Evolved Packet Core
LTE system core voice and data network.
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Product
Intel® 6th/7th Generation Core™ I3/i5/i7 Performance Embedded PC
EPC-B2205
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Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170/H110 chipset.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of VGA/DP/DVI.One expansion slot (low profile).Two Shock Resistant 2.5" drive bays.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
12.1" Fanless Panel PC With Intel® Core™ I5-7300U Processor
PPC-412
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12.1" XGA TFT LCD with resistive touchscreenIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system design1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3 x Independent displays1 x M.2 bay (2242) for storage only and support SATA RAID 0/1No RED CertificationSupports VESA 75 mounting interface
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Product
3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
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The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
Modular TPC - Computing Box Module With Intel® Core™ Processors (10th Gen)
TPC-B610
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High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design6 x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR4) support up to 64GB in totalComprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
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The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Product
Double DDS Core
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AllWin Instrument Science and Technology Co., Ltd.
1. Double DDS core,high accuracy and high stability2. Store more than 20 kinds of waveforms3. Frequency range: 1 Hz~120 MHz
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
21.5" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-321W TGL
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Industrial-grade 21.5" LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
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The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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Product
Thin Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, HDMI, LVDS, VGA, USB 3.0, M.2 And Dual GbE LAN
MANO521
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The MANO521 is a thin mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake) with Intel® H310 chipset or optional Intel® Q370 chipset. This Intel® Coffee Lake-based motherboard provides rapid video acceleration advantage, multiple expansion interfaces and triple-view capability. It is designed with rich functionality, solid performance in a small footprint, making it suitable for a broad range of performance-driven embedded applications such as industrial automation, transportation, self-service kiosks, medical, and digital signage. The MANO521 features two high bandwidth 260-pin DDR4-2400/2666 with a memory capacity up to 32GB. It offers two SATA-600 sockets and one M.2 Key M 2242/2260/2280 connector for storage. The thin mini-ITX motherboard also provides various expansion interfaces within its limited dimensions including one PCIe x4, one full-size PCIe Mini Card slot and one M.2 Key E 2230, which offers diversity and flexibility for application integration. Moreover, the mini-ITX embedded board has a built-in DC Power Jack or ATX connector supporting 12V and 19 to 24V DC input with AT mode auto power function.
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Product
Expandable ROS2 Robotic Controller With Intel® 9th Gen Core Processor
RQI-53/55/57/58
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ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
802.1 Core Test Software
IOL vIOLett®
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The same tool used for testing everyday in the UNH-IOL Ethernet Switching Protocols (ESP) Testing Services is now available to use in your own labs. See the below list of available testing packages. Each test package contains a complete set of tests for use with IOL vIOLett® Software, which is included with any test package license.
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Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
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The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
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Product
BACnet Packet Capture And Protocol Analyzer For MS/TP
BACTrace
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The multi-pane user interface shows captured packets in several different kinds of detail. The upper pane displays a quick summary of received packets, each of which is identified by number. The MS/TP frame type, destination and source MAC addresses are shown, as well as a timestamp in milliseconds. For APDUs, the BACnet service is also shown.
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Product
THIN 1U Embedded PC - Intel® 13th/14th Generation Desktop Core™ I3/i5/i7
EPC-T228A
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Thin design with 44.2mm in height.Support Intel® 13th/14th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
12-Bit, 20MS/s, 8/4-Ch AI Platform With Intel® Core™ I5/Celeron® Processor
MIC-1842
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8 x Simultaneously Analog Inputs, up to 20 MS/s, 12-bit resolutionSupports digital and analog triggers32-ch TTL digital I/OOnboard FIFO memory (16 K samples)2 x RS-232 ports2 x 10/100/1000 Base-T RJ-45 LAN ports2 x USB 2.0 and 2 x USB 3.0 portsiDoor expansion supported
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Highly Scalable Gaming Platform Based on 10th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD
ADi-SA3X-CL
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ADLINK‘s ADi-SA3X-CL all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with 10th Generation Intel® Core™ processors, the ADi-SA3X-CL provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® UHD Graphics 630/610 supporting up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA3X-CL fully satisfies the needs of your gaming application. The ADi-SA3X-CL is a true application-ready gaming platform providing OEMs with a highly flexible and reliable all-in-one system that offers unparalleled portfolio of services that help developers save time and pass compliance. The platform is designed to meet the GLI- 11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements.
