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System Level Test and Burn-in Solutions
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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SLT Socket
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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ECM PCB Tester
MS 1105
*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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Motion Simulator For Test Systems
Metis
METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
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Distributed Test Manager
DTM
The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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Compact Antenna Test Range
700.00 MHZ – 110000.00 MHZ
A Compact Antenna Test Range (CATR) allows electrically large antennas to be measured at a significantly shorter distance than would be necessary in a traditional far-field test range. Compact ranges use a source antenna (feed) to radiate a spherical wave in the direction of a parabolic reflector, collimating it into a planar wave for aperture illumination of a Device under Test (DUT). It's lowest operational frequency is determined by the size of the reflector, its edge treatment and the absorbers. The two edge treatments available are serrated edge for general purpose applications, and rolled edge to achieve higher accuracy for special applications. Multiple-feed systems may be used to improve the far-field characteristics. A compact range test system also allows system level testing of a complete device architecture.
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DRAM Module Test
We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
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System Level Test
SLT
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Asynchronous System Level Test Platform
Titan
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Device Testing
S-TEST Lab
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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Test & Test Development for Circuit Card Assembly
Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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CPE Design Verification System
Jupiter 310
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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BMS Manufacturing Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Mini LED Backlight Module Automatic Optical Test System
7661-K003
Chroma 7661-K003 Mini LED Backlight Module Automatic Optical Test System contains a 71803-2 2D color analyzer to measure chromaticity and brightness
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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ESS Performance Test System
The Energy Storage System (ESS) Performance Test System is used to evaluate, test, and certify the performance of energy storage systems up to 2MW. The system is a configurable platform with over 200 channels of simultaneously measured AC and DC voltages and currents, environmental temperatures, airflow, and communications. Intuitive software provides real-time monitoring and analysis of power, energy and efficiency to adhere with industry standards. The test system interfaces hardware such as load banks, and controls the ESS to simulate utility applications such as peak shaving and frequency regulation.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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NI Vehicle Radar Test System
VRTS provides automated radar measurement and obstacle simulation capabilities for 76 to 81 GHz automotive radar systems. With VRTS, you can perform precision RF measurements and simulate a wide range of test scenarios for radar hardware and software subsystems, including sensors, advanced driver assistance systems (ADAS), and embedded software. Use VRTS for all phases, from design to manufacturing, of ADAS and radar system test.
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Laser Diode Reliability Burn-In / Life-Test System
58602
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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Semiconductor Test Software
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
