Common Core
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Product
Intel® Core™ Panel Controller
AMAX-PT800 V2
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Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Modular Computing Box designed with 13th Gen. Intel® Core™ i5-1335UE deca-core/ i7-1365URE deca-core processor
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Product
Functional Testing for Evolved Packet Core (ePC/VePC)
PacketCraft
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is a software-only functional tester for ePC and VePC networks. It is installed on a customer laptop or desktop, or on a virtual PC in the cloud.
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Product
Split Core Hall Effect DC Current Sensor
CYHCT-C2TC
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ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used formeasurement of DC current etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
Intel® Core™ Ultra 3 Series Processor
AIMB-234
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Intel® Core™ Ultra ProcessorsSupports Intel® ARC™ GPU with up to 12Xe, enabling four independent 4K displaysSupports up to 128GB dual-channel DDR5-7200MT/s using CSODIMM modulesBuilt-in NPU5 delivering 50 TOPS for dedicated AI accelerationOffers full support for embedded software APIs and Advantech’s WISE-PaaS/DeviceOn platformProvides extensive I/O expandability—2.5GbE, high-speed PCIe x8 Gen5, USB4 and USB3.2 Gen2 ports, plus SATA 3.0
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Product
15" Fanless Panel PC With Intel® Celeron Quad Core J1900 Processor
PPC-3150-RJ9
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15" TFT XGA LED Panel with resistive touchscreenEmbedded Intel Celeron processor, quad core J1900 2.0GHz onboardSystem memory up to 8GB DDR3L 1333 SDRAMSupports one internal SATA 2.5" HDDSupports one Mini PCIe socket, two Gigabit EthernetFanless and compact size with low power consumputionSupports five RS-232 and one RS-232/422/485, besides six RS-232 and two RS-422/485 are optional by requestSupports one mSATA socket
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3086
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ntel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)12~24V DC input power rangeSupport Advantech I Door module
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
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Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
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MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
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The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-278
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 eDPRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 3 SATA(RAID 0,1,5)TPM2.0 supportWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
7th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-KL Series
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- 7th Gen. Intel® Core™ Proc- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
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The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
Micro Computer, Intel® Core
AIMC-3202
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Micro Computer, Intel® Core™ i7/i5/i3 CPU, H110, 2 Expansions, 250W 80Plus PSU. 1 x PCIe x16 and 1 x PCIe x4(1 x PCI for AIMC-3202-01) expansion slots. Compact design with front-accessible I/O.
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Micro-ATX Motherboard 12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-508
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Intel® Core™ 14/13/12th gen processors with H610E chipsetUp to 64GB DDR4 UDIMMs for data transferPCIe x16 slot Gen4, PCIe x4 slot Gen3, PCI slotNumerous expansion: 8 USB 3.2 ports, 6 USB 2.0 ports, and 10 COM
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
15.6" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
13th Gen. Intel® Core I7/ I5/ I3/ U300E P/U-Series 3.5" SBC
MIO-5377R
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13th Gen. Intel® Core™ Processor up to 14 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB, IBECC support by SKU4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2x LAN, 8x USB (incl. 1x USB4), 4x UART, 2x CANBus, 3x I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports Windows 10/11 LTSC & Ubuntu 22.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic Suite
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
Split Core Hall Effect DC Current Sensor
CYHCT-C2TV
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ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used for measurement of DCcurrent etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Product
COMMON RAIL Electronic Diesel Injection Analyzer
EDIA-PRO
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The EDIA-PRO is an enhanced version of the proven EDIA-5 analyzer. To meet expectations of our customers we created a system for automatic evaluation of injection system parameters based on measured waveforms. This makes the diagnosis easier and faster. Additional possibility of fast evaluation of cylinder compression and ability to check starting performance along with control valve measurement mode are perfect complement to diagnostic capabilities of EDIA device.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
AC/DC Split Core Current Sensor CT1000S
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This AC/DC split core current sensor is designed for measuring large DC and AC currents in applications such as electric vehicles, renewable energy systems, inverters, and motors. It facilitates high-current measurements by clamping around existing current connections. With its voltage output, this sensor is compatible with power analyzers (WT series and PX8000) and waveform measurement instruments (ScopeCorders and DLM series), making it a versatile tool for various high-current measurements.
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Product
Mini-ITX M/B Support 12th/13th Gen Intel® Core™ Processors, H610E, 3 X LAN For PPC-600
PPC-MB-620
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Supports Intel® 12/13th Gen Core™ i processor (LGA1700) with Intel Q670E/ H610E chipsetTwo 262-pin SO-DIMM up to 64GB DDR5 4800 MHz SDRAMSupports triple display of DP/HDMI/LVDSSupports PCIe x16 (Gen 5), 1 x M.2 M key & 1 M.2 E key, 6 USB 3.2Supports 2 x SATA 3.0 (Raid 0, 1) (only for PCH Q670E)Supports TPM 2.0Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
