Common Core
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3U I7 Core 2.1 GHz CPCI Controller
GX7936
The GX7936 is a single-slot embedded cPCI 3U controller for use with Marvin Test’s GX7300 PXI chassis. The GX7936 features a 2.1 GHz i7 Quad Core processor. When combined with the embedded storage peripherals of the GX7300 Series chassis, it is the ideal solution for an integrated, high performance PXI chassis / controller configuration.
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Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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PXI/PXIe RF Multiplexer, Dual 4-Channel, Terminated Common, 3GHz, 50Ω, SMB
40-876A-002
The 40-876A-002 (PXI) and 42-876A-002 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 2 banks in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module has low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost. Each MUX has been carefully designed to ensure excellent and repeatable RF characteristics to frequencies of 3GHz with each path having a nominally equal insertion loss.
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Sandwich Core Shear and Rigid Cellular Plastic Shear Testing
Model 3421
Jinan Testing Equipment IE Corporation
For measuring shear properties of sandwich cores to ASTM C273. Simple clip-on design attaches in seconds and provides repeatable test results.
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Bench-top 12 Cores Or 24 Chanels MPO/MTP Insertion Loss & Return Loss Tester
Anfkom International Co.,Limited
This test station do the auto-testing on 12 core(24 core) for insertion loss and return loss, highly efficient multi-core fiber insertion and return loss measurement and make high precision on the measurement result with OTDR mandrel free technical adopting.
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Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43
The ADLINK IMB-M43 is industry's first 6th/7th Gen Intel Core i7/i5/i3 Processor (formerly codenamed Skylake/Kabylake) based industrial ATX motherboard in the LGA1151 package with Intel Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots.
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Pre-Configured Core Test Sets
An In-Phase Core Test Sets provide you with a solid foundation and hardware framework to build your test set. Our pre-engineered Core Test Sets provide a completely integrated test set
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3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
785270-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Iron Core Loss Tester
Chongqing TOP Oil Purifier Co., LTD
Iron Core Loss Tester by Chongqing TOP
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COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Renesas RA Family Of 32-bit MCUs With Arm® Cortex®-M Core
The flexible Renesas Advanced (RA) 32-bit MCUs are industry leading 32-bit MCUs with the Arm® Cortex®-M33, -M23 and -M4 processor cores and PSA certification. RA delivers key advantages compared to competitive Arm Cortex-M MCUs by providing stronger embedded security, superior CoreMark® performance, and ultra-low power operation. PSA certification provides customers the confidence and assurance to quickly deploy secure IoT endpoint and edge devices, and smart factory equipment for Industry 4.0.
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PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Industrial Mini-ITX Motherboard With 14/13/12th Gen Intel® Core™ I9/i7/i5/i3 Processors
AmITX-RL-I
- 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 processors and Q670 chipset, up to 65W- Dual-channel DDR5 4800 MHz memory up to 64 GB- Quad. independent display: HDMI 2.0b, HDMI 1.4b, DP 1.4a, LVDS or eDP- Dual GbE ports: 1x 1GbE, 1x 2.5GbE- Expansion slots: 1x PCIe x16, 4x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 2x M.2 M-key- Support ATX (24+4 pin) or 12V DC-in power input
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CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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Thermal Imaging Core
JOHO336CM_A00
Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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Core Alignment Fiber Fusion Splicer
SH-FS170H
Shenzhen Sharingtek Communication Co., LTD
●It adopts German technology with core alignment system and independent property rights.●The equipment takes advanced PAS technology not only can be used to FTTX also meet the requirements of trunk line with good properties of mini size four motor drive light weight fast speed.Features●Hardness - The body is made from titanium alloy and it has rubber protection function quakeproof waterproof dustproof .●Fast - 7s fast splicing 15s fast heating support continuous heating average efficiency improve 2-3times.●Long lifetime - 200 fiber splicing no memory effect lithium batteries the fiber cleaver has 24 blade longer lifetime.
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AC/DC Split Core Current Sensor CT1000S
This AC/DC split core current sensor is designed for measuring large DC and AC currents in applications such as electric vehicles, renewable energy systems, inverters, and motors. It facilitates high-current measurements by clamping around existing current connections. With its voltage output, this sensor is compatible with power analyzers (WT series and PX8000) and waveform measurement instruments (ScopeCorders and DLM series), making it a versatile tool for various high-current measurements.
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FRAMOS SLVS-EC RX IP CORE
Sony’s SLVS-EC interface standard has emerged as the best high speed interface to Sony’s best image sensors, enabling higher throughput, greater signal integrity, and simpler designs. Engineers developing solutions using Xilinx FPGAs and SoCs can take advantage of FRAMOS’s SLVS-EC RX IP Core, Evaluation Board and tested source code examples. Device builders and camera vendors can de-risk the design while reaping the benefits of Sony’s latest high-speed interface.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Air Core Harmonic Filter Reactors
Use of nonlinear loads such as power electronics based equipment and electric furnaces have been on the rise for the last decades. Such loads decrease the power quality of the network that they are connected to. One of the most important parameters for defining the power quality is harmonic distortion.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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11th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-TGL Series
- 11th Gen. Intel® Core™ Processor- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
