Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
29MP Ultra-High Resolution Forensic Camera
SceneScope RUVIS 29MP System
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The SceneScope RUVIS 29MP is an Ultra High Definition camera based on a 29MP sensor with 6644 x 4452 pixel resolution, and a full-frame chip. It includes capture software with 3 user-selectable modes: Fast Viewing for placement, Focus on the evidence, and High Detail for Capture at High Resolution and High Dynamic Range.
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Product
RF Power Generators
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MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Product
PCIe Gen 4 Switch Adapter
P411W-32P
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The Broadcom P411W-32P is the industry’s first fully managed Gen 4.0 NVMe switch adapter, providing enterprise class options for NVMe solid state drive (SSD) attach requirements. The P411W-32P leverages Broadcom’s world-class board design, PEX88048 PCIe Gen 4.0 switch chip, and solid firmware expertise, to provide advanced features not available using traditional NVMe drive attach methods. Similar to Broadcom HBAs, the P411W-32P adapter is supplied with fully validated and supported firmware and standards based out of band manageability features.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V16GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Product
Automated Programmer Superpro Sb05
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※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Programming on-chip flash in your processor
XJDirect
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XJDirect is an advanced and innovative method for programming the internal flash of your processor and implementing some aspects of board test through JTAG when traditional boundary scan techniques cannot be used.
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Product
Inductor Test & Packaging Machine
1870D
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The Chroma 1870D Series (1870D/1870D-12) are specifically Designed automated test equipment for chip inductors. It comprises Various test functions that are required for verifying chip inductors. In addition, an automated tape packaging machine at the end of production line is equipped to fulfill demand for automated manufacturing.
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Product
UV Sensors
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With analog (4-20mA, 0-5V, 0-10V) or digital (USB, Modbus) output, also available with Android device (incl. app). SiC photodiode chip based Broadband UV sensitivity or filtered for UVA, UVB, UVC or UV-Index spectral sensitivity. Our sensors are also available with logarithmic signal transduction, linearity from 0 … 1500 mV. Calibration services available at our Berlin facility prior to delivery and after use
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Product
On-Chip Debugging Emulator
E2 Emulator
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The new E2 emulator is an advanced on-chip debugging emulator and flash programmer developed based on a concept of "improvement of development efficiency". The download speed is up to twice as fast as the E1 emulator. Moreover, new solutions contributing to reduction in development time will be available.
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Product
Phototransistors
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Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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Product
Digital Mission Engineering
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From chip to mission, connect modeling and simulation efforts across all phases of the engineering product life cycle. Model multi-domain operational environments, including land, sea, air and space, with accurate, dynamic, physics-based simulations. Integrate with the Ansys portfolio of multi-physics tools and solvers to achieve unmatched end-to-end modeling and simulation.
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Product
NVM Express
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NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Product
PIN Limiter Diodes
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Macom Technology Solutions Holdings Inc.
MACOM’s PIN limiter diodes provide excellent broadband performance from 1 MHz to 20 GHz and higher for receiver protector circuits. Our PIN limiter diodes are available in die form, plastic and ceramic packaging. Our ceramic packaged diode series is ideal for waveguide, coaxial, and surface mount applications, while our die diode series is well suited for chip and wire high frequency microwave applications.
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Product
OpenVPX SBC
SBC347D 3U
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The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
DIP Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
Capacitors - High Q MNOS Series
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Macom Technology Solutions Holdings Inc.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss due to our use of nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs high Q MNOS series of capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long term stability.
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Product
Arduino CAN Shield
IFB-10003-AWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L4GN16-SGH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
6U VME 1/10/40 GbE Switch
ComEth4070e
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The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
Low Light USB Camera With Microphone
Conversa
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Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Product
Video Signal Generator
MSPG-6100L
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MSPG-6100L is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV9NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc. bad program to protect a person under age through the regulation grade.
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Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Product
SparkFun ESP8266 Thing
Dev Board (with Headers)
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This is the SparkFun ESP8266 Thing Dev Board --- a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors or automate coffee makers. With an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any internet-connected project. To top it all off, the ESP8266 is incredibly easy to use; firmware can be developed in Arduino and uploaded over a simple serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins with pre-soldered headers, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Product
32GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V32GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
