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12/13/14th Gen Intel® Core™ Processor LGA1700 Nvidia MXM GPU Integration
AIMB-292
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12/13/14th Gen Intel® Core™ Desktop Processors, max. 24 Core, support Q670E chipsetIntegrated NVIDIA MXM GraphicsUp to 96GB DDR5 5600 MT/s with two SO-DIMMQuadruple displays with 3 DP and 1 LVDS (or eDP), up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1, 2 USB 2.0, 1 SATA IIIQualified for Edge AI SRP of WISE-DeviceOn and Embedded Software APIs
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Product
THIN 1U Embedded PC - Intel® 13th/14th Generation Desktop Core™ I3/i5/i7
EPC-T228A
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Thin design with 44.2mm in height.Support Intel® 13th/14th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Camera Cores
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Photonis camera cores provide day-through-night imaging to detect and capture images in any lighting conditions, from daylight through quarter-moon darkness. Our camera core portfolio covers a broad range of detection from visible, near infrared (NIR), short-wavelength infrared (SWIR) to long-wavelength infrared (LWIR) spectrum.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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3U Intel® Core™ i7-2715QE 2.1 GHz Quad-Core Processor-based PXI Controller
PXI-3980
Embedded Controller
The ADLINK PXI-3980 PXI embedded controller, based on the second generation Intel® Core™ i7 processor is specifically designed for hybrid PXI based testing systems, delivering a rugged yet stable platform for a wide variety of testing and measurement applications.
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Industrial All-In-One Touch Panel PC Based On 7th Gen. Intel® Core™ Processor
STC2-KL Series
Panel PC
- Intel® Core™ i3-7100U/i5-7300U/i7-7600U- 10.1"/15.6”/21.5” 16:9 LCD with LED backlight up to 50,000 hours- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Intel® Core™ Ultra 3 Series Processor
AIMB-234
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Intel® Core™ Ultra ProcessorsSupports Intel® ARC™ GPU with up to 12Xe, enabling four independent 4K displaysSupports up to 128GB dual-channel DDR5-7200MT/s using CSODIMM modulesBuilt-in NPU5 delivering 50 TOPS for dedicated AI accelerationOffers full support for embedded software APIs and Advantech’s WISE-PaaS/DeviceOn platformProvides extensive I/O expandability—2.5GbE, high-speed PCIe x8 Gen5, USB4 and USB3.2 Gen2 ports, plus SATA 3.0
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Medium Voltage Iron Core Oil-Immersed Shunt Reactor
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Iron core Oil-immersed Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system.
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Fanless Embedded System With 4th Gen Intel® Core™ Processor For Railway PC
tBOX322-882-FL
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The tBOX322-882-FL fanless railway embedded PC is based on 4th generation Intel® Core™ i7 or i3 processor with wide temperature capability from -40°C to +70°C. Certified with EN50155, EN50121 and complied with the standard of railway vehicles fire protection – PrCEN TS 45545-2, the railway PC is well suited for IoT & M2M-related applications such as onboard devices controller, train management, gateway, security surveillance and rolling stock environments. To keep all cables tightly secured, the railway pc has standard M12 connectors for Ethernet ports, USB ports, power input, and audio port. What is notable is that the graphics performance is now merely up to two times higher than previous generation, with the latest quad core processor, allowing faster and better information display.
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PXI Embedded Controller i5, dual core, Windows 7
OTP2 module no.184
Embedded Controller
PXI offers the optimal approach to validation and production testing. You can meet timing, synchronization, and throughput requirements across devices. PXI is a robust PC-based platform for measurement and automation systems, supported by software. PXI combines PCI electrical bus characteristics with CompactPCI's modular Eurocard packaging, and then adds special synchronization buses and important software functions.
