board
BCM91125E
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The BCM91125E is a full-length PCI evaluation board with the SiByte® BCM1125H MIPS processor System on a Chip (SoC). The board is designed for software development and developing PCI applications, which require high-performance processors. The BCM91125E can be plugged into a PCI slot in any PC, workstation or server, or can be used as a stand-alone device.
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Product
Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
96-CH High-Driving DIO Card
PCI-7396
Analog Input Module
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Product
Intelligent Pressure Calibrator
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Huaxin Instrument (Beijing) Co., Ltd
Here at Huaxin, we offer a selection of HS602 and HX601B intelligent pressure calibrators. They are high pressure, single range digital pressure calibrators with HART communication capability. Composed of high precision measurement chip, 24V DC power supply, battery charging protection circuit, HART communication module and intelligent digital pressure module, these two pressure calibrators provide a pressure calibration solution for gauges, transmitters, and switches over a wide pressure range.
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Product
Stone-chip (Gravelometer)
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Trialon routinely tests products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
