Evolved Packet Core
LTE system core voice and data network.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron®, Intel® Q170, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS962-512-PoE
The IPC962-512-PoE meets the increasing requirements for maximum quality and flexibility in modern production plants. It features flexible expansion capacity, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control. This machine vision controller is powered by the LGA1151 socket 7th/6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® Q170 chipset. The IPS962-512-PoE comes with a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The real-time vision system PS962-512-PoE enables a fast and high accurate inspection to ensure that the desired quality is achieved with no manufacturing defects. It supports four IEEE802.3at PoE LAN ports and four USB 3.0 ports for connection with industrial cameras. Operating over a wide temperature range from -10°C to +55°C, the IPS962-512-PoE provides reliable and stable performance within severe environments. Its easy setup and compact design are ideal for space constrained environments. Moreover, one PCIe x16 and one PCIe x4 expansion slots allow quick installation of I/O cards and graphics cards. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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3U I7 Core 2.3 GHz CPCI Controller
GX7937
The GX7937 is a single-slot embedded cPCI 3U controller for use with Marvin Test Solutions' GX7300 PXI chassis. The GX7937 features a 2.3 GHz i7 Quad Core processor. When combined with the embedded storage peripherals of the GX7300 Series chassis, it is the ideal solution for an integrated, high performance PXI chassis / controller configuration.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LAN, 8 USB, 2 PCI Express Mini Card Slots
eBOX670-891-FL
The eBOX670-891-FL supports the 7th/6th generation Intel® Core™ i7/i5/i3 and Celeron® processors with flexible I/O configurations. This outstanding embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB. The eBOX670-891-FL provides high flexibility with reserved I/O module space on the rear side. The embedded system integrator can expand the system quickly and easily by installing suitable I/O modules. The fanless embedded box computer features wireless communication capabilities with two internal PCI Express Mini Card slots and one SIM card slot. Four Gigabit Ethernet ports are for customers who need mass data transmission or LAN port teaming functions for each virtual machine. For storage needs, it is equipped with one easy-access CFast™ socket, one mSATA interface, and dual 2.5” SATA hard drive bays with RAID 0&1 support.
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IP Cores
logicBRICKS IP Cores by Xylon - for applications including compact multilayer video controller, versatile video input, multiview 3D transformation engine, image signal processing (isp) ulstraHD pipeline, high dynamic range pipeline, scalable 3d graphics accelerator, DDR3 SDRAM Memory Controller, slave hssl controller, HDR image signal processing framework, video design framework for multi-camera vision applications, and more
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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Compact, industrial thermal imaging core
Dione 1024 OEM Series
The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 2 HDMI, DisplayPort, 4 GbE LAN, 6 USB, PCIe X4/PCI Slot And 9 To 36 VDC
eBOX700-891-FL
The eBOX700-891-FL is an expansion-rich fanless embedded system powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Kaby Lake) with the Intel® H110 chipset. It supports dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. This embedded box PC comes with a user-friendly mechanism design and offers great flexibility, reliability, and scalability, well suited for vision inspection (USB/PoE), motion control, security surveillance and industrial automation. The eBOX700-891-FL is designed with user friendliness in mind. Its heatsink top cover can simply be opened by unfastening the four screws for the access to the processor and DRAM. Moreover, its bottom cover adopts a convenient flip lid design along with easy-to-access brackets for securing the USB dongle and hard drive. Axiomtek has obtained patents, No. M511183 and No. M531115, for the special chassis design of the eBOX700-891-FL. Easy maintenance is one of the advantages we are offering to our customers and one of the main focuses of our product development. We will continue pursuing excellence and innovation in design and manufacturing.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB501
The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ MicroATX Server Board with 4 x DDR4, 3 x PCIe, 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-587
- LGA 1200 Intel® Xeon® W and 10th Gen. Core™ i9/i7/i5/i3 processor with W480E chipset- DDR4 ECC/Non-ECC 2933/2666/2400 MHz UDIMM up to 128 GB- One PCIe x16 and 2 x PCIe x4 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 22110/2280 (SATA / PCIe compatible)- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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PXI Embedded Controller i5, dual core, Windows 7
OTP2 module no.184
PXI offers the optimal approach to validation and production testing. You can meet timing, synchronization, and throughput requirements across devices. PXI is a robust PC-based platform for measurement and automation systems, supported by software. PXI combines PCI electrical bus characteristics with CompactPCI's modular Eurocard packaging, and then adds special synchronization buses and important software functions.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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ATX Motherboard With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® Q87, USB 3.0, SATA 3.0, Dual LANs, DisplayPort, VGA, HDMI And MSATA
IMB211
The IMB211 is industrial-grade ATX motherboard with a full-range of integrated peripherals for general industrial and embedded applications. The IMB211 is based on 4th Generation Intel® Core™ i7/i5/i3/ Celeron® processors in LGA1150 socket with Intel® Q87 Express chipset. Four 204-pin DDR3-1333/1600 slots provide a maximum memory capacity of 32 GB to improve overall system performance. This industrial-grade high performance motherboard also supports Intel® Active Management Technology 9.0 (iAMT 9.0), SATA RAID, and triple-display capability through DisplayPort, HDMI and DVI-I interface. The board helps users to deploy more responsive, high-performance, graphic performance systems for advanced communication, gaming, industrial and automation applications.
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X-Band Silicon Radar Quad Core IC
AWS-0105
The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, HDMI/LVDS And LAN
PICO512
The PICO512 is designed to support the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U. Coming with one 260-pin DDR4-2133 SO-DIMM socket supporting system memory up to 16 GB, the Pico-ITX motherboard also features a PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors for an additional I/O board/signals. It supports a 4K visual experience with dual display outputs through HDMI and LVDS. Pico-ITX SBC can withstand a wide operating temperature range from -20°C to +70°C.
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3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade
cPCI-6636(KL) Series
The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
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Shortwave Infrared Camera Core
Tau® SWIR
FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Split Core Hall Effect DC Current Sensor
CYHCT-C2TV
ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used for measurement of DCcurrent etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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Fanless Robotic Controller with Intel® Xeon®/Core™ Processor
ROScube-I
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
