Common Core
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Ka-Band Silicon 5G Quad Core IC
AWMF-0108
The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-M47H
ADLINK IMB-M47H Industrial ATX Motherboard offers high computing performance with diverse I/O for industrial automation applications. It is the suitable choice for applications requiring real-time processing and high-level graphic capability.
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3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Quad Core KeyStone™ DSP + UltraScale™ FPGA Module
SMT6657-KU35
Sundance Multiprocessor Technology Ltd.
The SMT6657 DSP+FPGA module is a reliable and flexible platform for digital signal processing applications requiring high-performance integer and floating-point computation.It is applicable to both symmetric multiprocessing applications in which the computational load is shared by the two DSPs and asymmetric applications where one of the DSPs is responsible for hard real-time processing and the other acts as a supervisor, handling all non-deterministic communication and optionally running under control of an operating system.
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LV Iron Core Shunt Reactors
Iron core Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system. Shunt Reactors are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. Shunt Reactors can be directly connected to the power line or to a tertiary winding of a three-winding power or distribution transformer.
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Mini-ITX Embedded Board with 8th/9th Gen Intel® Core™ Desktop Processor
AmITX-CF-G
Targeted at gaming customers and system integrators, AmITX-CF-G is a Mini-ITX board specially designed for Gaming. AmITX-CF-G features GLI compliance, easy and flexible configuration, security enhancements, and system resilience. The values of AmITX-CF-G include amplified visual impact, guaranteed system integrity, secure transactions with fast TTM and low TCO, and maximized system uptime. AmITX-CF-G can satisfy application function requirements and meet GLI certification which cannot be offered by other conventional Mini-ITX boards.
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PXI/PXIe RF Multiplexer, Dual 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
42-876A-102
The 40-876A-102 (PXI) and 42-876A-102 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 2 banks in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module has low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Core Flow
Quizix Precision Pumps and Formation Response Testers (FRT’s) are the industry standard for core flow studies by operators, service organizations and research laboratories.
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X-Band Silicon Radar Quad Core IC
AWS-0104
The AWS-0104 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, 21dB gain in receive mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
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Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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ARINC 818-2 IP Core
iWave’s ARINC IP core is ARINC 818–2 compliant offering point-to-point, high-speed, low latency video transmission. This IP core can be implemented on any transceiver-based FPGA device. It can be used for both transmit and receive applications. This core supports configurable ADVB video formats and uses a simple streaming interface to interface with video & image processing IP cores supported by FPGA vendors.
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NXP I.MX8M Plus Quad Core Processor Based IIoT Gateway Platform
MXA-200
MXA-200 is an i.MX8M Plus based high-performance IoT gateway, which has an open platform design with Quad Core processor, two RS-232/422/485 isolated serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 port and operating temperature range of -20~70°C. It offers two M.2 slots for integrating Wi-Fi/4G/5G modules. MXA-200 enables system integrators to develop applications precisely for renewable energy, EV charger, smart city and factories which require massive data collection, cloud based application and video related monitoring solutions.
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Common Metallic Pendulum Impact Testing Machine
JB-(C/D)
Jinan Testing Equipment IE Corporation
KB- (C/D) common type metallic pendulum impact testing system is the basic model for impact tester. The metallic pendulum impact tester is used to determine the impact resistance of metal materials under dynamic load and capable of doing a large number of impact tests continuously. The display method for the models is different, respectively there are analog dial display, touch screen digital display and computer display. For the later two models, it can display the impact power, impact toughness, and pendulum rotation angle. All the testing reports can be printed out. The metallic pendulum impact testing system is the essential quality control equipment for metal material manufacturers and QC departments, as well as the necessary instrument of research institutes for new material research.
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Air Core Motor Starting Reactors
Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
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Detection of PtG and PtP Faults on Multi and Single Core Cables
CableTroll 2350
CableTroll 2350 is an indicator for detection of PtG and PtP faults on multi and single core cables. The unit uses standard type current transformers. (40:1, 60:1 or 3x500:1)
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Air Core Electric Arc Furnace Reactors
Arc Furnace Reactors are serially connected reactors that are installed in the supply systems of arc furnace transformers to stabilize arc and limit the unstable arc furnace current and voltage drop which optimize their melting process. These buffer reactors are connected in series to the primary side of the furnace transformer. Typically these reactors are tapped coils and manufactured as per customer'stap requirements.
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COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Industrial All-In-One Touch Panel PC Based On 7th Gen. Intel® Core™ Processor
STC2-KL Series
- Intel® Core™ i3-7100U/i5-7300U/i7-7600U- 10.1"/15.6”/21.5” 16:9 LCD with LED backlight up to 50,000 hours- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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6U CompactPCI 4th Generation Intel® Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3396
Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.
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Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
