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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
787895-33
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller - The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Air Core Inductors
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Osborne designs our Air Core Inductors to realize their advantage of high linearity. We also work with our clients to identify and mitigate any potential disturbances that could result from electromagnetic fields created. The air core design approach is known to create strong electromagneticfields. Osborne develops electromagnetic circuit models, if necessary, to ensure that our clients build effective and reliable circuits.
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High-Performance Intelligent Pod for Corelis Boundary-Scan Controllers
ScanTAP 4 & 8
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Boundary-scan has proven itself time and again to be a truly versatile interface for structural test, embedded functional test, built-in self-test (BIST), software debug, and in-system programming. Supporting such diverse applications requires equipment with high-performance specifications and extended features.Corelis ScanTAP pods are designed for use with PCI-1149.1/Turbo and PCIe-1149.1 high-speed JTAG controllers. Featuring 4 & 8 independent Test Access Ports (TAPs), up to 80 MHz clock rates, and advanced TAP capabilities such as analog voltage measurement, the ScanTAP family of intelligent pods is the ideal JTAG interface for high-performance environments.
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ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™
IMB521R
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The IMB521R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® C246 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It support three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3086
Embedded PC
ntel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)12~24V DC input power rangeSupport Advantech I Door module
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Intel Core Series - Medium Branch
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Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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LV Iron Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
12-Bit, 20MS/s, 8/4-Ch AI Platform With Intel® Core™ I5/Celeron® Processor
MIC-1842
Platform
8 x Simultaneously Analog Inputs, up to 20 MS/s, 12-bit resolutionSupports digital and analog triggers32-ch TTL digital I/OOnboard FIFO memory (16 K samples)2 x RS-232 ports2 x 10/100/1000 Base-T RJ-45 LAN ports2 x USB 2.0 and 2 x USB 3.0 portsiDoor expansion supported
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Low Loss Cable Assemblies
True Blue
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The Answer: An unmatched combination of low loss, durability, and value.The Question: What does Teledyne Storm Microwave’s True Blue® line of cable assemblies provide?For more than 30 years, our True Blue® assemblies have been the winning choice of design, test, and production engineers for:- Military and aerospace design-in applications- General purpose test applications- Production testing- With a design based entirely on high-performance materials, the True Blue® line covers frequencies from DC to 50 GHz.Assemblies are available in both custom configurations and a variety of standard lengths and connector combinations.The basic True Blue® cable is designed to be durable. However, for applications requiring added durability, assemblies are also available ruggedized, armored, and soft armored.
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Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
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Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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Advanced Design System (ADS) Core
W2200BP
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Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
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Research Core
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Qualtrics is the most trusted enterprise research platform in the world with over 8,500 brands and 99 of the top 100 business schools using Qualtrics to make the most critical decisions.
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3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
Controller
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
Detector of Earth Faults on Multi/Single-Core Terminations
CableTroll 2320
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CableTroll 2320 is an indicator for detection of Earth faults (PtG) and short circuit (PtP) faults on multi-core and single core cable terminations. The unit uses NorTroll type current sensors.
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23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
Panel PC
Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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Single and Dual Core Digital Signal Processor
SI-C665xDSP
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The SI-C665xDSP from Sheldon Instruments is a C programmable Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.
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Ultra Compact, Uncooled Thermal Imaging Core
Dione 1280 OEM Series
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The Dione 1280 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35 x 35 x 23.5 mm3 and weight is 27 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. The ultra-compact Dione 1280 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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17" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-317S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Intel® Core™ / Celeron® Embedded Controller
AMAX-5580
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Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 64-axis motion control with 1ms EtherCAT cycle time under Windows (applies to AMAX-5580 Core i processor)OPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Intel® Core™ i7/i5/Celeron® with 8GB/4GB DDR4 memorySystem I/O with 2 x GbE, 4 x USB 3.0, 2 x COM, 1 x HDMI, 1 x VGA, 1 x 7 pin terminal (dual power input with alarm output)
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Product
THIN 1U Embedded PC - Intel® 8th Generation Desktop Core™ I3/i5/i7
EPC-T2286
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Thin design with 44.2mm in height.Support Intel® 8th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785158-33
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
IP Core and FPGA Products
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Our FPGA offerings include development boards and IP cores for Altera FPGA devices. The IP cores include: I2C, PCIe, JPEG-LS, LVDS Camera Link and memory controllers.
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade
cPCI-6636(KL) Series
Processor Blade
The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
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Product
Multi-Sensor Core Logger
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The Geotek Multi-Sensor Core Logger (MSCL) systems enable a suite of geophysical measurements to be obtained rapidly, accurately and automatically on sediment or rock cores. The rugged nature of the equipment makes it suitable for use in either an onshore laboratory/repository environment or onboard survey and drilling vessels. All of Geotek’s core loggers accept core between 50 mm and 150 mm in diameter and up to 1.55 m in length. Geological cores and materials come in a variety of sizes therefore the MSCL and X-ray CT systems are designed for a full range of core material in a variety of liner compositions. To accommodate varying customers’ requirements (both operational and scientific), we provide a range of different core loggers and X-ray CT systems:
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Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
