Evolved Packet Core
LTE system core voice and data network.
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Product
Network Packet Brokers
Vision E40 / E100
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Keysight Network Applications and Security
These new cost-effective and scalable solutions help IT teams supporting hyperscale and microscale data centers, resolve application performance bottlenecks, trouble shoot problems, and improve data center automation, as well as better utilize network analysis and security tools. Today’s hyperscale data centers, which are designed for expansion, as well as micro data centers, which often sit on the network edge closer to end users for an improved experience, can create significant challenges for IT organizations. These challenges range from poor network performance due to increasing size and complexity, to security issues resulting from insufficient visibility into incident detection and resolution. Many IT organizations use multiple network monitoring tools, and need to efficiently transport network traffic from thousands of network locations. Ixia’s solutions for highly scalable and expanding data centers. Ixia’s Vision portfolio of NPBs provides intelligent, sophisticated, and programmable network flow optimization, delivering comprehensive visibility and security coverage. The new Vision Edge 40 and Vision Edge 100 offer real-time visibility, insight, and security into high density hyperscale and microscale data centers, even as they expand. Each is capable of inline and out-of-band deployments, and delivers control, coverage, and performance to protect and improve crucial networking, data center, and cloud business assets.
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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Product
Slim And Light All-In-One Medical Panel Computer Family With 11th Generation Intel® Core™ Processor Performance
MLC-M Series
Panel PC
MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor (Tiger Lake), providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
Medium Voltage Iron Core Oil-Immersed Shunt Reactor
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Iron core Oil-immersed Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
40Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
40Gbps QSFP+ & 10Gbps SFP+ ports, Support optical & copper transceivers, Wire-rate performance on all ports, Compact & Portable, Intuitive Graphical Control Interface, Control multiple units from single GUI, Test Automation with TCL interface
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
Windows 10 IoT Core Services
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Long-term OS support and services to manage device updates and assess device health
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Product
Core Fusion Splicer with Dual Observation
STC-OFS701H
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Shanghai Stone Communication tech Co., Ltd
The smallest Core to core fusion splicer with dual observation Weight 1.2kg only 3.5 inch TFT color LCD monitor with X & Y view simultaneously Fiber core can be displayed clearly with large magnification Alignment mode: Core, cladding and manual alignment 9 seconds splice time and 30 seconds heat time Friendly operation interface and smart menu Operation with Max wind velocity of 15m/s Operation with max 5000m above sea level Typical 120 cycles with battery
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784227-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
400/5A CHEAP SPLIT CORE CAST RESIN CURRENT TRANSFORMER
LZCK310-10
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Beijing GFUVE Electronics Co.,Ltd.
LZCK series outdoor waterproof current transformers are applicable for AC power system 35kV and measurement of current of power supply equipment below 10KV also can be used for microcomputer protection. This type of current transformer employs imported silicon steel which with high permeability as magnetic material, has the characteristics of Small magnetic circuit loss and can be split, its semicircular core and secondary windings employ high quality epoxy resin vacuum, casting in plastic-case(ABS or PC) which is flame retardance anti-moisture, stable performance, no maintenance.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Connector Core Tuner Machine
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Anfkom International Co.,Limited
Fiber optic connector active link connection loss caused mainly by the following aspects:1.Fiber core2.Horizontal mismatch3.Vertical mismatch4.Axial mismatch
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Product
Expandable ROS2 Robotic Controller With Intel® 9th Gen Core Processor
RQI-53/55/57/58
Robotic Controller
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
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Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Product
Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-SL
Gaming Platform
- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3086
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ntel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)12~24V DC input power rangeSupport Advantech I Door module
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, DisplayPort, LVDS And 2 GbE LAN
PICO51R
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The PICO51R is powered by the 7th generation Intel® Core™ i7/i5/i3 or Celeron® processor (code name: Kaby Lake). With the onboard CPU attached on the rear side of the board, the PICO51R can aid the heat-extraction process to make fanless design possible and make system integration fast. The pico-ITX embedded board also provides practical expansion interfaces within its limited dimensions including one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. This powerful 2.5-inch Pico-ITX embedded motherboard is designed for minimum maintenance and maximum ruggedness. In addition to two USB 3.0 (USB 3.1 Gen1) ports in support of industrial cameras for machine vision applications, the PICO51R also comes with an M.2 Key E slot for wireless communication capabilities and two Gigabit Ethernet ports for mass data transmission or LAN port teaming functions.The Intel® Core™-based PICO51R supports one 260-pin DDR4-2133 SO-DIMM for up to 16GB of system memory. Moreover, the pico-ITX single board computer utilizes Intel® HD graphics engine to bring a true high definition visual experience with dual display configurations through DisplayPort and 18/24-bit single/dual channel LVDS. In addition, this industrial motherboard can withstand a wide operating temperature range from -20°C to +60°C (-4°F to 140°F) for use in rugged and harsh environments.
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Product
Iron Core Current Limiting Reactors
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Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
