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6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Hand Held Loss Test Set with Return Loss Option
LTSH1315
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The KD Optics LTSH1315 is a combined laser or LED source and power meter designed to make attenuation testing in the field easy, reliable and consistent. A return loss option is available for 850nm multimode, 1310nm and 1550nm singlemode.
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2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
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The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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15.6" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-SL
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- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
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The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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10th Gen Intel® Core™ Processor LGA1200
AIMB-287
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Supports Intel® 10th Gen Core™ i processor (LGA1200) with Intel H420E chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666/2933 MHz SDRAMSupports 1 M.2 M key, 1 M.2 E key, 4 COM, 6 USB 3.0 and 2 SATA IIISupports dual display of HDMI 2.0/ HDMI 1.4b/ eDPSupports TPM 2.0 (optional)THIN Mini-ITX with 12~24V DC InputSupport SUSI, WISE-DeviceOn and Edge AI Suite.
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PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
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The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Fanless Embedded System With Intel® Atom™ Processor E3845 Quad Core™ (1.91 GHz) For Railway PC
tBOX323-835-FL
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The tBOX323-835-FL, a fanless railway PC, is designed for in-train applications. Integrated with onboard quad-core Intel® Atom™ E3845 processor and 4 GB low-powered DDR3L memory. The fanless railway PC boosts its computing performance and specializes its I/O design with five isolated COM ports, two M12-type LAN connectors, USB 2.0 ports, and one isolated digital I/O. The railway PC also provides VGA and HDMI outputs for in-train surveillance. The tBOX323-835-FL is an ideal all-in-one IoT (Internet of Things) solution for various applications, including railway multi-functions of gateway, controller, digital signage management and surveillance. Certificated with EN50155 and EN50121 for rolling stock and complied with EN45545-2 for fire resistance, the rugged embedded system operates reliably in a -40ºC to 70ºC operating temperature range (EN50155 Class TX) and in a high vibration environment.
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Intel® Core™ IPC Controller
AMAX-7580 V2
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Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)13th Generation Intel® Core™ i7/i5 Processor with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COM
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COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
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The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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LV Iron Core Motor Starting Reactors
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Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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Quad Optical Loss Test Set
KI27624-INGAAS-APC
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A Quad Optical Loss Test Set used to test power, insertion loss, continuity and faults on multimode and single mode fiber with an APC connector at 850 / 1300 nm & 1310 / 1550 nm. In a small package, it provides a powerful solution to improve test flexibility and productivity.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Intel® Core™ Ultra 7/5 Processors AMR Control System
AFE-R760
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Intel® Core™ Ultra 7/5 Processors, up to 16 Cores, TDP 28W. Dual Channel DDR5-5600, up to 96GB. Support 4x GMSL through 120pin B2B connector.Dedicate I/Os for AMR: 3x 2.5GbE, 2x USB-C, 2x USB-A, 4x COM, 2x CAN-FD, 8-bit GPIO.
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12th Gen. Intel® Core I7/ I5/ I3 P-Series 3.5" SBC
MIO-5377
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12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports iManager & Software APIs, WISE-DeviceOn
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
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*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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21.5" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-321SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Open Pluggable Specification (OPS) Digital Signage Player With Intel® Core™ I7/i5/i3 Processor
OPS875
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*Open Pluggable Specification (OPS) compliance*Socket G2 (rPGA988B) 3rd gen Intel® Core™ i7/i5/i3 processor*Intel® HM76 chipset*DDR3-1600 SO-DIMM, up to 8GB*2 USB 3.0 ports and 1 PCIe Mini Card slot*Pluggable HDD for easy maintenance*Easy to change DRAM*HDMI for 2nd display
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Dielectric Loss Tangent Testing Instruments
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Insulation materials in electrical equipment are used between a pair of electrodes; therefore it can be expressed as capacitors. Applying AC voltage to a capacitor with insulation materials causes an energy loss due to the leak current, the dielectric polarization, and the partial discharge. Because of this, the phase of the capacitor current is more delayed than that of a zero-loss current (reactive current) flowing in an ideal insulation material. The delay angle is called "Dielectric Loss Angle", and the tangent is "Dielectric Loss Tangent" (tanδ). Please refer to the technical guide explained in detail.
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Product
Compact, industrial thermal imaging core
Dione 1024 OEM Series
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The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.
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Thermal Imaging Core
JOHO336CM_A00
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Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
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The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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Product
Loss Test Set, Return Loss Test Set
LTS1315, LTS1315R
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The KD Optics LTS1315 is a combined mains / battery powered laser source and power meter designed to make attenuation testing in the field easy, reliable and most importantly, consistent. The LTS1315R incorporates return loss measurement (RLM) capability with the ability to switch very easily between dBrel and return loss.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB501
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The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
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*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0





























