3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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3D Software
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Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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3D Geo-Magnetometer
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For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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3D Measurement Software
PowerInspect®
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3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
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Wave Soldering Machines
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Shenzhen Leadsmt Technology Co.,Ltd
A bulk soldering process used for the manufacturing of printed circuit boards.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
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Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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Product
Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Product
Soldering Stations
SM-878AD
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*Module: 878AD*Display: LED*Power Rating:700W *Air Flow: 120L/Mints*Temperature: 100-450DEGREE*Noisy: <45dB
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Product
Direct 3D RightMark
D3D RM
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D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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Product
3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Product
Solderability Tester
LBT210
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Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Product
Solderability Tester
ZHX-35
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Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
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Digital Inspection
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The DI-1000 and DI-1000L-PRO inspect fiber optic connector endfaces, providing clear sharp digital images on your Windows® PC. The DI-1000 and DI-1000L-PRO use LIGHTEL's Series 2 Tips and come with a soft case designed to fit easily into a standard laptop case.
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Product
Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Pipeline Inspection
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Radiodetection and Pearpoint provide a wide array of Pushrod and Crawler pipeline inspection systems.
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3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Product
SparkFun Solder-able Breadboard
Mini
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This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Inspection
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A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
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Product
3D Image Processing Software
EyeVision
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EyeVision is the base for numerous measurement and inspection tasks in image processing. Features are: Creation of inspection programs with drag and drop function. EyeVision supports all hardware platforms such as; Smart Cameras, Vision Sensors, PC & Embedded support.
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Product
Inspection Solutions
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Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
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Product
Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Concrete Inspection System
StructureScan Pro
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Geophysical Survey Systems, Inc.
StructureScan Pro is a versatile concrete inspection system offering a wide variety of antenna options for concrete and other applications. Based on the SIR 4000 controller, the StructureScan Pro provides the GPR professional with solutions to any scanning situation.
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3D Measurement And Inspection
LOTOS
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LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
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Vision Inspection Products
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Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
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3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Product
3D AOI with Revolutionary New 3D Measurement
Zenith
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The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Thickness and Flaw Inspection
OmniScan MX2
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The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Conformal Coating Inspection
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Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.
