BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Test Fixture Kits
More then ten years of experience in special, customized engineering and manufacturing brought us to the highest level of creating reliable, flexible and robust Test Fixtures. Currently our HQ is located in Vecsés, Hungary together with our R&D. Equip Group has Test Fixture Kit manufacturing plant in Serbia, focusing on supplying competitive, high – quality and high – volume products for the global market.With more then 180 employees, Equip – Test is able to offer our customers turnkey solutions in fixturing with test program generation. No matter if you have a simple or complex, high-density PCB (Printed Circuit Boards), or if you have DUT (Device Under Test) already assembled into metal or plastic housing, we can offer you a very stable technical solution.
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Polyphase Socket Tester
K-281
Knopp’s K-281 Polyphase Socket Tester is designed to detect backfeed conditions, grounds, short circuits and wiring errors in either a 120/240, 120/208 or 277/480 volt meter socket. It is equipped with high intensity Power Lights and Fault Lights to show whether or not the meter is safe to set. The Polyphase Socket Tester also comes with a heavy duty handle for quick and easy installation.
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Socket Phone
Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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PCI Express 4.0 Test Platform
The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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IEC60065 Fig11 Australia UL Plug Socket Tester Socket Outlet Torque Tester
CX-CTN
Shenzhen Chuangxin Instruments Co., Ltd.
The plug torque tester conforms to the standard of IEC60065 figure 11. It is used for checking whether the mechanical stress which occurs when the Direct Plug-in Equipment with plug pin normally insert into the socket is in the required range.
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Scienlab Battery Test System – Pack Level, 110 KW Compact Version
SL1710A
Compact solution for testing Battery Packs with output power up to 110 kW and voltage range up to 1500 V
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BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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High Throughput Test Platform for Multi-Site & Index Parallel Applications
ETS-88
The ETS-88 is an optimal test platform for testing a wide variety of devices including: simple analog, high precision, high voltage, high current / power, automotive, video, audio, complex mixed-signal, as well as emerging power processes like SiC and GaN.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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6TL10 Table Top Test Base
H71001000
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettes.The platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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Custom Test Connectors and Sockets
Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Socket Tester c/w Buzzer
DL1092
Clear visual and audible indication RCD test of 30 mA RCD (max time 300 ms) Touch voltage to check for extraneous voltage on earth Compact, durable design in compliance with BS EN 61010
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Military Communications Test
Astronics testers for military radios and wireless communications systems help you keep your most critical communications up and running smoothly. Write test program sets once and deploy them instantaneously everywhere – whether your test set is in the factory, at the depot, or in operation.
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RSE Wireless EMC Spurious Emission
TS8996
The R&S®TS8996 RSE test system is designed for EMI and radiated spurious emission testing on wireless devices in semi-anechoic or fully anechoic chambers. The modular design makes it easy to extend the system to include new communications technologies. Typical devices under test include mobile phones or radio sets along with radiated measurements of other short-range devices. Standards require a wide range of test setups and a wide and high frequency range (up to 40 GHz). ESW or FSW frequency ranges are extended up to 325 GHz with option B21 using receive units TC-RSE for 5G FR2. Dedicated RSE test routines are also covered for this frequency range.
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Compact & Flexible Test Systems for FCT,ICT, ISP and Boundary Scan Designed for Easy Integration
LEON Rack
The LEONRack test system is a flexible test system that could be installed in automation or handling solutions. It is highly flexible and available in three different chassis sizes from low pin count to high pin count test systems. As part of the LEON Family, LEONRack is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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High Temperature Component Test Fixture
16194A
Measure both axial/radial leaded devices and SMD within the temperature range from -55 to +200°C.
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TEST SOCKET
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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240V Socket Tester Check Plug
CP501
The most popular socket tester available - detects 28 fault conditions.
A quick and easy way to ensure that 13A sockets are correctly wired, indicated by 3 bright long life LEDs.
Wiring faults are indicated by one or more of the LEDs failing to illuminate, with the pattern of lit LEDs indicating the type of fault detected. This fail-safe system means that any LED not lit indicates a fault. The robust ABS housing has a sculpted shape for easy removal and there is a look up chart on the tester for quick fault diagnosis.
The plug induces less than 5mA of earth leakage, well below RCD trip thresholds.
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Three-Phase Smart Socket
WECO 3230
Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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Display Driver Test System
T6391
High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Meter Socket Logger
PM2000
The PM2000 Meter Logger (USA only) is a 5-channel data logging system built into an electric meter housing. It is ideal for responding to residential voltage complaints and power consumption problems.
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Socket Tester with RCD Tripping
Shanghai Beha Electronics Co., Ltd.
*Mains wiring polarity check.*ELCB/RCD testing.*Measuring ear for line current.*Measuring ear for leakage current.*Helps calculate insulation resistance.*Helps calculate power consumption.*Helps fault finding of standing earth fault.*Fused main adapter.*Appliance testing (with the ad of a clamp meter).
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Socket Outlet Tester
Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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JEDEC TO Collet Socket
Series 514
TO Collet Sockets. Aries TO sockets feature molded chamfer lead-ins for easy device insertion. High stand-off design for heat dissipation and easy cleaning. External polarization for positive location.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
