3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
Specialist Inline Inspection
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NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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Product
Automated X-ray Inspection (AXI)
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Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Product
Analytical Gear Inspection Machine for Workpieces Up to Ø 6,000 mm
KNM X series
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machine structure with outstanding intrinsic accuracylarge bearing distances of guidesinherently stable granite machine base on active dampers to absorb vibrations ? no foundation requireddrive system close to center of gravitylinear motors in X-, Y-, Z- measuring axeshigh precision air- or hydrostatic bearing rotary tables (diameters from 500 to 1,800 mm) with direct drive and through holemotorized positioning of measuring column (V-axis) to the actual workpiece diameterlaser based system for safe operation
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Product
3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
contact/non-contact portable 3D measurement system
ScanArm
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The FARO ScanArm combines all of the advantages of the FaroArm with a hand held laser scanner and is the perfect contact/non-contact measurement system. Unlike other scanning systems, the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data — all in one simple tool.
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Product
PDP Driver/Function Inspection System
SRV
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*Greatly Reduced Testing Tact Time*Cutting-Edge Inspection*Easy Operation
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Product
Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Product
*Micro-fluoroscopic X-ray Inspection System
Cath-X
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The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Product
Handy Scan 3D
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The truly portable metrology-grade 3D scanners delivering highly accurate measurements.Truly portable and faster than everMetrology-grade accuracy and resolutionUser-friendly and easy to use
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
A Compact X-ray Inspection System, The MedaScope™ Desktop
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A compact X-ray machine weighing only 55 pounds, the MedaScope Desktop is easy to carry and can be set up rapidly. Glenbrook’s MedaScope Desktop is a portable, compact manual system for real-time, magnified x-ray screening of packaged devices including medical devices, electronics, and cables.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Product
Automated CMM Calibrated for High-Production Shop Floor Inspection
CMM Master
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The CMM Master provides process control by delivering optimal price and performance to your application. The system brings highly repeatable, thermally insensitive, versatile, and programmable inspection to the shop floor.
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Product
Thickness and Flaw Inspection
FOCUS PX / PC / SDK
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Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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Product
Detailed Stereo Image Analysis with 3D Visualization
StereoScope Pro
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StereoScope Pro is a real time stereo field analyzer with multiple views and MIDI/automation output capabilities. It is a powerful help to analyze how the audio signal is spread in the stereo field, and you can easily detect potential phase and mono compatibilities issues.
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Product
9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
D-Sub Male Connector
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
Solar Power Plant Inspection Service
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We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Product
3D Measurement Arm
FaroArm
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The FARO Focus3D is a high-speed 3D laser scanner used for generating point clouds and capturing detailed 3D images for documentation purposes.
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Product
Automatic Flight Inspection Systems
AT-940
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The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Verification And Print Quality Inspection Solutions
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Integrate quality barcode verifiers within your production line using our robust barcode verification technology.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
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The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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Product
Standard & Top Paint Inspection Gauges
121/4
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is a hand-held paint gauge that offers a quick, versatile method of coating examination and measurement in a portable, easy-to-use format.
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Product
Sensor for Filament Inspection
EyeFI
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EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
