Inspection Systems
See Also: Inspection, Inspection Services, X-ray Inspection Systems, Automated Fiber Optical inspection Systems
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Product
Over-Line Vision Inspection System
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Over-Line vision inspection systems utilize a compact sensor head mounted directly over an existing production line to scan every object that passes underneath, in any orientation and at any belt speed, in order to generate a continuous stream of critical QA data, such as size, shape and color attributes, and production metrics such as throughput, uptime and capacity.
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Product
Industrial CT X-Ray Inspection System
X5000
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The X5000 is the most versatile system offered by North Star Imaging. The system boasts a large scanning envelope and excellent ergonomics for loading sizable objects while still maintaining the sensitivity to inspect even the smallest of items.
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Product
Magnetic Particle Flaw Inspection System
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This model can perform every kinds of magnetic particle flaw inspection in our unit. circular magnetization longitudial magnetization continuous magnetization, residual magnetization threading bar magnetization current induction magnetization, AC magnetization AC demagnetization DC magnetization, DC demagnetization.
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Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
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*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Product
Automatic Flight Inspection System
AT-950
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The AT-950 is the easiest to use and the fastet performing FIS available.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Product
Printed Circuit Board Inspection System
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NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
RFID Label Inspection System
Eurotech RFID FS
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The Eurotech RFID FS RFID accurately rewinds rolls of RFID labels and validates their receptivity by running them through the Voyantic Tagsurance RFID inspection system. The unit allows stopping at a predetermined editing spot for the removal and replacement of the defective piece, as well as indicating defective labels by a mark printed by an inkjet system integrated with the machine. Adjustment of the closed loop tension control system can be made through adjusting the parameters on the software that control the servo motor control system. This gives the customer a virtual infinite range with which to wind their labels without cracking the inlay or antenna. As well accurate web adjustment and guidance is provided with a web guide system complete with an ultrasonic sensor. The Eurotech RFID FS RFID label inspection system is equipped with the Voyantic Tagsurance for testing the performance of RFID tags. This is done by verifying that the tag responds to commands on its whole operational frequency range, which means testing the tag on multiple frequencies, also outside the RFID reader frequency. Accurate power output combined with the Voyantic Snoop Pro antenna, optimized for testing tags inline at high speed, allows defining precise acceptance criteria and achieving stable quality.
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Product
AXI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Product
For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Bulkflow X-Ray Inspection System
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Designed to be integrated into line with optional reject stations, the Bulkflow X-ray System is perfect for loose and free flowing products. Offering a good detection levels on a wide range of contaminants including all metal, bone, glass and dense plastics.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
Automated Optical Inspection System
506
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We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Product
Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
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*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Custom Made Transducers
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GB Inspection Systems have manufactured bespoke transducers for over 35 years, covering a wide range of applications.From simple contouring of delay line / wedges used on pipe testing or special compact housings to allow easier access to test areas, we can offer solutions for your specific applications.
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Product
Connector Inspection
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The USB Connector Inspection System features easy focusing with high resolution imaging. The system includes standard software that provides image display, image capture, digital zoom, auto calibration, and basic analysis tools. Pass/Fail analysis and reporting features are optional software features. The Inspection System scope is fully compatible with the FiberWarrior Pro OTDR as well as other FiberWarrior Pro test sets, providing a full fiber optic testing solution.
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Product
X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Product
In-Process Wafer Inspection System
7945
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Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
