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Pico-ITX SBC With 4th/5th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, DisplayPort/LVDS, LAN And Audio
PICO880
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The PICO880 is an extremely compact Pico-ITX SBC with onboard 14nm 5th generation Intel® Core™ i7/i5/i3 and Celeron® processors. The palm-sized PICO880 enhanced performance enables greater multitasking at low power meeting the needs of the growing retail mobile device marketplace. The industrial grade embedded SBC is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). Designed with expandability in mind, the tiny embedded board has a full-size PCI Express Mini Card slots with mSATA support. The Axiomtek PICO880 also provides two flexible board-to-board connectors that integrate audio, four USB 3.0, one PCIe x1, one DisplayPort, two UARTs, LED, and power on/off interfaces. The pico-ITX motherboard PICO880 is equipped with standard features such as one DDR3L SO-DIMM with up to 8 GB memory capacity; one USB 2.0 port; one SATA-600 interface, one 10/100/1000Mbps Ethernet port that supports Wake-on-LAN, PXE; one DisplayPort and LVDS display interface with integrated Intel® HD graphics 5500 and 6000 that delivers high-resolution Ultra HD 4K display support for immersive visual retail experience. The single board computer also offers two optional expansion boards, AX93275 and AX93276 for additional RS-232/422/485, USB 3.0, HDMI, VGA and LAN ports. This outstanding embedded SBC runs well with Windows® 7 and 8.1 operating systems.
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Inversion Loss
DSP-1L
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Is used to protect your three-phase motors against loss, imbalance or inversion. It continuously monitors each phase of your power supply. In case of phase loss, imbalance or inversion, the DSP-1L cuts off the power to the control circuit and thus protects the motor concerned.
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Slim And Light All-In-One Medical Panel Computer Family With 11th Generation Intel® Core™ Processor Performance
MLC-M Series
Panel PC
MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor (Tiger Lake), providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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Windows 10 IoT Core Services
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Long-term OS support and services to manage device updates and assess device health
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ARINC 818 Switch IP Core
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ARINC 818-2 is a point-to-point, serial protocol, high bandwidth, low latency protocol for the transmission of uncompressed video, audio, and data during blanking period, widely used in AVIONICS application. Since a vast portion of the newer applications of the ARINC 818-2 have several displays with many channels of ARINC 818-2, switching has turned out to be more imperative. ARINC 818-2 switch can support up to 12 channels. Multiple switching modes such as broadcast, unicast, multicast, and mixed are also supported.
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Core Solutions
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Synthesizable 1394 and AS5643 IP Core solutionsPHY, LLLC, PHY & LLC for multiple FPGA families
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3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Fanless DIN-Rail IPC With Intel® Core™ Processors (13th Gen)
UNO-148 V2
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Intel® Core™ processors (13th Gen) with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COMSupports 2 x M.2 M key 2280 NVMe SSD storage (support RAID)Supports 1 x M.2 E Key 2230 wi-fi module and 1 x miniPCIe with Nano SIM card slotDual 2500 BASE-T Ethernet supports Time-Sensitive Network (TSN) technologyModular design for optional iDoor extensionSupport Windows 11 IoT Enterprise LTSC
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3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
Processor Blade
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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12.1" Panel PC With 8/9th Generation Intel® Core™ I/Celeron® Processor
PPC-6121
Panel PC
12.1" TFT XGA LCD panel with resistive touch control8/9th generation Intel® Core™ i/Celeron® processor (thermal power design: 35W)2 x 260-pin SO-DIMM DDR4 2666 MHz (max. 32 GB)1 x M.2 2230 (E key)1 x mSATA bay (SATA SSD + mSATA support RAID 0&1)1 x Optional TPM2.0 & 1 x Optional PCI/PCIe x4 expansion kit1 x Isolated RS422/485 (terminal block)1 x VGA and 1 x HDMI
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Quad Core KeyStone™ DSP + UltraScale™ FPGA Module
SMT6657-KU35
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Sundance Multiprocessor Technology Ltd.
The SMT6657 DSP+FPGA module is a reliable and flexible platform for digital signal processing applications requiring high-performance integer and floating-point computation.It is applicable to both symmetric multiprocessing applications in which the computational load is shared by the two DSPs and asymmetric applications where one of the DSPs is responsible for hard real-time processing and the other acts as a supervisor, handling all non-deterministic communication and optionally running under control of an operating system.
