3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Refurbished And Demo X-ray Inspection Systems
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Our 2024 collection of refurbished and demo X-ray inspection systems offers high-quality performance at an affordable price. These precision X-ray inspection systems provide exceptional value without compromising on quality.
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Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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3D Geo-Magnetometer
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For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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Solder Paste Analysis
SPA1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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TO-CAN Package Inspection System
7925
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Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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3D Software
Geomagic Control X
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Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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3D Sensor (Shiny Surfaces)
reflectCONTROL
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reflectCONTROL is designed specifically to meet the high quality requirements that ensure high quality for shiny surfaces. The system based on deflectometry projects a striped pattern onto the measurement object. Defects on the surface cause deviations from the striped pattern which are recorded by cameras and evaluated by software.
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Portable Strain Gage Welding and Soldering Unit
700
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A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.
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3D And 2D Visualization Software
3DViz
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The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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3D Video Microscope
BVM-20104
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The microscope is configured with 1.3M HD industrial camera. VGA image output interface, can be connected to the computer and monitor directly. clear and vivid image, taking photos, SD card storage, auto exposure. Camera is equipped with remote control panel, which makes the operation much easier. Optical lens keep parfocal under zoom, there is no deviation for center; 3D rotary observation
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Low to Modest Volume Clean, Inspect, Test
KI-TK034
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1310/1550 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO/APC, SC, LC connectors (EAR99 Restricted)
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DC Safety Inspection Device For Solar Panels
“DC Fault Tester”
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Identifies defect position instantly- contributes to saving inspection time
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Inspect & Explore Indoor and Confined Spaces
ELIOS
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Discover the first collision-tolerant drone, designed for the inspection and exploration of the most inaccessible places. Allowing for the first time to fly in complex, cluttered or indoor spaces, Elios unleashes the potential of UAVs in numerous applications where their use was previously too dangerous or simply impossible.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
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The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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3D Laser Scanning Systems
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3D laser scanning is a construction, engineering, and architectural tool often used to document the existing conditions (as-builts) of any structure.
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3D Scanner
peel 3
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peel 3 can handle any application in: aftermarket & tuning, AR, VR & digital content, education, heritage preservation and art, product design, healthcare, and MRO and engineering.
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Silicon Inspection System
NIR-01
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The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Automated Optical Inspection System
AV880 Series
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The AV880 Series of AOI solutions from ASC International provides the same high level inspection capabilities as found in our AV862/AV871 Series of AOI systems all wrapped into an inline platform for continuous flow requirements. A price to performance ratio sure to please those looking for a quick ROI.
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Turnkey NDT Corrosion Inspection Services
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Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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End Face Inspection Microscopes
D SCOPE EFI – D SCOPE EFI-C – D SCOPE EFI-C LWD
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The new D Scope EFI for MTP/MPO and multifibers field connectors is a cost effective microscope for inspecting fiber optic patchcords and cassettes.
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Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
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The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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3D Smart Sensors
FACTORYSMART®
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Scan object shape and contrast, take feature measurements, and make critical control decisions—then communicate directly to factory networks and equipment. All with a single device. All at production speed.
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Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
