Common Core
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Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-M47H
ADLINK IMB-M47H Industrial ATX Motherboard offers high computing performance with diverse I/O for industrial automation applications. It is the suitable choice for applications requiring real-time processing and high-level graphic capability.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
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Split Core Current Transformers
Application:Watt Transducer, Current Transducer, KWH Meter, Demand Meter, Power Factor Meter, Current Sensing Relays, Energy Management SystemsContinuous Thermal: Rating 1.25 at 30° C, 1.0 at 55° C Standard 5-amp secondary. Others available.
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Micro ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
MMB501
The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Rapidly Compile Networks For Implementation On Lattice SensAI IP Cores
Neural Network Compiler
Analyze networks for fit in the chosen number of engines and allocated memory. After compilation, simulate networks for functionality and performance prior to testing in hardware. Graphical display of networks supports analysis and understanding.
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Fanless Embedded System With Intel® Core™ I5-6300U 2.4 GHz/i3-6100U 2.3 GHz/Celeron® 3955U 2.0 GHz, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM And 9 - 36 VDC
eBOX565-500-FL
The eBOX565-500-FL is designed to support the 6th generation Intel® Core™ i5-6300U or Celeron® 3955U processor with one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB system memory. The eBOX565-500-FL is designed for reliable use in industrial environments with an IP40-rated enclosure, a wide range 9 to 36 VDC power input, a wide temperature ranges from -10°C to 50°C (14°F to 122°F), as well as up to 3G vibration endurance. To fulfill various needs, the palm-sized industrial embedded computer, which measures 141.6 x 106 x 73 mm in size, provides rich I/O connectivity including two HDMI ports, one RS-232/422/485 port, one RS-232 port, four USB 3.0 ports, two Gigabit Ethernet ports, and two SMA type connector openings for antenna. One PCI Express Mini Card slot enables the addition of Wi-Fi, 3G, or LTE wireless cards.
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Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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LGA 1151 Intel® Xeon® E3 v5/v6 & 6th/7th Generation Core™ Series Micro ATX Server Board with 4 DDR4, 1 PCIe x16, 3 PCIe x4, Quad LANs, USB 3.0
ASMB-585
- Supports LGA 1151 Intel® Xeon® E3-1200 v5/v6 and 6th/7th generation Core™ i7/i5/i3 processors- DDR4 ECC/non-ECC 2400/2133/1866/1600 MHz DIMM up to 64GB- One PCIe x16 slot (Gen3 x16 link), three PCIe x4 slots (2 Gen3 x4 link, 1 Gen3 x1 link)- Triple display - two DVI-D and one VGA ports- Supports up to ten RS-232 or six RS-232 and four RS-422/485 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C ambient operation temperature range
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784965-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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Fanless Embedded System With 4th Gen Intel® Core™ Processor For Railway PC
tBOX322-882-FL
The tBOX322-882-FL fanless railway embedded PC is based on 4th generation Intel® Core™ i7 or i3 processor with wide temperature capability from -40°C to +70°C. Certified with EN50155, EN50121 and complied with the standard of railway vehicles fire protection – PrCEN TS 45545-2, the railway PC is well suited for IoT & M2M-related applications such as onboard devices controller, train management, gateway, security surveillance and rolling stock environments. To keep all cables tightly secured, the railway pc has standard M12 connectors for Ethernet ports, USB ports, power input, and audio port. What is notable is that the graphics performance is now merely up to two times higher than previous generation, with the latest quad core processor, allowing faster and better information display.
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Common Metallic Pendulum Impact Testing Machine
JB-(C/D)
Jinan Testing Equipment IE Corporation
KB- (C/D) common type metallic pendulum impact testing system is the basic model for impact tester. The metallic pendulum impact tester is used to determine the impact resistance of metal materials under dynamic load and capable of doing a large number of impact tests continuously. The display method for the models is different, respectively there are analog dial display, touch screen digital display and computer display. For the later two models, it can display the impact power, impact toughness, and pendulum rotation angle. All the testing reports can be printed out. The metallic pendulum impact testing system is the essential quality control equipment for metal material manufacturers and QC departments, as well as the necessary instrument of research institutes for new material research.
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Processor Intel Core I7, PCI Gen 3, AMC
AMC726
The AMC726 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® 4th generation Core i7 Processor (Haswell) with QM87 PCH. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 And Intel® HM76 Chipset
OPS870-HM
OPS870-HM Open Pluggable Specification (OPS) compliant signage player is powered by 3rd Generation Intel® Core™ processors. The high performance OPS870-HM is based on Mobile Intel® HM76 Express chipset and features 3rd Generation Intel Core processors based on the leading edge 22nm process technology. Axiomtek's OPS870-HM is engineered to be installed into any OPS-compliant digital signage platform to enable faster and easier installation, and straightforward upgrading and maintenance. It significantly provides superb graphics performance, full HD content playback, and dual display presentations. Equipped with the OPS870-HM, users can apply a variety of DOOH (Digital Out Of Home) applications with ease!
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Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
