Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Chip-Type Attenuators
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Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
Rectifier Diodes
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Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Phototransistors
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Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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High-Speed Digital Output
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High-speed digital output photocouplers (optocouplers) are optically coupled high-speed, totem-pole output isolators containing a GaAlAs LED on the input side and a photodiode and signal processing circuit on the output side in a single chip.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
96/48-CH Opto-22 Compatible PCI Express Digital I/O Cards
PCIe-7248/7296
Digital I/O Module
ADLINK"s PCIe-7248/7296 are high-density parallel digital I/O boards with 96/48 I/O channels. The header connectors are fully compatible with industry Opto-22 standard. Thus, PCIe-7248/7296 can utilize the Opto-22 external devices. The PCIe-7248/7296 devices emulate mode 0 of the industry standard 8255 programmable peripheral interface (PPI) chips. The PCIe-7248/7296 provides 4/2 PPI chips respectively. Each PPI offers three 8-bit ports: Port A, Port B and Port C. The Port C is divided into 2 nibble-wide (4-bit) ports. The PCIe-7248/7296 devices have programmable timer/counters. One 16-bit counter is available for event counting, while the other 32-bit timer is available for timed interrupt generation. The PCIe-7248/7296 devices provide multiple programmable interrupt sources from DIO channels, as well as the output of the timer.
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Infiniium Oscilloscopes
Z‑Series
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The Infiniium Z-Series delivers this and more with its RealEdge technology enabling 63 GHz of oscilloscope bandwidth and superior signal integrity. The Z-Series takes advantage of indium phosphide chip technology and custom thin film packaging to give you extremely low noise, low jitter, and high effective number of bits. These technologies allow you to see the true representation of your signal.
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UV Photodiodes
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Active area from 0.06 mm² to 36 mm² and quadrant photodiodes for position detections. Spectral response for broadband UV or filtered for UVA, UVB, UVC or UV-Index. Various entrance optics and housings options available (TO or SMD). Our own SiC photodiode chip production since 2009 also available with VUV sensitivity. PTB (German equivalent of NIST or NPL) measured high radiation hardness. 350°C high temperature stable photodiodes available. Photodiode application guide.
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Integrated Potentiostat and Multiplexer
EmStatMUX8
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Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode.
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Arduino CAN Shield
IFB-10003-ANP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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IR Linear and 2D Sensor Array Modules
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Excelitas offers Linear and 2D IR Imager Arrays based upon our Thermopile Technology. All Arrays are provided as plug-and-play Modules featuring a sensing chip, robust metal housing with focusing lens, a PCB with microprocessor for calibration and bus interface and a quick connector for streamlined plug-and-play integration. We offer 8-pixel, 16-pixel and 32-pixel Linear IR Imager Array Modules for field-proven effectiveness in scanning presence detection, non-contact temperature measurement, smart-home products, and office electronics. Custom solutions also available upon request.
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EMV Training
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Barnes regularly provides EMV chip card implementation training and hands-on chip consultancy for both business and IT personnel. Whether migrating to chip cards for the first time, introducing new personnel to chip technology or implementing a new chip product, it is important that key staff receive a thorough grounding in the technology and the way it impinges on other aspects of the business.
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Data Loggers
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Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it.
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Product
O2/N2 Analyzers
GNL-2100 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-2100 analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation.
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Product
8G SO-DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-SD5V8GN56-SCH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Intelligent Power Switches
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ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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8G DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-D5V8GN56-SCH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Microelectro Mechanical Systems And MEMS Sensors
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NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
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X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
