3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
Solder Paste Analyser
SPA 1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Product
Terahertz Imager for Material Inspection
T-SENSE FMI
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This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Property Inspection Solution
DJI / IMGING
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Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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Product
Vision Inspection Products
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Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
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Product
3D Scanning System
CyberGage360
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Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection.CyberGage360 dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing floor; Lowers Cost of Quality & Speeds Up Product Time-to-Market. Designed for use in general purpose metrology, the CyberGage360 has a range of potential industrial applications from automotive to aerospace to consumer electronics, where high accuracy and high speed throughput are important.
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Product
Explosion Proof UV Inspection Light
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he Labino MB Hercules Ex is an extremely durable product specifically developed for use in areas where the risk of an explosion is high. Offshore Oil Rigs, Refineries, Aerospace, and Defense often require explosion proof products to ensure safety for their inspection teams. The Midbeam Hercules Ex has successfully completed extremely tough tests, including tests for thermal conditioning, Impact Tests, Drop Tests and IP tests that led to the ATEX certification (Certificate: ITS17ATEX402144X). This unique product is suitable for use in extreme weather conditions varying from 104° Fahrenheit (+ 40° Celsius) to minus 4° Fahrenheit (- 20° Celsius).
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Product
68-Pin SCSI Micro-D Female Solder Bucket
40-962-068-SB-F
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This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Smart 3D Scanner For Education And Hobby At An Affordable Price
NEO
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Allows you to easily scan objects for further 3D printing
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Product
3D Scanner
Artec Leo
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The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
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Product
Pulsed DC Holiday Detector Inspection Kit
280
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The Elcometer 280 Pulsed DC Holiday Detector is a ‘stick type’ holiday detector that has been designed to make pulsed DC high voltage holiday detection safer, easier and more reliable than ever before.
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Product
Package Inspection Products
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Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Product
Floor-Standing 3D Optical Profilometers
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High-precision, non-contact metrology systems designed for rapid, automated, large-area surface characterization in industrial and R&D settings.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
PCB Assembly Inspection
a3Di
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a3Di is a revolutionary new technology designed to provide accurate, repeatable and fast PCB inspection. The cost saving potential to your business is significant, reducing your overall product inspection costs, increasing your product throughput rates and reducing customer returns.
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Product
3D Multibeam Scanning Sonar
ProScan™
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Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
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Product
Vehicle Inspect Lines Software System
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Foshan Analytical Instrument Co, Ltd.
Flexible control mode(A collective-type control mode can be adopted,but a distributive-type control can also be adopted);Powerful system function(Distributive-type control and collective-type management,provide the functions of equipment debugging,vehicle log-in,vehicle testing and bill printing.A secret code and right-limit can be set so that the system safety function is enhanced);Remote control(A remote log-in,main remote control and remote printing can be realized in accordance with the actual conditions of the testing station.At the sametime,provides a powerful data-base and one station with multi-wire:That is one testing station has more
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Product
Thickness and Flaw Inspection
FOCUS PX / PC / SDK
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Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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Product
3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Product
High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Product
Inspection
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A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
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Product
FieldMaster 3D
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Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Product
Areal Confocal 3D Measurement
µsurf
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The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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Product
Hi-Definition Video Inspection Station with Measuring
VIS810
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
Open eVision 3D Studio
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Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge





























