-
Product
System Level Test
SLT
-
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
-
Product
Asynchronous System Level Test Platform
Titan
-
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
-
Product
System Level Test and Burn-in Solutions
-
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
-
Product
ECM PCB Tester
MS 1105
-
*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
-
Product
±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
-
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
-
Product
SLT Socket
-
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
-
Product
Semiconductor Test
-
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
-
Product
Motion Simulator For Test Systems
Metis
-
METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
-
Product
Device Testing
S-TEST Lab
-
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
-
Product
Systems Integration for Circuit Card Assembly
-
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
-
Product
System Testing
-
TestOrigen Software Testing Services Pvt Ltd.
System testing is basically a sequence of various test performed to check the whole computer-based system. The key objective of system testing is to confirm the system level testing should meet the user’s viewpoint.
-
Product
DRAM Module Test
-
We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
-
Product
Distributed Test Manager
DTM
-
The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
-
Product
Dynamic Test Systems
H3TRB | HTGB (HTGS) | RTGB (RTGS)
-
Durability and reliability of wide-bandgap materials such as SiC and GaN are an important topic. The focus here is on new failure mechanisms whose effects are not visible with traditional H(3)TRB/HTGS – but which nevertheless have an influence on the real application.
-
Product
Photonics Module Test System
58625
-
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
-
Product
Radio Frequency, Communications, & Navigation Test Systems
-
Reduce testing time and costs with the Astronics radio test sets for use in military, avionics, and civil security industries.Available in commercial and military grades, these integrated test systems make it easy to develop test program sets and leverage them securely and instantly across all deployed testers at the factory, depot, and operational levels.
-
Product
VLSI Test Systems
-
50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
-
Product
Manual Test System for ICT & ISP with Integrated ABex and up to 426 Test Points
LEON Fixture
-
The LEONFixture is the ideal ICT and ISP solution for small and cost sensitive applications. This manually operated test system combines optimal ergonomics with high performance, durability and precision, ensuring your investment over the long term. The LEONFixture features a test system integrated in a manual base fixture. The system is designed to be used with an Ingun ATS MA13 insert which could be customized by a lot of fixture houses all over the world.As part of the LEON Family, LEONFixture is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
-
Product
In-Circuit Test System
TestStation LX
-
TestStation LX is a cost-effective in-circuit test solution providing high-volume electronics manufacturers with reliable, high-quality test for the latest printed circuit board assembly technologies.
-
Product
Conformance Test System
TS-RRM
-
The R&S®TS-RRM 5G and LTE test system is a test solution for running 5G NR and LTE inter-RAT RRM test cases for certification of wireless devices.It is a fully automated conformance test system for running validated RRM conformance test cases. In addition to the RRM test cases required by GCF/PTCRB, the R&S®TS-RRM also supports carrier acceptance specific RRM tests.
-
Product
Compact & Flexible Test Systems for FCT,ICT, ISP and Boundary Scan Designed for Easy Integration
LEON Rack
-
The LEONRack test system is a flexible test system that could be installed in automation or handling solutions. It is highly flexible and available in three different chassis sizes from low pin count to high pin count test systems. As part of the LEON Family, LEONRack is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
-
Product
HV Test System for Patient Monitors
-
HV test enclosure for testing medical products (patient monitors). Insulated test booth with large space for DUT.3 different test nests for adapting different devices.Displays from patient monitors are checked. For this, insulation tests and leakage current measurements must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
-
Product
Semiconductor Test System
TS-960e
-
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
-
Product
LTE RRM Test System
T4010S
-
The T4020S LTE RRM tester is the Keysight platform for LTE RRM conformance testing of LTE UEs. T4020S belongs to the Keysight LTE product family and, as the other LTE T4000S test platforms, is based on the T2010A LTE Wireless Communications Test Set.
-
Product
Flash Memory Test System
T5830
-
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
-
Product
VXI Digital Multiplier
4152A
-
The 4152A’s advanced features like limit testing, averaging, speed/resolution trade-offs, and fast function changes provide the high “test system” throughput required in today’s production test environments.
-
Product
NFC Conformance Test System
T3111S
-
The T3111S RIDER NFC Conformance Test System is the Keysight solution for RF Analog and Digital Protocol testing of NFC, EMV and ISO devices. The Test System is based on the Keysight T1141A NFC Test Set and it is complemented by the Keysight's or FIME's robots for accurate and repeatability RF testing. Selected 3rd party positioning robots can also be supported.
-
Product
Memory Test Systems
T5503HS2
-
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
-
Product
Battery Management (BMS) Environmental Test System
-
The BMS Environmental Test System is a configurable platform simulating the essential signals used by Battery Management Systems (BMS) and cell-monitoring modules with the ability to perform environmental testing on multiple BMS units simultaneously. The system implements single-point value testing to evaluate specific BMS functions such as cell over and under voltage scenarios, cell leakage current, lost communications, or faulty system IO.
-
Product
Memory Test System
T5833/T5833ES
-
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.





























