Semiconductor Substrate
thin crystalline material sliced from ingot.
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Product
PXI Semiconductor/IC Test System
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A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
Differential Calibration Substrates
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The GGB Industries, Inc., line of DIFFERENTIAL CALIBRATION SUBSTRATES allows the user to calibrate any GGB Industries, Inc., microwave Picoprobe at the probe tip. The underlying principal of the calibration of a measurement system is to provide accurate known standards to which the measurement system can be connected.
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Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
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The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
Semiconductor Testing
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The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Product
Semiconductor Testers
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Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Product
Semiconductor Test Software Solutions
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The test engineering staff at Test Spectrum has developed hundreds of test software projects on all major ATE platforms for numerous product technologies.Whether you need to optimize a current test platform, convert to a lower cost test platform, or design a brand new program for a cutting edge product within incredible time constraints, the Test Spectrum team will exceed your program expectations with quality products and excellent results.
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Product
Software to Simulate Large Area Semiconductor Devices
Laoss
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Laoss (large-area organic semiconductor simulation) is a powerful software package for the design, simulation, and optimization of large-area organic and perovskite solar cells and LEDs (displays, lighting panels, photovoltaic arrays).
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Product
Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
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Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Semiconductor Large Range Type Tester
HS-PSTT
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HS-PSTT large Range Type Tester is a high-grade semiconductor material Type testing equipment,has the feature that testing large range,special suitable for testing the high-Resistivity Silicon Material(contains Silicon Core, phosphorus stick, Boron stick and so on),the resistivity require range is 0.0001～19999Ω·cm, Covers all measurement requirements of various silicon material type testing at the semiconductor and solar energy level at present .
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Product
Compact Semiconductor ATE
QST286
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Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Product
Semiconductor Equipment Manufacturers
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Integrated Dynamics Engineering
With shrinking process geometries, new structural elements and a major increase in substrate size, the challenges to improving process yield and overall throughput have increased exponentially. These demands drive a stringent requirement for system stability and overall immunity from internal and external forces.
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Product
Semiconductor Test
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Tecap SPACE offers all the functions necessary to control test systems (ATE) for the semiconductor test. Tecap is hardware-independent and can be used with all customer-specific concepts.
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Product
Semiconductor
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PackageFunctionSMV(2.9mm*2.8mm)AND GateUSV(2.0mm*2.1mm)NAND GateFM8(5.0mm*4.5mm)NOR GateSM8(2.9mm*4.0mm)OR GateUS8(2.0mm*3.1mm)INVERTER
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Product
Substrate Thickness, Warp, and TTV Measurement
413 Series
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Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
