Product

Reflow / Wave Solder Process Dashboard

Vantage

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KIC Thermal

Vantage - KIC Thermal

Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.

Product

Solder Cup Connector Kit

Y1142A

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Keysight Technologies

Y1142A - Keysight Technologies

Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.

Product

Slides (Ball & Crossed Roller)

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Del-Tron Precision, Inc.

Del-Tron Precision, Inc.

Del-Tron’s linear ball slides and linear crossed roller slides offer engineers and designers the flexibility to choose the right linear slide technology for their application. Our ball slides and crossed roller slides offer several levels of precision ranging from a straight line accuracy of 0.0005” per inch of travel in our standard precision ball slides to 0.0000040” per inch of travel straight line accuracy in our high precision ball slides and crossed roller slides.

Product

3D Inline Solder Paste Inspection System

TROI 7700 SERIES

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Pemtron Co., Ltd

TROI 7700 SERIES - Pemtron Co., Ltd

Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.

Product

Solder Test Pallet

WaveRIDER® NL 2

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E.C.D.

WaveRIDER® NL 2 - E.C.D.

The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.

Product

3D Solder Paste Inspection system

PI Series

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Vi Technology

PI Series - Vi Technology

PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.

Product

Solder Paste Inspection

3D SPI

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Viscom AG

3D SPI - Viscom AG

Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.

Product

Surface Mount Ball & Socket Test Point

SMOX

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Oxley Group

SMOX - Oxley Group

SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.

Product

Standard DIP Socket with Solder Tail Bifurcated Contacts

Series 511

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Aries

Series 511 - Aries

Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.

Product

SparkFun Solder-able Breadboard

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SparkFun Electronics

SparkFun Electronics

This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.

Product

Ball Pressure Tester

4710

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Gigasense

4710 - Gigasense

The ball pressure tester is used to test the thermal properties of insulating materials. The test sample is placed in an oven and a steel ball is pressed against the surface. The impression of the steel ball is measured to see if it meets the requirements.

Product

Solder Paste Printers

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Shenzhen Leadsmt Technology Co.,Ltd

Shenzhen Leadsmt Technology Co.,Ltd

Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.

Product

UL1989, UL1418 535g 2 Inch Steel Ball

CX-02

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-02 - Shenzhen Chuangxin Instruments Co., Ltd.

UL1989, UL1418 535g 2 inch Steel Ball

Product

Soldering Test

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Aero Nav Laboratories, Inc.

Aero Nav Laboratories, Inc.

The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.

Product

Open-Frame Collet Socket with Solder Tail Pins

Series 518

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Aries

Series 518 - Aries

Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.

Product

Solder Wettability Tester

5200 Advanced

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Rhesca Co., Ltd.

5200 Advanced - Rhesca Co., Ltd.

This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .