Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Product
Netlist Analyzer
GateVision
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GateVision PRO is the third generation of graphical netlist analyzers from Concept Engineering. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips with intuitive design navigation, schematic viewing, logic cone extraction and interactive logic cone viewing for debug support and design documentation.
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Product
96/48/24-CH Opto-22 Compatible Digital I/O PCI Cards
PCI-7296/7248/7224
Digital I/O Module
ADLINK"s PCI-7296/7248/7224 are high-density parallel digital I/O boards with 96/48/24 I/O channels. The header connectors are fully compatible with industry Opto-22 standard. Thus, PCI-7296/48/24 can utilize the Opto-22 external devices. The PCI-7296/7248/7224 devices emulate mode 0 of the industry standard 8255 programmable peripheral interface (PPI) chips. The PCI-7296/7248/7224 provides 4/2/1 PPI chips respectively. Each PPI offers three 8-bit ports: Port A, Port B and Port C. The Port C is divided into 2 nibble-wide (4-bit) ports. The PCI-7296/7248/7224 devices have programmable timer/counters. One 16-bit counter is available for event counting, while the other 32-bit timer is available for timed interrupt generation. The PCI-7296/7248/7224 devices provide multiple programmable interrupt sources from DIO channels, as well as the output of the timer.
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Product
ASIC
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Xtramus Industrial Instruments
Application-specific integrated circuit chips and hardware-based silicon solutions.
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Product
64 Channel Multihit TDC
VX1190B-2eSST
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The VX1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
3D-IC Solution
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Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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Product
Low Light USB Camera With Microphone
Conversa
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Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Product
32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Product
16 Channel Multihit TDC (25 ps)
V1290N-2eSST
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The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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Product
Cryogenic Temperature Sensors
Cernox®
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Cernox® thin film resistance cryogenic temperature sensors offer significant advantages over comparable bulk or thick film resistance sensors. The smaller package size of these thin film sensors makes them useful in a broader range of experimental mounting schemes, and they are also available in chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible, with bulk devices requiring strain-free mounting. Additionally, Cernox sensors have been proven very stable over repeated thermal cycling and under extended exposure to ionizing radiation.
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Product
Multi-module Programmers
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Xeltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Product
RF Power Generators
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MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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Product
Digitizer
742 Family
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The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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Product
Ultrasound Pulser ICs And HV Multiplexers
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ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
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Temperature Forcing System
ETF-SERIES
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Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Product
RF Signal Generators
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The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Scalable Multi-Channel Active Thermal Control (ATC)
T-Core Thermal Control System
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Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
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Dry Systems
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Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Product
PCI Express Optical Link Board
SIS1100-E2
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The SIS1100-e2 is the follow up card to our SIS1100-eCMC board (without CMC carrier functionality). It was developed to extend the lify cycle of our PCIe to VME interface. For software/driver compatibility reasons we still employ the PEX8311 PCI Express to local bus bridge chip.
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Product
Peak Track Instrument
90323
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The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Product
Multi-Contact Wedge
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The GGB Industries MULTI-CONTACT WEDGE allows for more chip design flexibility because it is custom configured to your circuit. Four Wedges can be used at the same time to probe a complete chip.
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
Thin Film Chip Resistors, High Reliability Type
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
200μm Flexible PET Interdigitated Electrode Chip
FPL1
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200μm flexible PET IDE chip designed for biosensing, gas sensing, and humidity monitoring applications.
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Product
ESP8266 WiFi With Headers
Feather HUZZAH
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Flagship development board from Adafruit, and like its namesake it is thin, light, and lets you fly! We designed Feather to be a new standard for portable microcontroller cores. This is the Assembled Adafruit Feather HUZZAH ESP8266 with headers. At the Feather HUZZAH's heart is an ESP8266 WiFi microcontroller clocked at 80 MHz and at 3.3V logic. This microcontroller contains a Tensilica chip core as well as a full WiFi stack. You can program the microcontroller using the Arduino IDE for an easy-to-run Internet of Things core.
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Product
16G DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-D5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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MIS Capacitors
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The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
