Common Core
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
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Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
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ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LAN, 8 USB, 2 PCI Express Mini Card Slots
eBOX670-891-FL
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The eBOX670-891-FL supports the 7th/6th generation Intel® Core™ i7/i5/i3 and Celeron® processors with flexible I/O configurations. This outstanding embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB. The eBOX670-891-FL provides high flexibility with reserved I/O module space on the rear side. The embedded system integrator can expand the system quickly and easily by installing suitable I/O modules. The fanless embedded box computer features wireless communication capabilities with two internal PCI Express Mini Card slots and one SIM card slot. Four Gigabit Ethernet ports are for customers who need mass data transmission or LAN port teaming functions for each virtual machine. For storage needs, it is equipped with one easy-access CFast™ socket, one mSATA interface, and dual 2.5” SATA hard drive bays with RAID 0&1 support.
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Product
Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
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The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
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The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
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ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
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The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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Product
12-Bit, 20MS/s, 8/4-Ch AI Platform With Intel® Core™ I5/Celeron® Processor
MIC-1842
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8 x Simultaneously Analog Inputs, up to 20 MS/s, 12-bit resolutionSupports digital and analog triggers32-ch TTL digital I/OOnboard FIFO memory (16 K samples)2 x RS-232 ports2 x 10/100/1000 Base-T RJ-45 LAN ports2 x USB 2.0 and 2 x USB 3.0 portsiDoor expansion supported
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 7th/6th Gen Intel® Core™ Processor, Intel® Q170/H110, SATA3, USB 3.0, Dual LAN And DVI-I
SHB140
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The SHB140 PICMG 1.3 single board computer is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 processors in the LGA1151 package with Intel® Q170 Express chipset (codename: Skylake). The high performance SHB-based CPU card comes with two DDR4 2133/2400 MHz up to 32GB and six SATA-600 ports with RAID 0/1/10/5. Combined high-bandwidth PCI Express for frame grabbing and conventional PCI expansion for motion capture, the SHB140 is an optimum solution for machine vision and automation applications. This high performance PICMG 1.3 slot CPU card also features an integrated Intel® AMT 11 and TPM 1.2 for higher security and easier maintenance.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
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The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, HDMI/LVDS And LAN
PICO512
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The PICO512 is designed to support the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U. Coming with one 260-pin DDR4-2133 SO-DIMM socket supporting system memory up to 16 GB, the Pico-ITX motherboard also features a PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors for an additional I/O board/signals. It supports a 4K visual experience with dual display outputs through HDMI and LVDS. Pico-ITX SBC can withstand a wide operating temperature range from -20°C to +70°C.
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Product
Evolved Packet Core Commander
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A Subscription based solution for vEPC test automation. The rapid evolution of mobile networking technology is changing MNOs and NEMs requirements for EPC test automation solutions. The new solutions have to be flexible, scalable, quickly and easily deployable in a cloud, and most importantly, affordable.
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Product
LGA 1700 Intel® 12th Gen. Core™ MicroATX Server Board with 4 x DDR5, 3 x PCIe (1 x Gen 5, 2 x Gen 4), 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-588
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and two PCIe x4 (Gen 4) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
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Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
Air Core Test Lab Reactors
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Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
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Product
18.5" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-318SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
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Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Product
Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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Product
Intel Core Series - Medium Branch
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Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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Product
Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Product
3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
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Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
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ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Highly Scalable Gaming Platform Based on 10th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD
ADi-SA3X-CL
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ADLINK‘s ADi-SA3X-CL all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with 10th Generation Intel® Core™ processors, the ADi-SA3X-CL provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® UHD Graphics 630/610 supporting up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA3X-CL fully satisfies the needs of your gaming application. The ADi-SA3X-CL is a true application-ready gaming platform providing OEMs with a highly flexible and reliable all-in-one system that offers unparalleled portfolio of services that help developers save time and pass compliance. The platform is designed to meet the GLI- 11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements.
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
