3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
Scanning & Inspection
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API’s offers a range of portable measuring and laser scanning solutions together with robot or tripod mounted 3D structured light scanner.
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Product
Fiber Optic Inspection Microscope
80761
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The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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Product
3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Product
3D CT Micro-Tomography And High Resolution Digital Radioscopy
DeskTom
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Compact system with no maintenance. 5 motion axis. Small footprint.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
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Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Package Inspection Products
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Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Product
200-480 degree Soldering Station
SM-936B
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* Temperature range 200C-600C (392F-896F).* Ceramic heating element and sensor insures rapid heat-uptemperature.* Celsius or Farenheit temperature setting.* Temmperature adjusted by simply turning the dial.* Wide selection of tips available.
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Product
Articulating Inspection Cameras
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Articulating Inspection Cameras with probes whose tips can be precisely turned (articulated) by the user up to 150 in two directions. Articulation enables inspection of targets located off-axis (even "behind" the probe) or in a tight space without removing the probe. The Inspection Cameras currently offered include the DCS16HPART, its wireless cousin the DCS18HPART, and the DCS665-ART Articulating Inspection Cameras.
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
contact/non-contact portable 3D measurement system
ScanArm
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The FARO ScanArm combines all of the advantages of the FaroArm with a hand held laser scanner and is the perfect contact/non-contact measurement system. Unlike other scanning systems, the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data — all in one simple tool.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE 3000
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The Ultraprobe 3000 is an advanced digital ultrasonic leak detector specializing in compressed air, leak detection, and steam traps. This instrument is versatile and offers reporting capabilities such as on-board data logging.
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Product
Soldering Station
SM-898D
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*Using micro-processor PID program control technology, precise dual digital display hot air gun and the stability of the actual temperature of the soldering iron, fast automatic temperature compensation feature further enhanced temperatures.*The amount of wind, air flow, temperature soldering iron are adjustable.*The air gun holder is a magnetron (or light control), holding the handle when the system will automatically enter the working mode; handle is placed on the shelf when the system enters standby mode automatically.(One more than the 898D Auto Sleep off function)*System with automatic cold wind function, can prolong the life of the heating element.*This product uses "brushless fan" as a source of air, reduce noise, improve work efficiency
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Product
3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
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This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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Product
Lab Inspection & Testing Services
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Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Product
3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex, 3D structures created in the fab.SEMulator3D process modeling and analysis is used for fast and accurate “virtual fabrication” of advanced nano-fabrication processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles.
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Product
3D Measuring Systems
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Measurement systems for mobile, laptops, tablets and other specific electronic equipment, can be achieved using hi-tech materials, such as Rohacell (as used in Aerospace Industry). innco systems 2D and 3D positioning systems are custom designed to meet each new challenge, for mobile phones to wireless network equipment.
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Product
Foreign Matter Inspection Device For FPDs
HS-930
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By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
3D Roughness Measurement System
IF-Profiler
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The If-Profiler is a handheld 3D roughness measurement system for high resolution measurement of surface finish. You measure roughness of flat and curved components with only one system. Measurements are performed both profile based (ISO 4287) and areal based (ISO 25178). The measurement system achieves flexible measurements and applications at high measurement speed. Various positions and measurement fields are traceably and intuitively measured. The IF-Profiler is also used to measure geometries with steep flanks and various coatings.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Real-time X-ray Inspection Systems
Ultra-Compact™
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Glenbrook Technologies redefines X-ray Inspection with our smallest JewelBox Micro focus x-ray system yet. With dimensions of just 22”W x 26”L, it’s small enough to fit on a standard desk, in an office or small lab. But it’s big in capabilities with >500x magnification , 5 axis manipulator and advanced image processing. To view our product video, please click below the product image to the right.
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Product
Floor-Standing 3D Optical Profilometers
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High-precision, non-contact metrology systems designed for rapid, automated, large-area surface characterization in industrial and R&D settings.
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Product
STEEL PLATE INSPECTION MACHINE
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Yubain Steel Plate Inspection Machine can effectively detect steel plate problems, including pinholes, hole breaks, hole deviations, leaks, multiple holes or few holes... and other shortcomings, which can help customers efficiently inspect incoming materials and inspections in the manufacturing process. , To avoid product damage due to steel plate problems, reduce financial losses and customer complaints.
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Product
Inspection Cameras
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The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
