Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
-
Product
PANELMAP
-
PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
-
Product
PXI-5670, 2.7 GHz PXI Vector Signal Generator
778768-02
Vector Signal Generator
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
-
Product
Ultrasonic Transducers
-
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
-
Product
Automated Test Equipment
test
These systems test semiconductor performance and quality with industry-leading precision and cost efficiency. Robust support for semiconductor design evaluation, volume production ramps, and yield improvement.
-
Product
2-Slot BRIC, 256x4, 1Pole, PXI Matrix (2 Sub-cards)
40-559-201-256x4
Matrix Switch Module
This range of BRIC ultra-high-density large PXI matrices are available in 2, 4 or 8-slot PXI sizes to suit all high-performance matrix requirements and are constructed using Pickering Electronics' 4mm x 4mm instrumentation quality reed relays. With their high level of switching density, these PXI matrices allow a complete Functional ATE system to be housed in a single 3U PXI chassis and allow the use of much lower cost 8 or 14-slot chassis. The 40-559 matrices can be used in many industries; typical applications include automotive ECU and semiconductor package testing. Dual analog busing for the narrower matrix options, enable completely separate matrices within a single module for parallel testing.
-
Product
Wafer Auto Line Integration
-
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
-
Product
Emulates Dallas Semiconductors DS89C420
FE-C420
-
* Emulates Dallas Semiconductors DS89C420 * 16K Code Memory * Real-Time Emulation * Frequency up to fmax at 3V and 5V * ISP Support * MS-Windows Debugger For C And Assembler * Emulation Headers and Signal Testpoints * Target Board and Programmer Included * Serially Linked to IBM PC at 115Kbaud
-
Product
Test Contactor/Probe Head
Hydra
-
Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
-
Product
Flexible Test And Scan Solution For FFC Devices
Ismeca NY32W
-
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
-
Product
Mixed Signal Test Systems
MTS1010i
-
The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
-
Product
PXI-5154, 1 GHz, 2 GS/s, 8-Bit, 64 MB/ch, PXI Oscilloscope
780319-02
Oscilloscope
1 GHz, 2 GS/s, 8-Bit, 64 MB/ch, PXI Oscilloscope—The PXI‑5154 is ideal for acquisition and characterization of fast, nanosecond-edge speeds. It is well-suited for automated test and data streaming applications in the consumer electronics, semiconductor, aerospace/defense, and life sciences industries. The PXI‑5154 also comes equipped with up to 256 MB of memory per channel to provide high, sustained sample rates over extended data capture windows. This digitizer, optimized for automated test, uses a high-throughput bus to lower test times, provides picosecond-level synchronization among modules, and integrates with the entire suite of NI hardware, so you can build and customize a complete mixed-signal or high‑channel‑count test system.
-
Product
Advanced Metrology System
AMS Series
-
Precision systems for accurate measurement and quality control in semiconductor manufacturing.
-
Product
Microelectronics Test & Engineering Services
-
EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
-
Product
Scalable Multi-Channel Active Thermal Control (ATC)
T-Core Thermal Control System
-
Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
-
Product
Dicing And Lapping Systems
-
In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
-
Product
Meters For Contact Angle And Surface Tension
SURFTENS HL
-
Optik Elektronik Gerätetechnik GmbH
Measuring instrument for contact angle and surface free energy, special solution for semiconductor technology for wafers up to 300 mm.
-
Product
Bonding
-
With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
-
Product
Metrology
-
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
-
Product
1.3 MP Global Shutter Camera (Monochrome / Color (RAW Bayer))
See3CAM_10CUG
-
The See3CAM_10CUG is a 1.3 MP Custom Lens CMOS USB Global Shutter Camera Module. This is a S/CS/C Mount global shutter camera and is UVC-compliant SuperSpeed USB 3.0 Camera. It is based on the Aptina / ON Semiconductor AR0134 CMOS sensor. See3CAM_10CUG is also backward compatible with USB 2.0 host ports and does not require any special camera drivers.
-
Product
Surface Analysis
-
Shimadzu offers a range of instruments that are ideal for all sample forms handled by customers in the fields of steel, non-ferrous metals, environment, foods, chemicals, pharmaceuticals, semiconductors, ceramics, and polymers. EPMA/SEM offers analysis of targets from several centimeters to several microns; XPS offers analysis from several millimeters to several microns; and SPM permits observations from over a hundred microns to several nanometers.
-
Product
Automotive
-
indie delivers advanced semiconductor, hardware, and software solutions for automotive, industrial, and mobility markets. We specialize in high-performance System-on-Chip (SoC), multi-modal sensing technologies, and advanced perception IP to enable smarter, safer, and more automated systems.
-
Product
THz Pulsed Imaging and Spectroscopy
TeraPulse 4000
-
TeraView’s proprietary semiconductor technology gives the TeraPulse 4000 a market leading signal-to-noise specification with over 90 dB at peak. As standard, the TeraPulse offers a bandwidth of 60 GHz up to typically 4.5 THz; with an option to extend this beyond 6 THz.
-
Product
4K Custom Lens USB 3.0 Camera Board (Color)
See3CAM_CU135
-
See3CAM_CU135 is a 13MP fixed focus 4K USB camera board with good low light performance and iHDR support. This 4K board camera is based on 1/3.2" AR1335 CMOS image sensor with advanced 1.1µm pixel BSI technology from ON Semiconductor® It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It is a Plug-and-Play camera (UVC compliant) for Windows and Linux. This 4K board camera is also backward compatible with USB 2.0 host ports.
-
Product
Compact Semiconductor ATE
QST286
-
Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
-
Product
Semiconductor Test
-
Tecap SPACE offers all the functions necessary to control test systems (ATE) for the semiconductor test. Tecap is hardware-independent and can be used with all customer-specific concepts.
-
Product
3.4 MP Autofocus Low Light USB Camera Board With Liquid Lens
See3CAM_30
-
See3CAM_30 is a 3.4MP UVC Compliant, low light, autofocus USB camera with liquid lens. It is a two-board solution with AR0330 CMOS image sensor from ON Semiconductor and USB 3.1 Gen1 type C interface board. See3CAM_30 is a colour camera with S-mount lens holder and does not require any special camera drivers to be installed in the host PC. See3CAM_30 is customizable and it is a Ready-to-Manufacture camera with all the necessary firmware built in and compatible with the USB Video Class (UVC). It consumes less power and doesn't heat up. There is no mechanical movement like in VCM motor for autofocus. Hence the life of the lens increases.
-
Product
High-resolution, SWIR InGaAs camera
Wildcat+ 640 Series
-
The Wildcat+ 640 series is based upon a state-of-the-art InGaAs detector with 640×512 pixels and 20 μm pixel pitch. The camera offers superior, high resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.The Wildcat+ 640 camera outputs full frame images up to 300 Hz via either a CameraLink or USB3 Vision interface.The Wildcat+ 640 is suitable for semiconductor inspection, display inspection (mobile phone and TV), and laser beam analysis.Benefits & Features- Compact and industry-proven camera design- High-resolution SWIR imaging- Advanced on-board image processing performance- GenICam complaint- Flexible optical mount and lens options
-
Product
Applications
-
No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution. VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.
-
Product
Vison Inspection System
-
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
-
Product
Thermal Control Products
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