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9th/8th Gen. Intel® Xeon®/Core™ Processor, 3.5" SBC W/ MIOe
MIO-5393
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9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25WDual channel DDR4-2400, up to 64GB, ECC for Xeon SKUTriple simultaneous displays with 48-bit LVDS+HDMI+DPUSB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSDDual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2CM.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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LV Iron Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
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Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
Mini-ITX M/B Support 12th/13th Gen Intel® Core™ Processors, H610E, 3 X LAN For PPC-600
PPC-MB-620
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Supports Intel® 12/13th Gen Core™ i processor (LGA1700) with Intel Q670E/ H610E chipsetTwo 262-pin SO-DIMM up to 64GB DDR5 4800 MHz SDRAMSupports triple display of DP/HDMI/LVDSSupports PCIe x16 (Gen 5), 1 x M.2 M key & 1 M.2 E key, 6 USB 3.2Supports 2 x SATA 3.0 (Raid 0, 1) (only for PCH Q670E)Supports TPM 2.0Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
787895-33
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller - The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-276
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Supports 8th/9th Generation Intel® Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAMSupports triple display of Dual DP++/HDMI 2.0a/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1 x M.2 B key + 1 x M.2 E key, 6 USB 3.1 & 4 USB 3.0, and 3 SATA IIISupports wide range 12V~24V DC InputSupports Intel vPro, AMT 12.0, Software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
14th Gen Intel® Core™ Ultra 7/5-Based Advanced Embedded Box PC
EMP-520 Series
Box PC
- 14th Gen. Intel® Core™ Ultra 7/5 Processors (Meteor Lake-H/U)- DDR5-5600MHz up to 96GB (48GB per DIMM)- 4x independent displays support EDID Emulation- 2x 2.5GbE, 1x COM, 6x USB ports, Type C Thunderbolt (optional)- 2 x Wi-Fi/BT/LTE antenna holes- M.2 2280 (SSD), M.2 3042 (LTE), M.2 2230 (Wi-Fi/BT)- VESA mount (optional)
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Product
Mini-ITX Embedded Board with 8th/9th Gen Intel® Core™ i7/i5/i3 Processors
AmITX-CF-I
Motherboard
The AmITX-CF-I is a Mini-ITX motherboard supporting the 8th/9th Gen Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processor in the LGA1151 package, and the Intel Q370/H310 chipset. The AmITX-CF-I is specifically designed for customers who need high-level processing and graphics performance with a long product life solution. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz non-ECC memory up to 32 GB in two SODIMM slots. The AmITX-CF-I features DVI, DP and HDMI ports, LVDS header, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and audio with Line-out, Line-in and Mic-in connectors. Expansion is provided by one PCIe x16, one M.2, and one mini-PCIe slot. The onboard pin header provides GPIO, USB and RS-232 support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.
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Product
Low Loss Test Cables
SF Series
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SuperFlexLow Loss Test Cables are very flexible, low loss and DC-26.5 GHz
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX324-894-FL
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The tBOX324-894-FL is a multi-functional fanless embedded computer certified with EN 50155, EN 50121, E-Mark, ISO 7637, DNV 2.4 and compliant with EN 45545-2, IEC 60945 for use in a variety of transportation applications. Thanks to the onboard 7th generation Intel® Core™ and Celeron® processors (official codename: Kaby Lake-U), the tBOX324-894-FL provides powerful computing performance in a compact size within which a modular I/O design has enhanced the operational efficiency and flexibility. The transportation box PC is equipped with two DDR4-1866/2133 SO-DIMM slots supporting up to 32GB system memory. To suit the need of extensive storage, it is equipped with two swappable 2.5” SATA3 HDDs and one CFast™ slot. The application ready tBOX324-894-FL is an outstanding embedded box PC for transportation-related applications such as train management, truck fleet management, transportation controller, data transfer, security surveillance, and onboard infotainment controller in the vehicle, railway, and marine markets.
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Product
End Point IP Core
PCIe
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The highly configurable PCIe End point IP core supports x1, x2, and x4 lane with a selection of 32/64-bit data path. Depending on design requirements, a maximum of 8 VCs and 8 TCs are supported. The IP core consists of many useful features that can be included to enhance system performance and to address special design needs in different applications. The data link layer allows the configuration of infinite credits to boost the flow control efficiency. By-pass mode, cut-through mode, and store-and-forward mode are other optional items. The transport layer features include configurable ECRC generation and checking, support for up to 64 configurable outstanding non-posted requests, and configurable payload size from 128 to 4 Kbytes
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19" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-319S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
18.5" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-318SW RPL
Panel PC
Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0104
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The AWS-0104 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, 21dB gain in receive mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
