Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Burn-In Test
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C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Test
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Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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Burn-in Environmental Test Chamber
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Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's High Temperature Aging Chamber is widely applied for automotive parts ,electronic and electric products ,components and materials by constant high temperature reliability test.
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Burn-In System
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The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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GFCI Socket Tester
TEL5
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Standard Electric Works Co., Ltd
● Fast, easy wiring check.● Easy to read light indication.● Confirm the correct wiring of AC socket.● Test GFCI for correct wiring & operation.● Detect 5 wiring faults.● GFCI circuit trips to confirm the tester is working.● The testing current for GFCI is about 8mA.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
Plug and Socket Gauges
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Shenzhen Chuangxin Instruments Co., Ltd.
The plug and socket gauge is designed according to BS1363-1 and BS1363-2 standard.
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Electric Burn-in Board Carts
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Conforms to SEMI ergonomic standards Holds and transports card cages for semi-automatic loading/unloading. Holds up to 10 burn-in boards. Raises and lowers the burn-in boards for easy loading/unloading of boards into ovens or onto test benches. Cart can be adapted to dock with any Micro Control oven.
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RF Bias Burn-In System
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These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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Camera Module Socket
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Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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RF Burn-In Services
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Innovative Circuits Engineering, inc
There are many burn-in services that we offer such as HTOL, RFBL, ELFR, LTOL, etc and our focus on quality and customer service when providing burn-in custom solutions is second to none. We work closely with our customers to make sure we provide them with the best possible burn-in regardless of their lot size or pin count. We can also provide you with other electrical stress tests such as THB and HAST, and we can provide you with comprehensive status reports for your tests as they progress whether they be burn-in, THB, HAST or any other test.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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JEDEC TO Collet Socket
Series 514
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TO Collet Sockets. Aries TO sockets feature molded chamfer lead-ins for easy device insertion. High stand-off design for heat dissipation and easy cleaning. External polarization for positive location.
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Test Socket Lids
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For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
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USB SOCKET TESTER
MDPPTSTUSB
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*Provides the user with a simple way to test a USB socket on a vehicle*Mini probe will light up when 4.4V - 5.25V is detected
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Laser Diode Burn-in Reliability Test System
58604
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The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Product
Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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GFCI Socket Tester
ST120
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The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Memory Burn-In Tester
H5620/H5620ES
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As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
