Common Core
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Product
Diagnostic Cores
Diagnostic VersaCore™
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The diagnostic cores are uniquely designed in the VC20™ with Advanced Cantilever™ technology format. Using the customizable PCB, components can be added to create a “golden core” to quickly troubleshoot your system*Test SMUs*Test Motherboard*Test Pogo pins*Test Relay matrix
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Product
4CH GigE Vision Compact Vision System with 6th Generation Intel® Core™ i7/i5/i3 Processors
EOS-1300
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ADLINK’s EOS-1300 is a high performance compact vision system equipped with 6th Generation IntelR Core? i7/i5/i3 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s. EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
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- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
Micro-ATX, 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-588 B1
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Intel® Core™ 14/13/12th gen & Series 23 2.5GbE LAN and 1 GbE LAN for digital devicesUp to 192GB DDR5 UDIMMs for data transferHigh speed expansions: PCIe x16 Gen5, 8 USB3.2, 1 USB3.2 Type C1 internal USB3.2 type A to support USB keylock functionsQuad displays by 2 DPs, HDMI, and eDP
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
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The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
Intel® Core™ Panel Controller
AMAX-PT800 V2
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Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Modular Computing Box designed with 13th Gen. Intel® Core™ i5-1335UE deca-core/ i7-1365URE deca-core processor
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Product
Load Testing for Evolved Packet Core (ePC/VePC)
Flare
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Linkbit Flare is designed for load testing of Evolved Packet Core (ePC) networks, and the upcoming VePC deployments. It is based on the technology initially develped for Linkbit functional testers, and as a result is extremely flexible.
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Product
Intel® Core™ Ultra 3 Series Processor
AIMB-234
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Intel® Core™ Ultra ProcessorsSupports Intel® ARC™ GPU with up to 12Xe, enabling four independent 4K displaysSupports up to 128GB dual-channel DDR5-7200MT/s using CSODIMM modulesBuilt-in NPU5 delivering 50 TOPS for dedicated AI accelerationOffers full support for embedded software APIs and Advantech’s WISE-PaaS/DeviceOn platformProvides extensive I/O expandability—2.5GbE, high-speed PCIe x8 Gen5, USB4 and USB3.2 Gen2 ports, plus SATA 3.0
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Product
PXI/PXIe RF Multiplexer, Quad 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
42-876A-104
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The 40-876A-104 (PXI) and 42-876A-104 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 4 banks in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module has low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
STP Engine (IP Core)
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The Stream Transpose® (STP) engine is a reconfigurable processor (DRP: Dynamically Reconfigurable Processor) core that combines the flexibility of software and the speed of hardware. The firmware defining processing can be reconfigured in an instant, allowing an almost infinite variety of functions to be integrated into a system. A 40nm process is currently available for ASIC.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
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- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ MicroATX Server Board with 4 x DDR4, 3 x PCIe, 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-587
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- LGA 1200 Intel® Xeon® W and 10th Gen. Core™ i9/i7/i5/i3 processor with W480E chipset- DDR4 ECC/Non-ECC 2933/2666/2400 MHz UDIMM up to 128 GB- One PCIe x16 and 2 x PCIe x4 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 22110/2280 (SATA / PCIe compatible)- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Product
Fanless Embedded System With Intel® Core™ I5-6300U 2.4 GHz/i3-6100U 2.3 GHz/Celeron® 3955U 2.0 GHz, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM And 9 - 36 VDC
eBOX565-500-FL
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The eBOX565-500-FL is designed to support the 6th generation Intel® Core™ i5-6300U or Celeron® 3955U processor with one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB system memory. The eBOX565-500-FL is designed for reliable use in industrial environments with an IP40-rated enclosure, a wide range 9 to 36 VDC power input, a wide temperature ranges from -10°C to 50°C (14°F to 122°F), as well as up to 3G vibration endurance. To fulfill various needs, the palm-sized industrial embedded computer, which measures 141.6 x 106 x 73 mm in size, provides rich I/O connectivity including two HDMI ports, one RS-232/422/485 port, one RS-232 port, four USB 3.0 ports, two Gigabit Ethernet ports, and two SMA type connector openings for antenna. One PCI Express Mini Card slot enables the addition of Wi-Fi, 3G, or LTE wireless cards.
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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Product
Intel® Core™ / Celeron® Embedded Controller
AMAX-5580
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Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 64-axis motion control with 1ms EtherCAT cycle time under Windows (applies to AMAX-5580 Core i processor)OPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Intel® Core™ i7/i5/Celeron® with 8GB/4GB DDR4 memorySystem I/O with 2 x GbE, 4 x USB 3.0, 2 x COM, 1 x HDMI, 1 x VGA, 1 x 7 pin terminal (dual power input with alarm output)
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Intel® Core™ I Automation Computer With 4 PCI(E) Expansion Slots
UNO-3285G
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Intel® 6th Gen Core™ i7-6822EQ Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI2 x PCIe x8, 2 x PCI, 2 x mPCIe (2 x full), 1x CFast, slot, 1 x mSATA slot (optional)Dual Hot-Swappable storage with thumb screw support for RAID 0/1Supports Fieldbus Protocol by iDoor TechnologyDual power input for power redundancyFront LED indicator design for monitoring system status
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Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, SMB
40-876A-001
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The 40-876A-001 (PXI) and 42-876A-001 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost. Each MUX has been carefully designed to ensure excellent and repeatable RF characteristics to frequencies of 3GHz with each path having a nominally equal insertion loss.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