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Product
Versatile All-In-One Medical Panel PC Family With 12th/13th Generation Intel® Core™ Processor Performance
MLC-S Series
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- Powerful 12th/13th Gen Intel® Core™ i3/i5/i7/i9 processor- 21.5’’or 23.8’’ full HD display with PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities- 7 illuminated soft-touch function keys on the front glass- Edge-to-edge glass surface and patented screwless design allow for easier and faster cleaning and disinfection procedures- Fully sealed aluminum housing and fan less design for high hygienic standards with IP54 rated ingress protection and antibacterial treatment- PCIe x16 internal expansion slots for storage, networking and processing cards
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Product
ATE Core Configurations
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ATE Core Configurations streamline the design, procurement, and deployment of automated test systems with highly integrated mechanical, power, and safety system infrastructure. These off-the-shelf systems reduce lead times and simplify standardization and global deployment. Lower your total cost of ownership for your test systems with ATE Core Configurations.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione S 1280 CAM Series
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The Dione S 1280 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution and NETD of less than 40 mK (available upon request) and 50 mK.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 1280 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 1280 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M34/M45 lens (optional).The ultra-compact Dione S 1280 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
7th & 6th Gen. Intel® Core™ U-Series (I7/i5/i3/*Celeron®), 3.5" SBC W/MIOe
MIO-5272
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7th & 6th Gen. Intel® Core™ U-series (i7/i5/i3/*Celeron®)Dual SO-DIMM slots support up to 16GB memoryMulti-Display: VGA + HDMI 1.4 + LVDS (48bit)Expansion: 2x Full-size miniPCIe slots (one for mSATA), MIOe connector for I/O extensionDual GbE, 6x USB, 2x COM, SMBus/I2C, GPIO, TPM (optional)Supports Windows 10 LTSC & Ubuntu 20.04 LTS, embedded software APIs, WISE-DeviceOn
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Product
Intel Core Ultra Processors (Code Name: Panther Lake)
MIO-5381
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Intel Core Ultra Processors, up to 14 Cores, TDP 28W/15WDual Channel DDR5-7200 up to 128GB, with IBECC support4 simultaneous displays: eDP + 2x HDMI + USB-C with DP Alt.2x LAN, 6x USB (incl. 1x USB4), 4x UART, 2x CAN-FD, 8bit GPIO, I2C(*SMBus)4x M.2 Expansions: E-Key 2230, B-Key 3052, 2x M-Key 2280Supports Windows 10/11 LTSC & Ubuntu 24.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic SuiteSupport EdgeBMC for OOB(Out-of-Band) remote control management
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
6 Motors Core Alignment Fiber Fusion Splicer
SH-FS170+
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Shenzhen Sharingtek Communication Co., LTD
♦Based on the principle of PAS(Lateral Projection System), adopt advanced image detection algorithm .♦ Double core align structure, higher success rate of fusion and lower loss;♦Adopt 4.3 inches 16:9 TFT colorized LCD screen;♦Typical fusion time: 9sec; fast time: 7sec♦Typical heating time: automatic v-shaped heat shrinkable 9 seconds, cover and automatic heating;♦Reliability design, strengthen shockproof, dust proof and other functions;♦Low power consumption design makes it possible to work long time with many functions operate at the same time;♦Multi-functional, small-sized, portable, can greatly improve working efficiency;♦Can detect the air pressure, temperature and humidity and other environmental factors and automatically calibrate arc.♦Removable plug the battery, convenient and quick charge;♦Concerning, the straps can be used for aerial work.