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Modular TPC - Computing Box Module With Intel® Core™ I3-N305 Processor
TPC-B520L
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Modular Computing Box powered by Intel® Core™ i3-N305, octo-core processorModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)Single DDR5 Memory slot supports up to 16GBSupport expansion via three M.2 slots (PCIe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type-C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyPerformance, fanless embedded system with chassis grounding protection
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8th Gen Intel® Core™ Processor BGA 1528
AIMB-233
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Supports Intel® Core™ core i7-8665UE /i5-8365UE/I3-8145UE/Celereon 4305UE, 15W TDP, BGA 1528 16nm ProcessorSupports two 260-pin SO-DIMM up to 64GB DDR4 2400 MHz SDRAMSupports multiple display I/O supports versatile Tri display functions for HDMI,Support PCIex1, 2 M.2 (1 F/S miniPCIe), 4 USB 3.1, 2 USB 3.0 and 2 SATA IIISupport wide range 12V~24V DC Input and low profile heightSupports WISE-PasS/RMM and Embedded Software APIsSupport SUSI, WISE-DeviceOn and Edge AI
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3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
Processor Blade
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Air Core Inductors
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Osborne designs our Air Core Inductors to realize their advantage of high linearity. We also work with our clients to identify and mitigate any potential disturbances that could result from electromagnetic fields created. The air core design approach is known to create strong electromagneticfields. Osborne develops electromagnetic circuit models, if necessary, to ensure that our clients build effective and reliable circuits.
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14th/13th/12th Gen. Intel® Core™ Processors (Alder Lake-S/Raptor Lake-S Series, LGA1700 Socket CPU) On 4" EPIC SBC
MIO-4370
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14th/13th/12th Gen. Intel® Core™ Processor up to 24 Cores, TDP 35WHigh scalability with socket type CPU (LGA1700) & Support Std. CPU coolerDDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI+eDPDual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM3 Expansions: Dual M.2 M-Key (support NVMe), M.2 E-KeySupports Windows 10 LTSC & Ubuntu 22.04 LTS, embedded software APIs, WISE-DeviceOn
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12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-208
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12th/13th/14th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipsetUp to 64GB DDR4 3200MT/s with two SO-DIMMPCIe x16 Gen4Triple independent displays with 2 DP, 1 HDMI, 1 LVDSRich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COMWISE-DeviceOn and Embedded Software APIs
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Embedded Real-Time Robotic Controller with 11th Gen Intel® Core Processor
ROScube Pico TGL
Robotic Controller
ADLINK’s ROScube Pico TGL is a real-time ROS 2 enabled robotic controller based on the 11th Gen Intel® Core™ i7/i5/i3 processors with Intel® Iris® Xe Graphics featuring exceptional I/O connectivity and supporting a wide variety of sensors and actuators for unlimited robotic applications. The ROScube Pico TGL supports the full complement of resources developed with ADLINK Neuron SDK. Bundled with AI features and capabilities and developed with the Intel® distribution of OpenVINO™ toolkit, the ROScube Pico TGL is a perfect platform for industrial service robot applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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3.5" SBC With Intel® Atom® X7835RE/x7433RE/x7211RE (Extended Temperature SKU) And Core™ I3-N305; Processor N97
MIO-5354
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Intel® Atom™ x7835RE, x7433RE, x7211RE, support Extend Temp.DDR5-4800 up to 16GB, support IBECC by Platform3 independent display: LVDS + HDMI + DP2x LAN, 6x USB, 4x COM, 2x CAN-FD, SMBus/I2C, DC-in 12~24VExpansion: 3x standalone M.2 slot: E-Key 2230, B-Key 2280 & 3052Supports EdgeBMC (for OOB control) & Software APIs, DeviceOn
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Air Core Test Lab Reactors
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Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ Processor, Intel® HM86 And TPM 1.2
OPS880-HM
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The OPS880-HM is powered by 4th Generation Intel® Core™ i5 and i3 processors (codename: Haswell) with the Mobile Intel® HM86 Express chipset. The OPS880-HM supports one DDR3L SO-DIMM socket with memory maximum up to 8GB. In addition, it features one mSATA interface as storage device and two PCI Express Mini Card slots for graphics-enhanced video card, wireless LAN card for 802.11 b/g/n and 3G/GPRS, and tuner/AV capture card. The outstanding OPS digital signage module is an ideal choice for various display applications in different environments, e.g., shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
