3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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3D Measurement Arm
FaroArm
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The FARO Focus3D is a high-speed 3D laser scanner used for generating point clouds and capturing detailed 3D images for documentation purposes.
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Solderability Tester
MUST 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Protective Inspection Kit for Hazardous Areas
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The kit provides all the tools required for the on-site inspection of a coating, including surface profile, dewpoint, relative humidity, both wet and dry film thickness and also adhesive testing.Measurement parameters include:Surface inspectionSurface profileSurface contaminationClimatic conditionsCoating thicknessAdhesion
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Video Inspection Station with Measuring
VIS310
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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X5 XL800 X-Ray Inspection
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Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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Solder Wettability Tester
5200TN
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Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Fiber Optic Inspection
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Optical Wavelength Laboratories
A dependable connector endface inspection scope is a vital part of any fiber optic professional’s tool kit. Inspecting patch cord connector endfaces before attaching them to equipment or patch panels saves time and effort, and ensures a clean, quality connection. These 400x video inspection scopes allow users to view connector endfaces on a PC or laptop screen, preventing harmful invisible light from entering the users eye, and ensuring maximum eye protection.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
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TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
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Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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Cargo and Vehicle Inspection
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In a world where threats continue to evolve and concealment techniques become more sophisticated, our customers are facing more complex, difficult missions than ever.
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IoT Data Inspection App
Data Explorer
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he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application. The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Complete GPR System for Road Inspection
RoadScan
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Geophysical Survey Systems, Inc.
The RoadScan™ 30 system provides users with an effective tool for quickly determining pavement layers at high speeds. RoadScan is able to collect data densities not obtainable using other labor-intensive methods commonly used for pavement testing.
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Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Foreign Matter Inspection Device For FPDs
HS-930
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By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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DIP Vision Inspection Machine
Optima III
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Landrex Technologies Co., Ltd.
DIP Vision Inspection Machine
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CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE® 3000
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he Ultraprobe 3000 is a digital ultrasonic inspection, information, storage, and retrieval system that comfortably fits in the palm of your hand.
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Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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3D Measurement Software
PowerInspect®
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3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
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Product
Revopoint MetroX: Blue Laser Line and Full-field Structured Light 3D Scanner
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4 Flexible Scanning Modesꔷ Metrology-grade Accuracy: Up to 0.03 mmꔷ Volumetric Accuracy: Up to 0.03 mm + 0.1 mm × L(m)ꔷ Up to 7,000,000 Points/s in Full-field Structured Light Modeꔷ Up to 800,000 Points/s in Multi-line Laser Mode
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Bottom-up and Top-down 3D Modular AOI
SpectorBOX
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With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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Probes for Tube Inspection
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Probes for tube inspection are lightweight but solidly constructed eddy current, remote field, magnetic flux leakage, and IRIS ultrasound. These probes are used for ferromagnetic or non-ferromagnetic tube inspection applications.
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Connector, 104-Pin D-Type Male, Solder Bucket, 5A
92-960-104-M
D-Sub Male Connector
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied without backshell. This connector is not compatible with Pickering modules that use the 104-pin D-type connector.
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Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Inspection and Maintenance
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Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
