Product

Solder Paste Inspection Machine

3D SPI

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Jet Technology Co., Ltd.

3D SPI - Jet Technology Co., Ltd.

The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

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Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

IEC60950 50mm Impact Test Balls

CX-15

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-15 - Shenzhen Chuangxin Instruments Co., Ltd.

The Impact Test Ball is a specially machined ball to test impact resistance according to IEC, CSA and UL Standards. It is made of chrome-plated-steel for durability, and is fitted with an eyelet to facilitate testing for pendulum applications. Eyelet is threaded to the ball to allow attachment of a handle or force gauge. Weights are closely controlled.

Product

Replacement 30" Matched Cable Set for Use with Dx10 HiTemp Solder Tip Leadset

Dx20-Cable-HiTemp

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Teledyne LeCroy

Dx20-Cable-HiTemp - Teledyne LeCroy

Replacement 30" matched cable set for use with Dx20 HiTemp Solder tip leadset

Product

Ball Pressure Test Apparatus

CX-Q03

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-Q03 - Shenzhen Chuangxin Instruments Co., Ltd.

The Ball Pressure Apparatus is used to check the integrity of dielectric materials by exerting 20N force. The BPA10 is called out in IEC 60335, 60950, 61010, UL, CSA and European Norms. It is used to check the integrity of dielectric materials by exerting 20N force. The Ball Pressure Apparatus is made of stainless steel for long life. Since accelerated life procedures are used for this oven test, more than one apparatus may be useful for parallel testing.

Product

LVDT Displacement Sensors With Ball Swivel Heads

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INELTA Sensorsysteme GmbH & Co. KG

INELTA Sensorsysteme GmbH & Co. KG

This LVDT Series is made for a rough, industrial use. The housing having a diameter of 20mm is fastened "floating" to the application using two ball swivel heads. There is a diversity of displacements up to 200m possible.

Product

Heavy Load Ball Screw with Caged Ball Structur

HBN

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THK America, Inc.

HBN - THK America, Inc.

Heavy Load Ball Screw with Caged Ball Structure. Heavy load ball screws with the caged ball structure (HBN model) drastically improve the rated load compared to the conventional products by utilizing the optimum internal structure for use in heavy load condition. In this model, the caged ball structure is adopted between balls to eliminate collisions and mutual frictions of the balls and improve the lubricant maintenance. This modification brings about a longer lifetime under heavy load conditions.