Semiconductor Substrate
thin crystalline material sliced from ingot.
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Product
Software to Simulate Large Area Semiconductor Devices
Laoss
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Laoss (large-area organic semiconductor simulation) is a powerful software package for the design, simulation, and optimization of large-area organic and perovskite solar cells and LEDs (displays, lighting panels, photovoltaic arrays).
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Impact Series Power Discrete Semiconductor Tester
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The Impact Series Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.
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Automated Discrete Semiconductor Tester (ATE)
5300HX
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The Model 5300HX Automated Discrete Semiconductor Tester (ATE) is designed for fast, reliable testing of a wide range of discrete devices. Using an on-board Intel SBC, can provide stand alone testing capability or connected to a PC for intuitive test development and data capture.
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Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
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The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
Semiconductor Probe
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Using the spring contact probes for semiconductor package inspection, customers can test various types of packages with LEENO's Total Interface Solution.
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Product
Semiconductor Test
Ismeca NY32
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32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.
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Semiconductor Test Services
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Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
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Semiconductor Test Software Solutions
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The test engineering staff at Test Spectrum has developed hundreds of test software projects on all major ATE platforms for numerous product technologies.Whether you need to optimize a current test platform, convert to a lower cost test platform, or design a brand new program for a cutting edge product within incredible time constraints, the Test Spectrum team will exceed your program expectations with quality products and excellent results.
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Product
Semiconductor CharacterizationSystem
Keithley 4200
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Materials Development Corporation
The MDC CSM/Win-4200 System integrates the extraordinary power of the CSM/Win softwarewith the power of the new Keithley 4200-SCS. Measure capacitance, voltage, and current down to sub-femtoamp levels.
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Semiconductor Testing
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The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Product
GaN substrates
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Sumitomo Electric Industries, Ltd.
Gallium Nitride (GaN) substrates are widely used for optical devices in the blue-violate to green ranges due to their excellent material characteristics. In recent years, GaN substrates have been drawing attention for power devices. Many development projects are underway.
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Semiconductor Lifecycle Management
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Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.
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Semiconductor Testing Equipment
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We provide you with various inspection equipment mainly for the semiconductor post-production process. Also, "inspection boards", "measurement control" and "test applications" are available for you to meet your various needs.
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Product
3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex, 3D structures created in the fab.SEMulator3D process modeling and analysis is used for fast and accurate “virtual fabrication” of advanced nano-fabrication processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles.
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Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Semiconductor Yield Management Software
QuickLoad-Central
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QuickLoad-Central is our new STDF filtering, analysis, reporting, managing, viewing and editing tool. It looks at all your STDF files before you need to, pulling out key information to pre-generate reports and help you quickly find the files you need. You can list files of interest with yield and header information on our dashboard, visualize your data, open pre-generated reports or push any information from them that you can think of to JMP, Excel or other analysis tools.
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Product
Custom Aluminum Nitride Ceramic Substrate
CAN1
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CAN1 Custom Aluminum Nitride Ceramic Substrate is a custom aluminum nitride ceramic substrate for sensor platforms, MEMS devices, thermal management studies, thin-film deposition, and electronic materials research. The substrate can be supplied for prototype development, coating trials, and small-batch R&D projects where stable ceramic material and custom dimensions are required.
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Product
Dissolved Oxygen Concentration Monitor Series for Semiconductor Manufacturing
HD-960LR
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Ideal for measuring dissolved oxygen concentration in Wet Process from Front-end of Line to Back-end of Line.By adopting a chemical resistant sensor, it is possible to support a wide range of dissolved oxygen concentration measurements from facility to process usage.
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Product
Semiconductors
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Meets SDIO card v2.0 specificationSupports SDIO SPI, 1-bit, and 4-bit SD modesHost clock rate from 0-50 MHzSingle SDIO function interfaceSD commands processed in hardwareReset output on completion of initializationIndication of high speed and high power enabling to application logicMaximum block size supported is 1024 bytesThree I/O mode selection pinsCRC7 and CRC16 modulesSupports direct R/W (IO52) and extended R/W (IO53) commandsAPB bus interfaceParallel bus interfaceStandard 8051 split bus interfaceGeneric 8051 bus interfaceUART interface
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Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
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Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Comprehensive Suite of Software Tools for Semiconductor Test Applications
ICEasy Test Suite
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Marvin Test Solutions' ICEasy Test Suite is supplied with both the TS-900 and TS-960 semiconductor test platforms and provides a comprehensive set of software tools - facilitating the development and debugging of test programs for semiconductor devices. In addition the suite includes I-V curve and Shmoo plot tools for analyzing a device's DC and AC characteristics. The complete suite of tools interfaces seemlessly with Marvin Test Solutions' ATEasy®, a test executive and test development evironment which is supplied with each TS-900 / TS-960 system.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Semiconductor Packaging System
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Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.
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Semi-automatic Semiconductor Probe Assembly Equipment
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The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
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Product
Semiconductor Package Wind Tunnel
WT-100
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Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Product
Atlas DCA Pro Advanced Semiconductor Analyser
DCA75
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The DCA75 is a great instrument for identifying and testing a wide variety of semiconductor components. Just connect any way round! The DCA75 will perform the following:*Display component type (such as N-CH MOSFET, darlington transistor etc).*Display component pinout (such as drain, source, gate etc).*Display detailed parameter measurement.*Plot characteristics curves on your PC.
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Product
Semiconductors
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Teledyne Lincoln Microwave designs our own proprietary microwave diodes, which underpin many of our performance advantages.Our Semiconductor Technology Centre is located at the School of Physics and Astronomy within the University of Nottingham, UK. Facilities include a 90m2 ISO class 6 process cleanroom with ISO class 5 laminar flow.
