Evolved Packet Core
LTE system core voice and data network.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-278
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 eDPRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 3 SATA(RAID 0,1,5)TPM2.0 supportWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
7th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-KL Series
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- 7th Gen. Intel® Core™ Proc- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
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The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
Micro Computer, Intel® Core
AIMC-3202
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Micro Computer, Intel® Core™ i7/i5/i3 CPU, H110, 2 Expansions, 250W 80Plus PSU. 1 x PCIe x16 and 1 x PCIe x4(1 x PCI for AIMC-3202-01) expansion slots. Compact design with front-accessible I/O.
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Micro-ATX Motherboard 12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-508
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Intel® Core™ 14/13/12th gen processors with H610E chipsetUp to 64GB DDR4 UDIMMs for data transferPCIe x16 slot Gen4, PCIe x4 slot Gen3, PCI slotNumerous expansion: 8 USB 3.2 ports, 6 USB 2.0 ports, and 10 COM
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
15.6" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
13th Gen. Intel® Core I7/ I5/ I3/ U300E P/U-Series 3.5" SBC
MIO-5377R
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13th Gen. Intel® Core™ Processor up to 14 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB, IBECC support by SKU4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2x LAN, 8x USB (incl. 1x USB4), 4x UART, 2x CANBus, 3x I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports Windows 10/11 LTSC & Ubuntu 22.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic Suite
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
Split Core Hall Effect DC Current Sensor
CYHCT-C2TV
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ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used for measurement of DCcurrent etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
AC/DC Split Core Current Sensor CT1000S
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This AC/DC split core current sensor is designed for measuring large DC and AC currents in applications such as electric vehicles, renewable energy systems, inverters, and motors. It facilitates high-current measurements by clamping around existing current connections. With its voltage output, this sensor is compatible with power analyzers (WT series and PX8000) and waveform measurement instruments (ScopeCorders and DLM series), making it a versatile tool for various high-current measurements.
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Product
Mini-ITX M/B Support 12th/13th Gen Intel® Core™ Processors, H610E, 3 X LAN For PPC-600
PPC-MB-620
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Supports Intel® 12/13th Gen Core™ i processor (LGA1700) with Intel Q670E/ H610E chipsetTwo 262-pin SO-DIMM up to 64GB DDR5 4800 MHz SDRAMSupports triple display of DP/HDMI/LVDSSupports PCIe x16 (Gen 5), 1 x M.2 M key & 1 M.2 E key, 6 USB 3.2Supports 2 x SATA 3.0 (Raid 0, 1) (only for PCH Q670E)Supports TPM 2.0Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
18.5" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-318SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
High-Performance Intelligent Pod for Corelis Boundary-Scan Controllers
ScanTAP 4 & 8
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Boundary-scan has proven itself time and again to be a truly versatile interface for structural test, embedded functional test, built-in self-test (BIST), software debug, and in-system programming. Supporting such diverse applications requires equipment with high-performance specifications and extended features.Corelis ScanTAP pods are designed for use with PCI-1149.1/Turbo and PCIe-1149.1 high-speed JTAG controllers. Featuring 4 & 8 independent Test Access Ports (TAPs), up to 80 MHz clock rates, and advanced TAP capabilities such as analog voltage measurement, the ScanTAP family of intelligent pods is the ideal JTAG interface for high-performance environments.
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Product
Ka-Band Silicon 5G Quad Core IC
AWMF-0108
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The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
12.1" Panel PC With 8/9th Generation Intel® Core™ I/Celeron® Processor
PPC-6121
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12.1" TFT XGA LCD panel with resistive touch control8/9th generation Intel® Core™ i/Celeron® processor (thermal power design: 35W)2 x 260-pin SO-DIMM DDR4 2666 MHz (max. 32 GB)1 x M.2 2230 (E key)1 x mSATA bay (SATA SSD + mSATA support RAID 0&1)1 x Optional TPM2.0 & 1 x Optional PCI/PCIe x4 expansion kit1 x Isolated RS422/485 (terminal block)1 x VGA and 1 x HDMI
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Product
Ultra-compact thermal imaging core
Dione 1024 CAM Series
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The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz.Dione 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional).Dione 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses (optional) provides a high level of tunability for optimal integration into many systems.The compact Dione 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.
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Product
11th Gen. Intel® Core U-Series I7/i5/i3/Celeron 3.5" SBC W/ MIOe
MIO-5375
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11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28WDual Channel DDR4-3200 up to 64GB4 simultaneous displays: LVDS/ eDP*, HDMI, DP, USB Type-C2 GbE, 4 USB3.1, CAN Bus, DC-in 12-24VExpansion: M.2 E-Key/B-Key/M-Key (supports NVMe) , MIOeSupports iManager, WISE-PaaS/RMM, SW API, and Edge AI Suite
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Product
Core Loss Tester
VCL
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Core loss testing has become most important test for quality assurance in Electrical industry. Core loss tester determines that whether a Core is damaged or not.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
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21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
LV Iron Core Motor Starting Reactors
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Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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Product
THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
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12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-M47H
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ADLINK IMB-M47H Industrial ATX Motherboard offers high computing performance with diverse I/O for industrial automation applications. It is the suitable choice for applications requiring real-time processing and high-level graphic capability.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279 A1
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
