Common Core
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Product
Industrial All-In-One Touch Panel PC Based On 7th Gen. Intel® Core™ Processor
STC2-KL Series
Panel PC
- Intel® Core™ i3-7100U/i5-7300U/i7-7600U- 10.1"/15.6”/21.5” 16:9 LCD with LED backlight up to 50,000 hours- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Product
Intel® Core™ Ultra 5/7/9 LGA1851
AIMB-589
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Intel® Core™ Ultra Series 2 Processors, max. 24Core. Support W880/Q870 chipsetsUp to 192GB DDR5 UDIMMs/CUDIMMs for data transfer2 x 2.5GbE LAN and 2 x GbE LAN for digital devices1 x USB4, 8 x USB3.2, 4 x USB2.02 x M.2 M-Key 2280 for NVMe SSDAccommodate 2 double-deck GPU cards by PCIe x16 slots (x8 lanes)
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Product
Intel® 8th & 9th Gen. Core™ I Mini-ITX Motherboard
PPC-MB-610
Motherboard
Supports Intel® 8th & 9th Gen Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports triple display of DP/VGA/LVDSSupports PCIe x16 (Gen 3), 1 M.2 M key & 1 M.2 E key, 6 x USB 3.1Supports 2 x SATA 3.0 (Raid 0, 1)Supports TPM 2.0 (optional)Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
Controller
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
14/13/12th Gen Intel® Core™ I9/i7/i5/i3 With Intel® R680E Chipset Industrial ATX Motherboard
IMB-M47-R680E
Motherboard
Discover the pinnacle of industrial computing with our flagship IMB-M47-R680E ATX motherboard, tailored for the latest 14/13/12th Gen Intel® Core™ processors. Featuring the advanced Intel R680E chipset and integrated PCIe 5.0 technology, this motherboard accommodates up to seven high-speed PCIe slots, ensuring exceptional expandability and superior performance.
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Product
Intel® 6th/7th Generation Core I Desktop Compact Fanless System
MIC-7700
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Intel® 6th/7th Generation Core i Desktop CPU (LGA1151) with Q170/H110 chipset2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIMSupports 2 LAN, Isolation COM, 32-bit GPIO modules2 x GigaLAN and 8 x USB 3.0VGA and DVI outputSupports Advantech’s i-module, SUSIAccess, and embedded software APIs9 ~ 36 V DC input power rangeWide operating temperature
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Product
Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
AMSTX-CF Series
Motherboard
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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Product
Ultra-compact thermal imaging core
Dione 1024 CAM Series
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The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz.Dione 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional).Dione 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses (optional) provides a high level of tunability for optimal integration into many systems.The compact Dione 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.
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Product
Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
Industrial All-In-One Touch Panel PC Based On 11th Gen. Intel® Core™ Processor
STC2-TGL Series
Panel PC
- High performance with 11th Gen. Intel® Core™ Processor- 15.6"16:9 LCD panel with LED backlight with 50,000 service life- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment for ease of cleaning and enhanced readability- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Product
Intel Coffee Lake Platform To Support Intel® 9th & 8th Gen Core™ I Processor With One Low-Profile PCIe Expansion Slot
EPC-B2276
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Supports Intel® 9th & 8th Gen Core™ i processor (LGA1151) with Intel Q370.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of 2x DP/HDMI.One low-profile PCIe expansion slot.Reserved 2 USB, 2 COM, punchouts on front panel.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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Product
Slim And Light All-In-One Medical Panel Computer Family With 11th Generation Intel® Core™ Processor Performance
MLC-M Series
Panel PC
MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor (Tiger Lake), providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
Medium Voltage Iron Core Oil-Immersed Shunt Reactor
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Iron core Oil-immersed Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
Windows 10 IoT Core Services
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Long-term OS support and services to manage device updates and assess device health
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Product
Core Fusion Splicer with Dual Observation
STC-OFS701H
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Shanghai Stone Communication tech Co., Ltd
The smallest Core to core fusion splicer with dual observation Weight 1.2kg only 3.5 inch TFT color LCD monitor with X & Y view simultaneously Fiber core can be displayed clearly with large magnification Alignment mode: Core, cladding and manual alignment 9 seconds splice time and 30 seconds heat time Friendly operation interface and smart menu Operation with Max wind velocity of 15m/s Operation with max 5000m above sea level Typical 120 cycles with battery
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784227-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
400/5A CHEAP SPLIT CORE CAST RESIN CURRENT TRANSFORMER
LZCK310-10
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Beijing GFUVE Electronics Co.,Ltd.
LZCK series outdoor waterproof current transformers are applicable for AC power system 35kV and measurement of current of power supply equipment below 10KV also can be used for microcomputer protection. This type of current transformer employs imported silicon steel which with high permeability as magnetic material, has the characteristics of Small magnetic circuit loss and can be split, its semicircular core and secondary windings employ high quality epoxy resin vacuum, casting in plastic-case(ABS or PC) which is flame retardance anti-moisture, stable performance, no maintenance.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
